Methods for modeling substrate coupling in RF-ICs

Vesa Starck; Markku Åberg

Methods for modeling substrate coupling in RF-ICs

Vesa Starck, Markku Åberg

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Original language	English
Title of host publication	Circuit paradigm in the 21st century
Subtitle of host publication	ECCTD '01: proceedings of the 15th European Conference on Circuit Theory and Design
Editors	Veikko Porra
Place of Publication	Espoo
Publisher	Helsinki University of Technology
Pages	245-248
Volume	3
ISBN (Print)	951-22-5582-0
Publication status	Published - 2001
MoE publication type	A4 Article in a conference publication
Event	15th European Conference on Circuit Theory and Design, ECCTD 2001 - Espoo, Finland Duration: 28 Aug 2001 → 31 Aug 2001 Conference number: 15

Publication series

Series	Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications
Volume	33:a
ISSN	1455-8440

Conference

Conference	15th European Conference on Circuit Theory and Design, ECCTD 2001
Abbreviated title	ECCTD '01
Country/Territory	Finland
City	Espoo
Period	28/08/01 → 31/08/01

Cite this

Starck, Vesa ; Åberg, Markku. / Methods for modeling substrate coupling in RF-ICs. Circuit paradigm in the 21st century: ECCTD '01: proceedings of the 15th European Conference on Circuit Theory and Design. editor / Veikko Porra. Vol. 3 Espoo : Helsinki University of Technology, 2001. pp. 245-248 (Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications, Vol. 33:a).

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title = "Methods for modeling substrate coupling in RF-ICs",

author = "Vesa Starck and Markku {\AA}berg",

year = "2001",

language = "English",

isbn = "951-22-5582-0",

volume = "3",

series = "Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications",

publisher = "Helsinki University of Technology",

pages = "245--248",

editor = "Veikko Porra",

booktitle = "Circuit paradigm in the 21st century",

address = "Finland",

note = "15th European Conference on Circuit Theory and Design, ECCTD 2001, ECCTD '01 ; Conference date: 28-08-2001 Through 31-08-2001",

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Starck, V & Åberg, M 2001, Methods for modeling substrate coupling in RF-ICs. in V Porra (ed.), Circuit paradigm in the 21st century: ECCTD '01: proceedings of the 15th European Conference on Circuit Theory and Design. vol. 3, Helsinki University of Technology, Espoo, Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications, vol. 33:a, pp. 245-248, 15th European Conference on Circuit Theory and Design, ECCTD 2001, Espoo, Finland, 28/08/01.

Methods for modeling substrate coupling in RF-ICs. / Starck, Vesa; Åberg, Markku.
Circuit paradigm in the 21st century: ECCTD '01: proceedings of the 15th European Conference on Circuit Theory and Design. ed. / Veikko Porra. Vol. 3 Espoo: Helsinki University of Technology, 2001. p. 245-248 (Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications, Vol. 33:a).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Methods for modeling substrate coupling in RF-ICs

AU - Starck, Vesa

AU - Åberg, Markku

N1 - Conference code: 15

PY - 2001

Y1 - 2001

M3 - Conference article in proceedings

SN - 951-22-5582-0

VL - 3

T3 - Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications

SP - 245

EP - 248

BT - Circuit paradigm in the 21st century

A2 - Porra, Veikko

PB - Helsinki University of Technology

CY - Espoo

T2 - 15th European Conference on Circuit Theory and Design, ECCTD 2001

Y2 - 28 August 2001 through 31 August 2001

ER -

Starck V, Åberg M. Methods for modeling substrate coupling in RF-ICs. In Porra V, editor, Circuit paradigm in the 21st century: ECCTD '01: proceedings of the 15th European Conference on Circuit Theory and Design. Vol. 3. Espoo: Helsinki University of Technology. 2001. p. 245-248. (Helsinki University of Technology: Electronic Circuit Design Laboratory. Publications, Vol. 33:a).