Micromachining integration platform for sub-terahertz and terahertz systems

    Research output: Contribution to journalArticleScientificpeer-review

    1 Citation (Scopus)

    Abstract

    We demonstrate a sub-terahertz (THz) and THz integration platform based on micromachined waveguides on silicon. The demonstrated components in the frequency range 225–325 GHz include waveguides, filters, waveguide vias, and low-loss transitions between the waveguide and the monolithic integrated circuits. The developed process relies on microelectromechanical systems manufacturing methods and silicon wafer substrates, promising a scalable and cost-efficient system integration method for future sub-THz and THz communication and sensing applications. Low-temperature Au/In thermo-compression and Au–Au laser bonding processes are parts of the integration platform enabling integration of millimeter-wave monolithic integrated circuits.

    Original languageEnglish
    Pages (from-to)651-659
    Number of pages9
    JournalInternational Journal of Microwave and Wireless Technologies
    Volume10
    Issue number56
    DOIs
    Publication statusPublished - 2018
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Micromachining
    Monolithic integrated circuits
    Waveguides
    Waveguide filters
    Silicon wafers
    Millimeter waves
    MEMS
    Silicon
    Lasers
    Communication
    Substrates
    Costs
    Temperature

    Keywords

    • Hybrid and multi-chip modules
    • micromachining
    • Si-based devices and IC technologies

    Cite this

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    title = "Micromachining integration platform for sub-terahertz and terahertz systems",
    abstract = "We demonstrate a sub-terahertz (THz) and THz integration platform based on micromachined waveguides on silicon. The demonstrated components in the frequency range 225–325 GHz include waveguides, filters, waveguide vias, and low-loss transitions between the waveguide and the monolithic integrated circuits. The developed process relies on microelectromechanical systems manufacturing methods and silicon wafer substrates, promising a scalable and cost-efficient system integration method for future sub-THz and THz communication and sensing applications. Low-temperature Au/In thermo-compression and Au–Au laser bonding processes are parts of the integration platform enabling integration of millimeter-wave monolithic integrated circuits.",
    keywords = "Hybrid and multi-chip modules, micromachining, Si-based devices and IC technologies",
    author = "Vladimir Ermolov and Antti Lamminen and Jaakko Saarilahti and Ben W{\"a}lchli and Mikko Kantanen and Pekka Pursula",
    year = "2018",
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    language = "English",
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    T1 - Micromachining integration platform for sub-terahertz and terahertz systems

    AU - Ermolov, Vladimir

    AU - Lamminen, Antti

    AU - Saarilahti, Jaakko

    AU - Wälchli, Ben

    AU - Kantanen, Mikko

    AU - Pursula, Pekka

    PY - 2018

    Y1 - 2018

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    AB - We demonstrate a sub-terahertz (THz) and THz integration platform based on micromachined waveguides on silicon. The demonstrated components in the frequency range 225–325 GHz include waveguides, filters, waveguide vias, and low-loss transitions between the waveguide and the monolithic integrated circuits. The developed process relies on microelectromechanical systems manufacturing methods and silicon wafer substrates, promising a scalable and cost-efficient system integration method for future sub-THz and THz communication and sensing applications. Low-temperature Au/In thermo-compression and Au–Au laser bonding processes are parts of the integration platform enabling integration of millimeter-wave monolithic integrated circuits.

    KW - Hybrid and multi-chip modules

    KW - micromachining

    KW - Si-based devices and IC technologies

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