Micromachining integration platform for sub-terahertz and terahertz systems

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    Abstract

    We demonstrate a sub-terahertz (THz) and THz integration platform based on micromachined waveguides on silicon. The demonstrated components in the frequency range 225–325 GHz include waveguides, filters, waveguide vias, and low-loss transitions between the waveguide and the monolithic integrated circuits. The developed process relies on microelectromechanical systems manufacturing methods and silicon wafer substrates, promising a scalable and cost-efficient system integration method for future sub-THz and THz communication and sensing applications. Low-temperature Au/In thermo-compression and Au–Au laser bonding processes are parts of the integration platform enabling integration of millimeter-wave monolithic integrated circuits.

    Original languageEnglish
    Pages (from-to)651-659
    Number of pages9
    JournalInternational Journal of Microwave and Wireless Technologies
    Volume10
    Issue number56
    DOIs
    Publication statusPublished - 1 Jun 2018
    MoE publication typeA1 Journal article-refereed

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    Keywords

    • Hybrid and multi-chip modules
    • micromachining
    • Si-based devices and IC technologies
    • OtaNano

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