Micromechanical bulk acoustic wave resonator

Tomi Mattila (Corresponding author), Aarne Oja, Heikki Seppä, Olli Jaakkola, Jyrki Kiihamäki, Hannu Kattelus, Mika Koskenvuori, Pekka Rantakari, Ilkka Tittonen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

21 Citations (Scopus)


We describe the use of bulk acoustic mode in micromechanical silicon resonators operating at radio frequencies. Based on measured data from the fabricated resonator (f/sub r//spl sim/14 MHz, Q>100 000) we analyze the characteristic impedance and signal levels in such microdevices and compare the values with conventional quartz crystals. We find that the high impedance level of microresonators can be met with integration of the readout electronics and that silicon can accommodate significantly larger vibration energy densities than quartz. Based on the results, we anticipate a wide application range for the micromechanical bulk acoustic wave structures in future wireless communication devices and microsensors.
Original languageEnglish
Title of host publication2002 IEEE Ultrasonics Symposium Proceedings
PublisherIEEE Institute of Electrical and Electronic Engineers
ISBN (Print)0-7803-7582-3
Publication statusPublished - 2002
MoE publication typeA4 Article in a conference publication
Event2002 IEEE International Ultrasonics Symposium and Short Courses - Munich, Germany
Duration: 8 Oct 200211 Oct 2002

Publication series

SeriesProceedings - IEEE Ultrasonics Symposium


Conference2002 IEEE International Ultrasonics Symposium and Short Courses

Fingerprint Dive into the research topics of 'Micromechanical bulk acoustic wave resonator'. Together they form a unique fingerprint.

Cite this