Micromechanical bulk acoustic wave resonator

Tomi Mattila; Aarne Oja; Heikki Seppä; Olli Jaakkola; Jyrki Kiihamäki; Hannu Kattelus; Mika Koskenvuori; Pekka Rantakari; Ilkka Tittonen

doi:10.1109/ULTSYM.2002.1193551

Micromechanical bulk acoustic wave resonator

Tomi Mattila (Corresponding author), Aarne Oja, Heikki Seppä, Olli Jaakkola, Jyrki Kiihamäki, Hannu Kattelus, Mika Koskenvuori, Pekka Rantakari, Ilkka Tittonen

Helsinki University of Technology

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

23 Citations (Scopus)

Abstract

We describe the use of bulk acoustic mode in micromechanical silicon resonators operating at radio frequencies. Based on measured data from the fabricated resonator (f/sub r//spl sim/14 MHz, Q>100 000) we analyze the characteristic impedance and signal levels in such microdevices and compare the values with conventional quartz crystals. We find that the high impedance level of microresonators can be met with integration of the readout electronics and that silicon can accommodate significantly larger vibration energy densities than quartz. Based on the results, we anticipate a wide application range for the micromechanical bulk acoustic wave structures in future wireless communication devices and microsensors.

Original language	English
Title of host publication	2002 IEEE Ultrasonics Symposium Proceedings
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	945-948
ISBN (Print)	0-7803-7582-3
DOIs	https://doi.org/10.1109/ULTSYM.2002.1193551
Publication status	Published - 2002
MoE publication type	A4 Article in a conference publication
Event	2002 IEEE International Ultrasonics Symposium and Short Courses - Munich, Germany Duration: 8 Oct 2002 → 11 Oct 2002

Publication series

Series	Proceedings - IEEE Ultrasonics Symposium
Volume	2002
ISSN	1051-0117

Conference

Conference	2002 IEEE International Ultrasonics Symposium and Short Courses
Country/Territory	Germany
City	Munich
Period	8/10/02 → 11/10/02

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10.1109/ULTSYM.2002.1193551

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Mattila, T., Oja, A., Seppä, H., Jaakkola, O., Kiihamäki, J., Kattelus, H., Koskenvuori, M., Rantakari, P., & Tittonen, I. (2002). Micromechanical bulk acoustic wave resonator. In 2002 IEEE Ultrasonics Symposium Proceedings (pp. 945-948). IEEE Institute of Electrical and Electronic Engineers. Proceedings - IEEE Ultrasonics Symposium Vol. 2002 https://doi.org/10.1109/ULTSYM.2002.1193551

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title = "Micromechanical bulk acoustic wave resonator",

abstract = "We describe the use of bulk acoustic mode in micromechanical silicon resonators operating at radio frequencies. Based on measured data from the fabricated resonator (f/sub r//spl sim/14 MHz, Q>100 000) we analyze the characteristic impedance and signal levels in such microdevices and compare the values with conventional quartz crystals. We find that the high impedance level of microresonators can be met with integration of the readout electronics and that silicon can accommodate significantly larger vibration energy densities than quartz. Based on the results, we anticipate a wide application range for the micromechanical bulk acoustic wave structures in future wireless communication devices and microsensors.",

author = "Tomi Mattila and Aarne Oja and Heikki Sepp{\"a} and Olli Jaakkola and Jyrki Kiiham{\"a}ki and Hannu Kattelus and Mika Koskenvuori and Pekka Rantakari and Ilkka Tittonen",

year = "2002",

doi = "10.1109/ULTSYM.2002.1193551",

language = "English",

isbn = "0-7803-7582-3",

series = "Proceedings - IEEE Ultrasonics Symposium",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

pages = "945--948",

booktitle = "2002 IEEE Ultrasonics Symposium Proceedings",

address = "United States",

note = "2002 IEEE International Ultrasonics Symposium and Short Courses ; Conference date: 08-10-2002 Through 11-10-2002",

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Mattila, T, Oja, A, Seppä, H, Jaakkola, O, Kiihamäki, J, Kattelus, H, Koskenvuori, M, Rantakari, P & Tittonen, I 2002, Micromechanical bulk acoustic wave resonator. in 2002 IEEE Ultrasonics Symposium Proceedings. IEEE Institute of Electrical and Electronic Engineers, Proceedings - IEEE Ultrasonics Symposium, vol. 2002, pp. 945-948, 2002 IEEE International Ultrasonics Symposium and Short Courses, Munich, Germany, 8/10/02. https://doi.org/10.1109/ULTSYM.2002.1193551

Micromechanical bulk acoustic wave resonator. / Mattila, Tomi (Corresponding author); Oja, Aarne; Seppä, Heikki et al.

2002 IEEE Ultrasonics Symposium Proceedings. IEEE Institute of Electrical and Electronic Engineers, 2002. p. 945-948 (Proceedings - IEEE Ultrasonics Symposium, Vol. 2002).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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T1 - Micromechanical bulk acoustic wave resonator

AU - Mattila, Tomi

AU - Oja, Aarne

AU - Seppä, Heikki

AU - Jaakkola, Olli

AU - Kiihamäki, Jyrki

AU - Kattelus, Hannu

AU - Koskenvuori, Mika

AU - Rantakari, Pekka

AU - Tittonen, Ilkka

PY - 2002

Y1 - 2002

N2 - We describe the use of bulk acoustic mode in micromechanical silicon resonators operating at radio frequencies. Based on measured data from the fabricated resonator (f/sub r//spl sim/14 MHz, Q>100 000) we analyze the characteristic impedance and signal levels in such microdevices and compare the values with conventional quartz crystals. We find that the high impedance level of microresonators can be met with integration of the readout electronics and that silicon can accommodate significantly larger vibration energy densities than quartz. Based on the results, we anticipate a wide application range for the micromechanical bulk acoustic wave structures in future wireless communication devices and microsensors.

AB - We describe the use of bulk acoustic mode in micromechanical silicon resonators operating at radio frequencies. Based on measured data from the fabricated resonator (f/sub r//spl sim/14 MHz, Q>100 000) we analyze the characteristic impedance and signal levels in such microdevices and compare the values with conventional quartz crystals. We find that the high impedance level of microresonators can be met with integration of the readout electronics and that silicon can accommodate significantly larger vibration energy densities than quartz. Based on the results, we anticipate a wide application range for the micromechanical bulk acoustic wave structures in future wireless communication devices and microsensors.

U2 - 10.1109/ULTSYM.2002.1193551

DO - 10.1109/ULTSYM.2002.1193551

M3 - Conference article in proceedings

SN - 0-7803-7582-3

T3 - Proceedings - IEEE Ultrasonics Symposium

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BT - 2002 IEEE Ultrasonics Symposium Proceedings

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 2002 IEEE International Ultrasonics Symposium and Short Courses

Y2 - 8 October 2002 through 11 October 2002

ER -

Micromechanical bulk acoustic wave resonator

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