Micromechanical bulk acoustic wave resonator

Tomi Mattila (Corresponding author), Aarne Oja, Heikki Seppä, Olli Jaakkola, Jyrki Kiihamäki, Hannu Kattelus, Mika Koskenvuori, Pekka Rantakari, Ilkka Tittonen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

21 Citations (Scopus)

Abstract

We describe the use of bulk acoustic mode in micromechanical silicon resonators operating at radio frequencies. Based on measured data from the fabricated resonator (f/sub r//spl sim/14 MHz, Q>100 000) we analyze the characteristic impedance and signal levels in such microdevices and compare the values with conventional quartz crystals. We find that the high impedance level of microresonators can be met with integration of the readout electronics and that silicon can accommodate significantly larger vibration energy densities than quartz. Based on the results, we anticipate a wide application range for the micromechanical bulk acoustic wave structures in future wireless communication devices and microsensors.
Original languageEnglish
Title of host publication2002 IEEE Ultrasonics Symposium Proceedings
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages945-948
ISBN (Print)0-7803-7582-3
DOIs
Publication statusPublished - 2002
MoE publication typeA4 Article in a conference publication
Event2002 IEEE International Ultrasonics Symposium and Short Courses - Munich, Germany
Duration: 8 Oct 200211 Oct 2002

Publication series

SeriesProceedings - IEEE Ultrasonics Symposium
Volume2002
ISSN1051-0117

Conference

Conference2002 IEEE International Ultrasonics Symposium and Short Courses
CountryGermany
CityMunich
Period8/10/0211/10/02

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  • Cite this

    Mattila, T., Oja, A., Seppä, H., Jaakkola, O., Kiihamäki, J., Kattelus, H., Koskenvuori, M., Rantakari, P., & Tittonen, I. (2002). Micromechanical bulk acoustic wave resonator. In 2002 IEEE Ultrasonics Symposium Proceedings (pp. 945-948). IEEE Institute of Electrical and Electronic Engineers. Proceedings - IEEE Ultrasonics Symposium, Vol.. 2002 https://doi.org/10.1109/ULTSYM.2002.1193551