Micromechanical silicon precision scale

Aarne Oja, Teuvo Sillanpää, Heikki Seppä, Jyrki Kiihamäki, Pekka Seppälä, Jani Karttunen, Kari Riski

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    3 Citations (Scopus)
    Original languageEnglish
    Title of host publicationDesign, Test, Integration and Packaging of MEMS/MOEMS
    PublisherInternational Society for Optics and Photonics SPIE
    Pages498-505
    ISBN (Print)0-8194-3645-3
    DOIs
    Publication statusPublished - 2000
    MoE publication typeA4 Article in a conference publication
    EventSymposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000 - Paris, France
    Duration: 9 May 200011 May 2000

    Publication series

    SeriesProceedings of SPIE
    Volume4019
    ISSN0277-786X

    Conference

    ConferenceSymposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000
    CountryFrance
    CityParis
    Period9/05/0011/05/00

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