Micromechanical silicon precision scale

Aarne Oja; Teuvo Sillanpää; Heikki Seppä; Jyrki Kiihamäki; Pekka Seppälä; Jani Karttunen; Kari Riski

doi:10.1117/12.382318

Micromechanical silicon precision scale

Aarne Oja, Teuvo Sillanpää, Heikki Seppä, Jyrki Kiihamäki, Pekka Seppälä, Jani Karttunen, Kari Riski

Centre for Metrology and Accreditation Finland (MIKES)

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	Design, Test, Integration and Packaging of MEMS/MOEMS
Publisher	International Society for Optics and Photonics SPIE
Pages	498-505
ISBN (Print)	0-8194-3645-3
DOIs	https://doi.org/10.1117/12.382318
Publication status	Published - 2000
MoE publication type	A4 Article in a conference publication
Event	Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000 - Paris, France Duration: 9 May 2000 → 11 May 2000

Publication series

Series	Proceedings of SPIE
Volume	4019
ISSN	0277-786X

Conference

Conference	Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000
Country/Territory	France
City	Paris
Period	9/05/00 → 11/05/00

Access to Document

10.1117/12.382318

Cite this

@inproceedings{5e2fbde2f29f4681bd0f7b13fa05bf6a,

title = "Micromechanical silicon precision scale",

author = "Aarne Oja and Teuvo Sillanp{\"a}{\"a} and Heikki Sepp{\"a} and Jyrki Kiiham{\"a}ki and Pekka Sepp{\"a}l{\"a} and Jani Karttunen and Kari Riski",

year = "2000",

doi = "10.1117/12.382318",

language = "English",

isbn = "0-8194-3645-3",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "498--505",

booktitle = "Design, Test, Integration and Packaging of MEMS/MOEMS",

address = "United States",

note = "Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000 ; Conference date: 09-05-2000 Through 11-05-2000",

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Oja, A, Sillanpää, T, Seppä, H, Kiihamäki, J, Seppälä, P, Karttunen, J & Riski, K 2000, Micromechanical silicon precision scale. in Design, Test, Integration and Packaging of MEMS/MOEMS. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 4019, pp. 498-505, Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000, Paris, France, 9/05/00. https://doi.org/10.1117/12.382318

Micromechanical silicon precision scale. / Oja, Aarne; Sillanpää, Teuvo; Seppä, Heikki et al.
Design, Test, Integration and Packaging of MEMS/MOEMS. International Society for Optics and Photonics SPIE, 2000. p. 498-505 (Proceedings of SPIE, Vol. 4019).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Micromechanical silicon precision scale

AU - Oja, Aarne

AU - Sillanpää, Teuvo

AU - Seppä, Heikki

AU - Kiihamäki, Jyrki

AU - Seppälä, Pekka

AU - Karttunen, Jani

AU - Riski, Kari

PY - 2000

Y1 - 2000

U2 - 10.1117/12.382318

DO - 10.1117/12.382318

M3 - Conference article in proceedings

SN - 0-8194-3645-3

T3 - Proceedings of SPIE

SP - 498

EP - 505

BT - Design, Test, Integration and Packaging of MEMS/MOEMS

PB - International Society for Optics and Photonics SPIE

T2 - Symposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000

Y2 - 9 May 2000 through 11 May 2000

ER -