Micromechanical silicon precision scale

Aarne Oja, Teuvo Sillanpää, Heikki Seppä, Jyrki Kiihamäki, Pekka Seppälä, Jani Karttunen, Kari Riski

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

3 Citations (Scopus)
Original languageEnglish
Title of host publicationDesign, Test, Integration and Packaging of MEMS/MOEMS
PublisherInternational Society for Optics and Photonics SPIE
Pages498-505
ISBN (Print)0-8194-3645-3
DOIs
Publication statusPublished - 2000
MoE publication typeA4 Article in a conference publication
EventSymposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000 - Paris, France
Duration: 9 May 200011 May 2000

Publication series

SeriesProceedings of SPIE
Volume4019
ISSN0277-786X

Conference

ConferenceSymposium on Design, Test, Integration, and Packaging of MEMS/MOEMS, DTIP 2000
CountryFrance
CityParis
Period9/05/0011/05/00

Cite this