Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon

Lauri Kilpi (Corresponding Author), Oili M.E. Ylivaara, Antti Vaajoki, Jari Malm, Sakari Sintonen, Marko Tuominen, Riikka L. Puurunen, Helena Ronkainen

Research output: Contribution to journalArticleScientificpeer-review

13 Citations (Scopus)

Abstract

The scratch test method is widely used for adhesion evaluation of thin films and coatings. Usual critical load criteria designed for scratch testing of coatings were not applicable to thin atomic layer deposition (ALD) films on silicon wafers. Thus, the bases for critical load evaluation were established and the critical loads suitable for ALD coating adhesion evaluation on silicon wafers were determined in this paper as LCSi1, LCSi2, LCALD1, and LCALD2, representing the failure points of the silicon substrate and the coating delamination points of the ALD coating. The adhesion performance of the ALD Al2O3, TiO2, TiN, and TaCN+Ru coatings with a thickness range between 20 and 600 nm and deposition temperature between 30 and 410°C on silicon wafers was investigated. In addition, the impact of the annealing process after deposition on adhesion was evaluated for selected cases. The tests carried out using scratch and Scotch tape test showed that the coating deposition and annealing temperature, thickness of the coating, and surface pretreatments of the Si wafer had an impact on the adhesion performance of the ALD coatings on the silicon wafer. There was also an improved load carrying capacity due to Al2O3, the magnitude of which depended on the coating thickness and the deposition temperature. The tape tests were carried out for selected coatings as a comparison. The results show that the scratch test is a useful and applicable tool for adhesion evaluation of ALD coatings, even when carried out for thin (20 nm thick) coatings.
Original languageEnglish
Article number01A124
JournalJournal of Vacuum Science and Technology A: Vacuum, Surfaces and Films
Volume34
Issue number1
DOIs
Publication statusPublished - 2016
MoE publication typeA1 Journal article-refereed

Fingerprint

Silicon
adhesion
Adhesion
coatings
Thin films
Coatings
evaluation
Testing
Atomic layer deposition
silicon
thin films
atomic layer epitaxy
Silicon wafers
wafers
Tapes
tapes
Annealing
load carrying capacity
annealing
Load limits

Cite this

@article{ab67e05d956c4f5998ca950e3c0ba5b4,
title = "Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon",
abstract = "The scratch test method is widely used for adhesion evaluation of thin films and coatings. Usual critical load criteria designed for scratch testing of coatings were not applicable to thin atomic layer deposition (ALD) films on silicon wafers. Thus, the bases for critical load evaluation were established and the critical loads suitable for ALD coating adhesion evaluation on silicon wafers were determined in this paper as LCSi1, LCSi2, LCALD1, and LCALD2, representing the failure points of the silicon substrate and the coating delamination points of the ALD coating. The adhesion performance of the ALD Al2O3, TiO2, TiN, and TaCN+Ru coatings with a thickness range between 20 and 600 nm and deposition temperature between 30 and 410°C on silicon wafers was investigated. In addition, the impact of the annealing process after deposition on adhesion was evaluated for selected cases. The tests carried out using scratch and Scotch tape test showed that the coating deposition and annealing temperature, thickness of the coating, and surface pretreatments of the Si wafer had an impact on the adhesion performance of the ALD coatings on the silicon wafer. There was also an improved load carrying capacity due to Al2O3, the magnitude of which depended on the coating thickness and the deposition temperature. The tape tests were carried out for selected coatings as a comparison. The results show that the scratch test is a useful and applicable tool for adhesion evaluation of ALD coatings, even when carried out for thin (20 nm thick) coatings.",
author = "Lauri Kilpi and Ylivaara, {Oili M.E.} and Antti Vaajoki and Jari Malm and Sakari Sintonen and Marko Tuominen and Puurunen, {Riikka L.} and Helena Ronkainen",
year = "2016",
doi = "10.1116/1.4935959",
language = "English",
volume = "34",
journal = "Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films",
issn = "0734-2101",
publisher = "American Vacuum Society AVS",
number = "1",

}

Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon. / Kilpi, Lauri (Corresponding Author); Ylivaara, Oili M.E.; Vaajoki, Antti; Malm, Jari; Sintonen, Sakari; Tuominen, Marko; Puurunen, Riikka L.; Ronkainen, Helena.

In: Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films, Vol. 34, No. 1, 01A124, 2016.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Microscratch testing method for systematic evaluation of the adhesion of atomic layer deposited thin films on silicon

AU - Kilpi, Lauri

AU - Ylivaara, Oili M.E.

AU - Vaajoki, Antti

AU - Malm, Jari

AU - Sintonen, Sakari

AU - Tuominen, Marko

AU - Puurunen, Riikka L.

AU - Ronkainen, Helena

PY - 2016

Y1 - 2016

N2 - The scratch test method is widely used for adhesion evaluation of thin films and coatings. Usual critical load criteria designed for scratch testing of coatings were not applicable to thin atomic layer deposition (ALD) films on silicon wafers. Thus, the bases for critical load evaluation were established and the critical loads suitable for ALD coating adhesion evaluation on silicon wafers were determined in this paper as LCSi1, LCSi2, LCALD1, and LCALD2, representing the failure points of the silicon substrate and the coating delamination points of the ALD coating. The adhesion performance of the ALD Al2O3, TiO2, TiN, and TaCN+Ru coatings with a thickness range between 20 and 600 nm and deposition temperature between 30 and 410°C on silicon wafers was investigated. In addition, the impact of the annealing process after deposition on adhesion was evaluated for selected cases. The tests carried out using scratch and Scotch tape test showed that the coating deposition and annealing temperature, thickness of the coating, and surface pretreatments of the Si wafer had an impact on the adhesion performance of the ALD coatings on the silicon wafer. There was also an improved load carrying capacity due to Al2O3, the magnitude of which depended on the coating thickness and the deposition temperature. The tape tests were carried out for selected coatings as a comparison. The results show that the scratch test is a useful and applicable tool for adhesion evaluation of ALD coatings, even when carried out for thin (20 nm thick) coatings.

AB - The scratch test method is widely used for adhesion evaluation of thin films and coatings. Usual critical load criteria designed for scratch testing of coatings were not applicable to thin atomic layer deposition (ALD) films on silicon wafers. Thus, the bases for critical load evaluation were established and the critical loads suitable for ALD coating adhesion evaluation on silicon wafers were determined in this paper as LCSi1, LCSi2, LCALD1, and LCALD2, representing the failure points of the silicon substrate and the coating delamination points of the ALD coating. The adhesion performance of the ALD Al2O3, TiO2, TiN, and TaCN+Ru coatings with a thickness range between 20 and 600 nm and deposition temperature between 30 and 410°C on silicon wafers was investigated. In addition, the impact of the annealing process after deposition on adhesion was evaluated for selected cases. The tests carried out using scratch and Scotch tape test showed that the coating deposition and annealing temperature, thickness of the coating, and surface pretreatments of the Si wafer had an impact on the adhesion performance of the ALD coatings on the silicon wafer. There was also an improved load carrying capacity due to Al2O3, the magnitude of which depended on the coating thickness and the deposition temperature. The tape tests were carried out for selected coatings as a comparison. The results show that the scratch test is a useful and applicable tool for adhesion evaluation of ALD coatings, even when carried out for thin (20 nm thick) coatings.

U2 - 10.1116/1.4935959

DO - 10.1116/1.4935959

M3 - Article

VL - 34

JO - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

JF - Journal of Vacuum Science and Technology A: Vacuum, Surfaces and Films

SN - 0734-2101

IS - 1

M1 - 01A124

ER -