Abstract
| Original language | English |
|---|---|
| Publication status | Published - 2013 |
| MoE publication type | Not Eligible |
| Event | 2nd Asia-Pacific Conference on Antennas and Propagation, APCAP 2013 - Chiang Mai, Thailand Duration: 5 Aug 2013 → 7 Aug 2013 |
Conference
| Conference | 2nd Asia-Pacific Conference on Antennas and Propagation, APCAP 2013 |
|---|---|
| Abbreviated title | APCAP 2013 |
| Country | Thailand |
| City | Chiang Mai |
| Period | 5/08/13 → 7/08/13 |
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Microstrip parasitic patch array with substrate integrated waveguide feed for 35 GHz applications. / Bunea, A-C.; Neculoiu, D.; Lahti, Markku; Vähä-Heikkilä, Tauno.
2013. Paper presented at 2nd Asia-Pacific Conference on Antennas and Propagation, APCAP 2013, Chiang Mai, Thailand.Research output: Contribution to conference › Conference article › Scientific › peer-review
TY - CONF
T1 - Microstrip parasitic patch array with substrate integrated waveguide feed for 35 GHz applications
AU - Bunea, A-C.
AU - Neculoiu, D.
AU - Lahti, Markku
AU - Vähä-Heikkilä, Tauno
PY - 2013
Y1 - 2013
N2 - A microstrip patch antenna with four parasitic patches for 35 GHz is presented in this paper. The antenna structure is fed by a substrate integrated waveguide (SIW) and opens up the way to 3D integration of large scale arrays for high gain applications. A SIW to grounded coplanar waveguide (GCPW) transition was designed and added to the antenna element for on wafer characterization. A test structure was fabricated in a six tape LTCC process. The measured reflection losses are lower than – 10 dB between 34.94 GHz – 36.2 GHz, while the simulated directivity was about 8.8 dBi at 35 GHz.
AB - A microstrip patch antenna with four parasitic patches for 35 GHz is presented in this paper. The antenna structure is fed by a substrate integrated waveguide (SIW) and opens up the way to 3D integration of large scale arrays for high gain applications. A SIW to grounded coplanar waveguide (GCPW) transition was designed and added to the antenna element for on wafer characterization. A test structure was fabricated in a six tape LTCC process. The measured reflection losses are lower than – 10 dB between 34.94 GHz – 36.2 GHz, while the simulated directivity was about 8.8 dBi at 35 GHz.
M3 - Conference article
ER -