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Microstructural and mechanical characterization of Cu/Sn SLID bonding utilizing Co as contact metallization layer

  • F. Emadi*
  • , V. Vuorinen
  • , Stefan Mertin
  • , K. Widell
  • , M. Paulasto-Kröckel
    • *Corresponding author for this work
    • Aalto University

    Research output: Contribution to journal › Article › Scientific › peer-review

    16   Link opens in a new tab Citations (Scopus)

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