@inproceedings{cd5e16f235e04f82a9392f9bc89f7c5e,
title = "Microsystem integration from RF to millimeter wave applications",
abstract = "Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT{\textquoteright}s demonstrations.",
keywords = "LTCC, millimeter wave, module, RF",
author = "Tauno V{\"a}h{\"a}-Heikkil{\"a} and Markku Lahti",
year = "2015",
doi = "10.1117/12.2180864",
language = "English",
isbn = "978-1-62841-639-8",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
editor = "S{\'a}nchez-Rojas, {Jos{\'e} Luis} and Riccardo Brama",
booktitle = "Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems",
address = "United States",
note = "SPIE Microtechnologies 2015 : Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems, SPIE Microtechnologies 2015 ; Conference date: 04-05-2015 Through 06-05-2015",
}