Microsystem integration from RF to millimeter wave applications

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT’s demonstrations.
Original languageEnglish
Title of host publicationSmart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
PublisherInternational Society for Optics and Photonics SPIE
DOIs
Publication statusPublished - 2015
MoE publication typeA4 Article in a conference publication
EventSPIE Microtechnologies 2015: Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems - Barcelona, Spain
Duration: 4 May 20156 May 2015

Publication series

NameProceedings of SPIE
PublisherSPIE
Volume9517
ISSN (Print)0277-786X

Conference

ConferenceSPIE Microtechnologies 2015
Abbreviated titleSPIE Microtechnologies 2015
CountrySpain
CityBarcelona
Period4/05/156/05/15

Fingerprint

Microsystems
Millimeter waves
Packaging
Microwaves
Consumer products
Radio receivers
Demonstrations

Keywords

  • LTCC
  • millimeter wave
  • module
  • RF

Cite this

Vähä-Heikkilä, T., & Lahti, M. (2015). Microsystem integration from RF to millimeter wave applications. In Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems [95170R] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 9517 https://doi.org/10.1117/12.2180864
Vähä-Heikkilä, T. ; Lahti, M. / Microsystem integration from RF to millimeter wave applications. Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9517).
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abstract = "Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT’s demonstrations.",
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Vähä-Heikkilä, T & Lahti, M 2015, Microsystem integration from RF to millimeter wave applications. in Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems., 95170R, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 9517, SPIE Microtechnologies 2015, Barcelona, Spain, 4/05/15. https://doi.org/10.1117/12.2180864

Microsystem integration from RF to millimeter wave applications. / Vähä-Heikkilä, T.; Lahti, M.

Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems. International Society for Optics and Photonics SPIE, 2015. 95170R (Proceedings of SPIE, Vol. 9517).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Vähä-Heikkilä T, Lahti M. Microsystem integration from RF to millimeter wave applications. In Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems. International Society for Optics and Photonics SPIE. 2015. 95170R. (Proceedings of SPIE, Vol. 9517). https://doi.org/10.1117/12.2180864