Microsystem integration from RF to millimeter wave applications

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    Radio frequency systems have been applied successfully to consumer products. Typically these radios operate up to 6 GHz. During recent years, interest towards microwave (up to 30 GHz) and millimeter wave frequencies (30 ... 300 GHz) has increased significantly. Technologies have been developed to have high performance microwave and millimeter wave components. On the other hand, integration and packaging technologies have not developed as fast while their importance is crucial especially in consumer applications. This presentation focuses to latest trends in wireless microsystem component integration and packaging trends backed up with demonstrators and measured results based on VTT’s demonstrations.
    Original languageEnglish
    Title of host publicationSmart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems
    PublisherInternational Society for Optics and Photonics SPIE
    DOIs
    Publication statusPublished - 2015
    MoE publication typeA4 Article in a conference publication
    EventSPIE Microtechnologies 2015: Smart Sensors, Actuators, and MEMS VII; and Cyber Physical Systems - Barcelona, Spain
    Duration: 4 May 20156 May 2015

    Publication series

    SeriesProceedings of SPIE
    Volume9517
    ISSN0277-786X

    Conference

    ConferenceSPIE Microtechnologies 2015
    Abbreviated titleSPIE Microtechnologies 2015
    Country/TerritorySpain
    CityBarcelona
    Period4/05/156/05/15

    Keywords

    • LTCC
    • millimeter wave
    • module
    • RF

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