Microvia fill process boundary control

Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review

2 Citations (Scopus)

Abstract

This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15%) without endangering product output quality
Original languageEnglish
Pages (from-to)10439-10444
JournalIFAC Proceedings Volumes
Volume47
Issue number3
DOIs
Publication statusPublished - 2014
MoE publication typeA4 Article in a conference publication
EventThe 19th IFAC World Congress, IFAC WC 2014 - Cape Town, South Africa
Duration: 24 Aug 201429 Aug 2014

Fingerprint

Mass transfer
Electrolytes
Copper
Ions

Keywords

  • spatially distributed systems
  • monitoring
  • manufacturing
  • modeling

Cite this

Tenno, R. ; Pohjoranta, Antti. / Microvia fill process boundary control. In: IFAC Proceedings Volumes. 2014 ; Vol. 47, No. 3. pp. 10439-10444.
@article{cfd4064d66ba4e19ac39616788160efb,
title = "Microvia fill process boundary control",
abstract = "This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15{\%}) without endangering product output quality",
keywords = "spatially distributed systems, monitoring, manufacturing, modeling",
author = "R. Tenno and Antti Pohjoranta",
year = "2014",
doi = "10.3182/20140824-6-ZA-1003.00947",
language = "English",
volume = "47",
pages = "10439--10444",
journal = "IFAC-PapersOnLine",
issn = "2405-8971",
publisher = "IFAC Secretariat",
number = "3",

}

Microvia fill process boundary control. / Tenno, R.; Pohjoranta, Antti.

In: IFAC Proceedings Volumes, Vol. 47, No. 3, 2014, p. 10439-10444.

Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review

TY - JOUR

T1 - Microvia fill process boundary control

AU - Tenno, R.

AU - Pohjoranta, Antti

PY - 2014

Y1 - 2014

N2 - This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15%) without endangering product output quality

AB - This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15%) without endangering product output quality

KW - spatially distributed systems

KW - monitoring

KW - manufacturing

KW - modeling

UR - https://www.sciencedirect.com/journal/ifac-proceedings-volumes/vol/47/issue/3

U2 - 10.3182/20140824-6-ZA-1003.00947

DO - 10.3182/20140824-6-ZA-1003.00947

M3 - Article in a proceedings journal

VL - 47

SP - 10439

EP - 10444

JO - IFAC-PapersOnLine

JF - IFAC-PapersOnLine

SN - 2405-8971

IS - 3

ER -