Microvia fill process boundary control

R. Tenno, Antti Pohjoranta

    Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review

    2 Citations (Scopus)

    Abstract

    This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15%) without endangering product output quality
    Original languageEnglish
    Pages (from-to)10439-10444
    JournalIFAC Proceedings Volumes
    Volume47
    Issue number3
    DOIs
    Publication statusPublished - 2014
    MoE publication typeA4 Article in a conference publication
    EventThe 19th IFAC World Congress, IFAC WC 2014 - Cape Town, South Africa
    Duration: 24 Aug 201429 Aug 2014

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    Mass transfer
    Electrolytes
    Copper
    Ions

    Keywords

    • spatially distributed systems
    • monitoring
    • manufacturing
    • modeling

    Cite this

    Tenno, R. ; Pohjoranta, Antti. / Microvia fill process boundary control. In: IFAC Proceedings Volumes. 2014 ; Vol. 47, No. 3. pp. 10439-10444.
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    Microvia fill process boundary control. / Tenno, R.; Pohjoranta, Antti.

    In: IFAC Proceedings Volumes, Vol. 47, No. 3, 2014, p. 10439-10444.

    Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review

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    AB - This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15%) without endangering product output quality

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    KW - monitoring

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