Microvia fill process boundary control

R. Tenno, Antti Pohjoranta

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)

    Abstract

    This paper presents an exponentially stabilizing boundary control for the microvia fill process. The control accounts for the mass balance of the copper ions in the electrolyte and for the surface mass balance of the deposition-blocking additives, both modeled with a diffusion mass transfer model in a shape changing domain. With simulations based on real-world data, it is shown that by applying the control, the microvia fill process can be speeded up (in the example case by ca. 15%) without endangering product output quality
    Original languageEnglish
    Title of host publication19th IFAC World Congress
    EditorsEdward Boje, Xiaohua Xia
    PublisherElsevier
    Pages10439-10444
    ISBN (Print)978-3-902823-62-5
    DOIs
    Publication statusPublished - 2014
    MoE publication typeA4 Article in a conference publication
    EventThe 19th IFAC World Congress, IFAC WC 2014 - Cape Town, South Africa
    Duration: 24 Aug 201429 Aug 2014

    Publication series

    SeriesIFAC Proceedings Volumes
    Number3
    Volume47
    ISSN1474-6670

    Conference

    ConferenceThe 19th IFAC World Congress, IFAC WC 2014
    Abbreviated titleIFAC WC 2014
    CountrySouth Africa
    CityCape Town
    Period24/08/1429/08/14

    Keywords

    • spatially distributed systems
    • monitoring
    • manufacturing
    • modeling

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  • Cite this

    Tenno, R., & Pohjoranta, A. (2014). Microvia fill process boundary control. In E. Boje, & X. Xia (Eds.), 19th IFAC World Congress (pp. 10439-10444). Elsevier. IFAC Proceedings Volumes, No. 3, Vol.. 47 https://doi.org/10.3182/20140824-6-ZA-1003.00947