Abstract
This paper presents an exponentially stabilizing boundary
control for the microvia fill process. The control
accounts for the mass balance of the copper ions in the
electrolyte and for the surface mass balance of the
deposition-blocking additives, both modeled with a
diffusion mass transfer model in a shape changing domain.
With simulations based on real-world data, it is shown
that by applying the control, the microvia fill process
can be speeded up (in the example case by ca. 15%)
without endangering product output quality
| Original language | English |
|---|---|
| Title of host publication | 19th IFAC World Congress |
| Editors | Edward Boje, Xiaohua Xia |
| Publisher | Elsevier |
| Pages | 10439-10444 |
| ISBN (Print) | 978-3-902823-62-5 |
| DOIs | |
| Publication status | Published - 2014 |
| MoE publication type | A4 Article in a conference publication |
| Event | The 19th IFAC World Congress, IFAC WC 2014 - Cape Town, South Africa Duration: 24 Aug 2014 → 29 Aug 2014 |
Publication series
| Series | IFAC Proceedings Volumes |
|---|---|
| Number | 3 |
| Volume | 47 |
| ISSN | 1474-6670 |
Conference
| Conference | The 19th IFAC World Congress, IFAC WC 2014 |
|---|---|
| Abbreviated title | IFAC WC 2014 |
| Country | South Africa |
| City | Cape Town |
| Period | 24/08/14 → 29/08/14 |
Keywords
- spatially distributed systems
- monitoring
- manufacturing
- modeling
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Cite this
Tenno, R., & Pohjoranta, A. (2014). Microvia fill process boundary control. In E. Boje, & X. Xia (Eds.), 19th IFAC World Congress (pp. 10439-10444). Elsevier. IFAC Proceedings Volumes, No. 3, Vol.. 47 https://doi.org/10.3182/20140824-6-ZA-1003.00947