Microvia Superfilling Process Control

R. Tenno, A. Pohjoranta

    Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review

    Abstract

    Electrochemical thermodynamics is the foundation of the microvia fill process, whose model represents the mass conservation of species (copper ions and surfactants) in the condition of moving boundary. The shape of via changes due to the deposed metallic copper, whose growth depends on the blocking effect of surfactants, which in turn depends on the boundary curvature. The via filling process is controlled through the boundary by adjusting the electric current flowing through the bath system. Maximizing the current raises the via fill process speed but ends up in depletion of the copper ions at the bottom of via causing an incomplete via fill (poorly fabricated board). In this paper the problem is solved by adjusting the concentration of copper ions to a reference value near the panel surface of the plated board. The stabilizing control is proposed based on the developed via fill model. By applying the control, the via fill process can be sped up by ca. 20% and the via dimple minimized 5% without risking product output quality.

    Original languageEnglish
    Pages (from-to)85-90
    Number of pages6
    JournalIFAC-PapersOnLine
    Volume52
    Issue number7
    DOIs
    Publication statusPublished - 2019
    MoE publication typeA4 Article in a conference publication
    Event3rd IFAC Workshop on Thermodynamic Foundations for a Mathematical Systems Theory, TFMST 2019 - Louvain-la-Neuve, Belgium
    Duration: 20 May 201924 May 2019

    Fingerprint

    Process control
    Copper
    Ions
    Surface active agents
    Electric currents
    Conservation
    Thermodynamics

    Keywords

    • boundary control
    • distributed parameter system
    • electrodeposition

    Cite this

    Tenno, R. ; Pohjoranta, A. / Microvia Superfilling Process Control. In: IFAC-PapersOnLine. 2019 ; Vol. 52, No. 7. pp. 85-90.
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    keywords = "boundary control, distributed parameter system, electrodeposition",
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    Microvia Superfilling Process Control. / Tenno, R.; Pohjoranta, A.

    In: IFAC-PapersOnLine, Vol. 52, No. 7, 2019, p. 85-90.

    Research output: Contribution to journalArticle in a proceedings journalScientificpeer-review

    TY - JOUR

    T1 - Microvia Superfilling Process Control

    AU - Tenno, R.

    AU - Pohjoranta, A.

    PY - 2019

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    N2 - Electrochemical thermodynamics is the foundation of the microvia fill process, whose model represents the mass conservation of species (copper ions and surfactants) in the condition of moving boundary. The shape of via changes due to the deposed metallic copper, whose growth depends on the blocking effect of surfactants, which in turn depends on the boundary curvature. The via filling process is controlled through the boundary by adjusting the electric current flowing through the bath system. Maximizing the current raises the via fill process speed but ends up in depletion of the copper ions at the bottom of via causing an incomplete via fill (poorly fabricated board). In this paper the problem is solved by adjusting the concentration of copper ions to a reference value near the panel surface of the plated board. The stabilizing control is proposed based on the developed via fill model. By applying the control, the via fill process can be sped up by ca. 20% and the via dimple minimized 5% without risking product output quality.

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