Abstract
Small electronic devices are nowadays used in varying
conditions, which expose them to stresses, which should
be recognized, and take into account in the planning
work. One part of this stress is related to transport of
potentially harmful chemical substances into small
mechanical structures of devices. The transport of these
chemical substances, which may be partly or totally bound
to fine particles, happens by molecular diffusion and
advection by air flow. The exact structure of the devices
of interest may be very complicated to be used in
diffusion and fluid mechanical calculations. Therefore,
we have applied simplified contamination model, which
parameters, though, are estimated by numerical modelling
of fine particle transport inside an example internal
structure. We observed that it is possible to calculate
the needed parameters and that those parameters showed
maximum mobility for particles of diameter varying from
about 50 to 500 nm.
| Original language | English |
|---|---|
| Title of host publication | Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006 |
| Publisher | COMSOL |
| Pages | 117-122 |
| ISBN (Print) | 87-989426-1-1 |
| Publication status | Published - 2006 |
| MoE publication type | A4 Article in a conference publication |
Keywords
- electronic devices
- aerosol particles
- aerosols
- contamination
- transport models
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Cite this
Gregersen, L. E. ., Olin, M., Laakso, L., Hannula, J., Galkin, T., & Väkeväinen, K. (2006). Model calculations about deposition of aerosol particles in electronic devices. In Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006 (pp. 117-122). COMSOL.