Small electronic devices are nowadays used in varying conditions, which expose them to stresses, which should be recognized, and take into account in the planning work. One part of this stress is related to transport of potentially harmful chemical substances into small mechanical structures of devices. The transport of these chemical substances, which may be partly or totally bound to fine particles, happens by molecular diffusion and advection by air flow. The exact structure of the devices of interest may be very complicated to be used in diffusion and fluid mechanical calculations. Therefore, we have applied simplified contamination model, which parameters, though, are estimated by numerical modelling of fine particle transport inside an example internal structure. We observed that it is possible to calculate the needed parameters and that those parameters showed maximum mobility for particles of diameter varying from about 50 to 500 nm.
|Title of host publication||Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006|
|Publication status||Published - 2006|
|MoE publication type||A4 Article in a conference publication|
- electronic devices
- aerosol particles
- transport models
Gregersen, L. E. ., Olin, M., Laakso, L., Hannula, J., Galkin, T., & Väkeväinen, K. (2006). Model calculations about deposition of aerosol particles in electronic devices. In Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006 (pp. 117-122). COMSOL.