Model calculations about deposition of aerosol particles in electronic devices

Lars (Ed.) Gregersen, Markus Olin, Lauri Laakso, Jukka Hannula, Timo Galkin, Kyösti Väkeväinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Small electronic devices are nowadays used in varying conditions, which expose them to stresses, which should be recognized, and take into account in the planning work. One part of this stress is related to transport of potentially harmful chemical substances into small mechanical structures of devices. The transport of these chemical substances, which may be partly or totally bound to fine particles, happens by molecular diffusion and advection by air flow. The exact structure of the devices of interest may be very complicated to be used in diffusion and fluid mechanical calculations. Therefore, we have applied simplified contamination model, which parameters, though, are estimated by numerical modelling of fine particle transport inside an example internal structure. We observed that it is possible to calculate the needed parameters and that those parameters showed maximum mobility for particles of diameter varying from about 50 to 500 nm.
Original languageEnglish
Title of host publicationProceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006
PublisherCOMSOL
Pages117-122
ISBN (Print)87-989426-1-1
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication

Fingerprint

chemical substance
aerosol
airflow
advection
fluid
modeling
calculation
particle
parameter
electronics
contamination
planning

Keywords

  • electronic devices
  • aerosol particles
  • aerosols
  • contamination
  • transport models

Cite this

Gregersen, L. E. ., Olin, M., Laakso, L., Hannula, J., Galkin, T., & Väkeväinen, K. (2006). Model calculations about deposition of aerosol particles in electronic devices. In Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006 (pp. 117-122). COMSOL.
Gregersen, Lars (Ed.) ; Olin, Markus ; Laakso, Lauri ; Hannula, Jukka ; Galkin, Timo ; Väkeväinen, Kyösti. / Model calculations about deposition of aerosol particles in electronic devices. Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006. COMSOL, 2006. pp. 117-122
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abstract = "Small electronic devices are nowadays used in varying conditions, which expose them to stresses, which should be recognized, and take into account in the planning work. One part of this stress is related to transport of potentially harmful chemical substances into small mechanical structures of devices. The transport of these chemical substances, which may be partly or totally bound to fine particles, happens by molecular diffusion and advection by air flow. The exact structure of the devices of interest may be very complicated to be used in diffusion and fluid mechanical calculations. Therefore, we have applied simplified contamination model, which parameters, though, are estimated by numerical modelling of fine particle transport inside an example internal structure. We observed that it is possible to calculate the needed parameters and that those parameters showed maximum mobility for particles of diameter varying from about 50 to 500 nm.",
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Gregersen, LE, Olin, M, Laakso, L, Hannula, J, Galkin, T & Väkeväinen, K 2006, Model calculations about deposition of aerosol particles in electronic devices. in Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006. COMSOL, pp. 117-122.

Model calculations about deposition of aerosol particles in electronic devices. / Gregersen, Lars (Ed.); Olin, Markus; Laakso, Lauri; Hannula, Jukka; Galkin, Timo; Väkeväinen, Kyösti.

Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006. COMSOL, 2006. p. 117-122.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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T1 - Model calculations about deposition of aerosol particles in electronic devices

AU - Gregersen, Lars (Ed.)

AU - Olin, Markus

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AU - Galkin, Timo

AU - Väkeväinen, Kyösti

N1 - CA2: tk506 Project code: 6272

PY - 2006

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N2 - Small electronic devices are nowadays used in varying conditions, which expose them to stresses, which should be recognized, and take into account in the planning work. One part of this stress is related to transport of potentially harmful chemical substances into small mechanical structures of devices. The transport of these chemical substances, which may be partly or totally bound to fine particles, happens by molecular diffusion and advection by air flow. The exact structure of the devices of interest may be very complicated to be used in diffusion and fluid mechanical calculations. Therefore, we have applied simplified contamination model, which parameters, though, are estimated by numerical modelling of fine particle transport inside an example internal structure. We observed that it is possible to calculate the needed parameters and that those parameters showed maximum mobility for particles of diameter varying from about 50 to 500 nm.

AB - Small electronic devices are nowadays used in varying conditions, which expose them to stresses, which should be recognized, and take into account in the planning work. One part of this stress is related to transport of potentially harmful chemical substances into small mechanical structures of devices. The transport of these chemical substances, which may be partly or totally bound to fine particles, happens by molecular diffusion and advection by air flow. The exact structure of the devices of interest may be very complicated to be used in diffusion and fluid mechanical calculations. Therefore, we have applied simplified contamination model, which parameters, though, are estimated by numerical modelling of fine particle transport inside an example internal structure. We observed that it is possible to calculate the needed parameters and that those parameters showed maximum mobility for particles of diameter varying from about 50 to 500 nm.

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KW - aerosols

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KW - transport models

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BT - Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006

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Gregersen LE, Olin M, Laakso L, Hannula J, Galkin T, Väkeväinen K. Model calculations about deposition of aerosol particles in electronic devices. In Proceedings of the Nordic Comsol Conference 2006 Copenhagen. Copenhagen, November, 1-2, 2006. COMSOL. 2006. p. 117-122