Model for electroless nickel plating of through holes board process: Model accuracy testing

K. Kantola*, R. Tenno, H. Koivo

*Corresponding author for this work

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

Model for the electroless nickel plating of through holes board process developed earlier is tested in this paper on independent (from calibration) data and shown to be adequate and thus capable to be applied for monitoring of the board and bath parameters usually analysed in laboratory with a delay of 6-10 hours.
Original languageEnglish
Title of host publicationProceedings of the Fifth IASTED International Conference on Modelling, Simulation, and Optimization
PublisherActa Press
Pages74-84
ISBN (Print)0-88986-524-8, 978-0-88986-526-6
Publication statusPublished - 2005
MoE publication typeA4 Article in a conference publication
Event5th IASTED International Conference on Modelling, Simulation, and Optimization - Oranjestad, Aruba
Duration: 29 Aug 200531 Aug 2005

Conference

Conference5th IASTED International Conference on Modelling, Simulation, and Optimization
Country/TerritoryAruba
CityOranjestad
Period29/08/0531/08/05

Keywords

  • Chemical plating
  • Identification
  • Modelling

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