Abstract
| Original language | English |
|---|---|
| Title of host publication | 25th Norchip Conference, NORCHIP 2007 |
| Place of Publication | Piscataway, NJ, USA |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 142-145 |
| ISBN (Print) | 978-1-4244-1516-8, 978-1-4244-1517-5 |
| DOIs | |
| Publication status | Published - 2007 |
| MoE publication type | A4 Article in a conference publication |
| Event | 25th Norchip Conference, Norchip 2007 - Alborg, Denmark Duration: 19 Nov 2007 → 20 Nov 2007 |
Conference
| Conference | 25th Norchip Conference, Norchip 2007 |
|---|---|
| Abbreviated title | Norchip 2007 |
| Country | Denmark |
| City | Alborg |
| Period | 19/11/07 → 20/11/07 |
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Modeling capacitive links for broadband inter-chip communication. / Viitala, O.; Flak, Jacek; Lindfors, S.
25th Norchip Conference, NORCHIP 2007. Piscataway, NJ, USA : IEEE Institute of Electrical and Electronic Engineers , 2007. p. 142-145.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Modeling capacitive links for broadband inter-chip communication
AU - Viitala, O.
AU - Flak, Jacek
AU - Lindfors, S.
PY - 2007
Y1 - 2007
N2 - This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.
AB - This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.
U2 - 10.1109/NORCHP.2007.4481058
DO - 10.1109/NORCHP.2007.4481058
M3 - Conference article in proceedings
SN - 978-1-4244-1516-8
SN - 978-1-4244-1517-5
SP - 142
EP - 145
BT - 25th Norchip Conference, NORCHIP 2007
PB - IEEE Institute of Electrical and Electronic Engineers
CY - Piscataway, NJ, USA
ER -