Abstract
This paper presents the modeling of a close-proximity
communication link with a lumped circuit representation.
The inter-chip data transfer is performed via capacitive
couplings between the top facing dies (flip-chip
arrangement). The problems occuring in such a wireless
communications are introduced. Based on three-dimensional
(3D) electromagnetics (EM) simulations, a lumped circuit
model for the capacitive link has been developed. The
effect of cross-talk between adjacent channels is also
considered in the model and discussed.
Original language | English |
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Title of host publication | 25th Norchip Conference, NORCHIP 2007 |
Place of Publication | Piscataway, NJ, USA |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Pages | 142-145 |
ISBN (Print) | 978-1-4244-1516-8, 978-1-4244-1517-5 |
DOIs | |
Publication status | Published - 2007 |
MoE publication type | A4 Article in a conference publication |
Event | 25th Norchip Conference, Norchip 2007 - Alborg, Denmark Duration: 19 Nov 2007 → 20 Nov 2007 |
Conference
Conference | 25th Norchip Conference, Norchip 2007 |
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Abbreviated title | Norchip 2007 |
Country/Territory | Denmark |
City | Alborg |
Period | 19/11/07 → 20/11/07 |