Modeling capacitive links for broadband inter-chip communication

O. Viitala, Jacek Flak, S. Lindfors

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)

    Abstract

    This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.
    Original languageEnglish
    Title of host publication25th Norchip Conference, NORCHIP 2007
    Place of PublicationPiscataway, NJ, USA
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages142-145
    ISBN (Print)978-1-4244-1516-8, 978-1-4244-1517-5
    DOIs
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    Event25th Norchip Conference, Norchip 2007 - Alborg, Denmark
    Duration: 19 Nov 200720 Nov 2007

    Conference

    Conference25th Norchip Conference, Norchip 2007
    Abbreviated titleNorchip 2007
    CountryDenmark
    CityAlborg
    Period19/11/0720/11/07

    Fingerprint Dive into the research topics of 'Modeling capacitive links for broadband inter-chip communication'. Together they form a unique fingerprint.

    Cite this