Modeling capacitive links for broadband inter-chip communication

O. Viitala; Jacek Flak; S. Lindfors

doi:10.1109/NORCHP.2007.4481058

Modeling capacitive links for broadband inter-chip communication

O. Viitala, Jacek Flak, S. Lindfors

BA191G Sensor System Integration

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

4 Citations (Scopus)

Abstract

This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.

Original language	English
Title of host publication	25th Norchip Conference, NORCHIP 2007
Place of Publication	Piscataway, NJ, USA
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	142-145
ISBN (Print)	978-1-4244-1516-8, 978-1-4244-1517-5
DOIs	https://doi.org/10.1109/NORCHP.2007.4481058
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	25th Norchip Conference, Norchip 2007 - Alborg, Denmark Duration: 19 Nov 2007 → 20 Nov 2007

Conference

Conference	25th Norchip Conference, Norchip 2007
Abbreviated title	Norchip 2007
Country	Denmark
City	Alborg
Period	19/11/07 → 20/11/07

Access to Document

10.1109/NORCHP.2007.4481058

Fingerprint Dive into the research topics of 'Modeling capacitive links for broadband inter-chip communication'. Together they form a unique fingerprint.

Cite this

@inproceedings{1c81acbe81644bd1b2bfd550bf32fafe,

title = "Modeling capacitive links for broadband inter-chip communication",

abstract = "This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.",

author = "O. Viitala and Jacek Flak and S. Lindfors",

year = "2007",

doi = "10.1109/NORCHP.2007.4481058",

language = "English",

isbn = "978-1-4244-1516-8",

pages = "142--145",

booktitle = "25th Norchip Conference, NORCHIP 2007",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "25th Norchip Conference, Norchip 2007, Norchip 2007 ; Conference date: 19-11-2007 Through 20-11-2007",

}

Modeling capacitive links for broadband inter-chip communication. / Viitala, O.; Flak, Jacek; Lindfors, S.

25th Norchip Conference, NORCHIP 2007. Piscataway, NJ, USA : IEEE Institute of Electrical and Electronic Engineers, 2007. p. 142-145.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Modeling capacitive links for broadband inter-chip communication

AU - Viitala, O.

AU - Flak, Jacek

AU - Lindfors, S.

PY - 2007

Y1 - 2007

N2 - This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.

AB - This paper presents the modeling of a close-proximity communication link with a lumped circuit representation. The inter-chip data transfer is performed via capacitive couplings between the top facing dies (flip-chip arrangement). The problems occuring in such a wireless communications are introduced. Based on three-dimensional (3D) electromagnetics (EM) simulations, a lumped circuit model for the capacitive link has been developed. The effect of cross-talk between adjacent channels is also considered in the model and discussed.

U2 - 10.1109/NORCHP.2007.4481058

DO - 10.1109/NORCHP.2007.4481058

M3 - Conference article in proceedings

SN - 978-1-4244-1516-8

SN - 978-1-4244-1517-5

SP - 142

EP - 145

BT - 25th Norchip Conference, NORCHIP 2007

PB - IEEE Institute of Electrical and Electronic Engineers

CY - Piscataway, NJ, USA

T2 - 25th Norchip Conference, Norchip 2007

Y2 - 19 November 2007 through 20 November 2007

ER -