Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.
|Title of host publication||Proceedings|
|Subtitle of host publication||IMAPS Nordic Conference 2012|
|Publication status||Published - 2012|
|MoE publication type||A4 Article in a conference publication|
|Event||IMAPS Nordic Annual Conference 2012 - Helsingor, Denmark|
Duration: 2 Sep 2012 → 4 Sep 2012
|Conference||IMAPS Nordic Annual Conference 2012|
|Period||2/09/12 → 4/09/12|
- Flip chip bonding
- Non-Newtonian flow
- Pixel detector
Gädda, A., Salonen, J., Vähänen, S., Monnoyer, P., Heikkinen, H., Pohjonen, H., & Eränen, S. (2012). Modeling of the underfill flow process in the flip chip bonded pixel detectors. In J. Kutilainen (Ed.), Proceedings: IMAPS Nordic Conference 2012 (pp. 82-85). IMAPS Nordic.