Abstract
Modeling of the underfilling process of the flip chip
bonded components has been studied. The size of the
hybridized pixel detectors used in the flip chip bonding
process varied up to 1 cm * 1.6 cm. An underfill was
required to enhance the mechanical properties of the
bonded component. An imidazole based epoxy resin was used
as the underfill polymer. Computational methods were
considered to be highly attractive in order to reduce
failure in testing of limited number of available
experimental samples. In addition, the computational
methods permit rapid definition of suitable process
parameters. The polymer was modeled as a non-Newtonian
fluid, which agreed with the actual material properties.
The modeling was also selected as simple as possible. The
obtained values were replicated as close as possible
during the actual dispensing of the underfill material.
The viscosity of the underfill material was adjusted by
heating. The modeled parameters were validated by
positive results on the bonded components.
Original language | English |
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Title of host publication | Proceedings |
Subtitle of host publication | IMAPS Nordic Conference 2012 |
Editors | Jarkko Kutilainen |
Publisher | IMAPS Nordic |
Pages | 82-85 |
ISBN (Print) | 978-1-6227-6316-0 |
Publication status | Published - 2012 |
MoE publication type | A4 Article in a conference publication |
Event | IMAPS Nordic Annual Conference 2012 - Helsingor, Denmark Duration: 2 Sept 2012 → 4 Sept 2012 |
Conference
Conference | IMAPS Nordic Annual Conference 2012 |
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Country/Territory | Denmark |
City | Helsingor |
Period | 2/09/12 → 4/09/12 |
Keywords
- Flip chip bonding
- Modeling
- Non-Newtonian flow
- Pixel detector
- Underfill