Modeling of the underfill flow process in the flip chip bonded pixel detectors

Akiko Gädda, Jaakko Salonen, Sami Vähänen, Philippe Monnoyer, Hannele Heikkinen, Harri Pohjonen, Simo Eränen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publicationIMAPS Nordic Conference 2012
EditorsJarkko Kutilainen
Pages82-85
Publication statusPublished - 2012
MoE publication typeA4 Article in a conference publication
EventIMAPS Nordic Annual Conference 2012 - Helsingor, Denmark
Duration: 2 Sep 20124 Sep 2012

Conference

ConferenceIMAPS Nordic Annual Conference 2012
CountryDenmark
CityHelsingor
Period2/09/124/09/12

Fingerprint

Computational methods
Pixels
Detectors
Polymers
Epoxy resins
Materials properties
Viscosity
Heating
Mechanical properties
Fluids
Testing

Keywords

  • Flip chip bonding
  • Modeling
  • Non-Newtonian flow
  • Pixel detector
  • Underfill

Cite this

Gädda, A., Salonen, J., Vähänen, S., Monnoyer, P., Heikkinen, H., Pohjonen, H., & Eränen, S. (2012). Modeling of the underfill flow process in the flip chip bonded pixel detectors. In J. Kutilainen (Ed.), Proceedings: IMAPS Nordic Conference 2012 (pp. 82-85)
Gädda, Akiko ; Salonen, Jaakko ; Vähänen, Sami ; Monnoyer, Philippe ; Heikkinen, Hannele ; Pohjonen, Harri ; Eränen, Simo. / Modeling of the underfill flow process in the flip chip bonded pixel detectors. Proceedings: IMAPS Nordic Conference 2012. editor / Jarkko Kutilainen. 2012. pp. 82-85
@inproceedings{60baae1683e44b54b275fc8250c271f5,
title = "Modeling of the underfill flow process in the flip chip bonded pixel detectors",
abstract = "Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.",
keywords = "Flip chip bonding, Modeling, Non-Newtonian flow, Pixel detector, Underfill",
author = "Akiko G{\"a}dda and Jaakko Salonen and Sami V{\"a}h{\"a}nen and Philippe Monnoyer and Hannele Heikkinen and Harri Pohjonen and Simo Er{\"a}nen",
year = "2012",
language = "English",
isbn = "978-1-6227-6316-0",
pages = "82--85",
editor = "Jarkko Kutilainen",
booktitle = "Proceedings",

}

Gädda, A, Salonen, J, Vähänen, S, Monnoyer, P, Heikkinen, H, Pohjonen, H & Eränen, S 2012, Modeling of the underfill flow process in the flip chip bonded pixel detectors. in J Kutilainen (ed.), Proceedings: IMAPS Nordic Conference 2012. pp. 82-85, IMAPS Nordic Annual Conference 2012, Helsingor, Denmark, 2/09/12.

Modeling of the underfill flow process in the flip chip bonded pixel detectors. / Gädda, Akiko; Salonen, Jaakko; Vähänen, Sami; Monnoyer, Philippe; Heikkinen, Hannele; Pohjonen, Harri; Eränen, Simo.

Proceedings: IMAPS Nordic Conference 2012. ed. / Jarkko Kutilainen. 2012. p. 82-85.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Modeling of the underfill flow process in the flip chip bonded pixel detectors

AU - Gädda, Akiko

AU - Salonen, Jaakko

AU - Vähänen, Sami

AU - Monnoyer, Philippe

AU - Heikkinen, Hannele

AU - Pohjonen, Harri

AU - Eränen, Simo

PY - 2012

Y1 - 2012

N2 - Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.

AB - Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.

KW - Flip chip bonding

KW - Modeling

KW - Non-Newtonian flow

KW - Pixel detector

KW - Underfill

UR - http://www.proceedings.com/15895.html

M3 - Conference article in proceedings

SN - 978-1-6227-6316-0

SP - 82

EP - 85

BT - Proceedings

A2 - Kutilainen, Jarkko

ER -

Gädda A, Salonen J, Vähänen S, Monnoyer P, Heikkinen H, Pohjonen H et al. Modeling of the underfill flow process in the flip chip bonded pixel detectors. In Kutilainen J, editor, Proceedings: IMAPS Nordic Conference 2012. 2012. p. 82-85