Modeling of the underfill flow process in the flip chip bonded pixel detectors

Akiko Gädda; Jaakko Salonen; Sami Vähänen; Philippe Monnoyer; Hannele Heikkinen; Harri Pohjonen; Simo Eränen

Modeling of the underfill flow process in the flip chip bonded pixel detectors

Akiko Gädda, Jaakko Salonen, Sami Vähänen, Philippe Monnoyer, Hannele Heikkinen, Harri Pohjonen, Simo Eränen

CO112 Sales and Customer Partnerships III

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

Abstract

Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.

Original language	English
Title of host publication	Proceedings
Subtitle of host publication	IMAPS Nordic Conference 2012
Editors	Jarkko Kutilainen
Publisher	IMAPS Nordic
Pages	82-85
ISBN (Print)	978-1-6227-6316-0
Publication status	Published - 2012
MoE publication type	A4 Article in a conference publication
Event	IMAPS Nordic Annual Conference 2012 - Helsingor, Denmark Duration: 2 Sep 2012 → 4 Sep 2012

Conference

Conference	IMAPS Nordic Annual Conference 2012
Country	Denmark
City	Helsingor
Period	2/09/12 → 4/09/12

Keywords

Flip chip bonding
Modeling
Non-Newtonian flow
Pixel detector
Underfill

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Gädda, A., Salonen, J., Vähänen, S., Monnoyer, P., Heikkinen, H., Pohjonen, H., & Eränen, S. (2012). Modeling of the underfill flow process in the flip chip bonded pixel detectors. In J. Kutilainen (Ed.), Proceedings: IMAPS Nordic Conference 2012 (pp. 82-85). IMAPS Nordic.

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title = "Modeling of the underfill flow process in the flip chip bonded pixel detectors",

abstract = "Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.",

keywords = "Flip chip bonding, Modeling, Non-Newtonian flow, Pixel detector, Underfill",

author = "Akiko G{\"a}dda and Jaakko Salonen and Sami V{\"a}h{\"a}nen and Philippe Monnoyer and Hannele Heikkinen and Harri Pohjonen and Simo Er{\"a}nen",

year = "2012",

language = "English",

isbn = "978-1-6227-6316-0",

pages = "82--85",

editor = "Jarkko Kutilainen",

booktitle = "Proceedings",

publisher = "IMAPS Nordic",

address = "Finland",

note = "IMAPS Nordic Annual Conference 2012 ; Conference date: 02-09-2012 Through 04-09-2012",

}

Modeling of the underfill flow process in the flip chip bonded pixel detectors. / Gädda, Akiko; Salonen, Jaakko; Vähänen, Sami; Monnoyer, Philippe; Heikkinen, Hannele; Pohjonen, Harri; Eränen, Simo.

Proceedings: IMAPS Nordic Conference 2012. ed. / Jarkko Kutilainen. IMAPS Nordic, 2012. p. 82-85.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Salonen, Jaakko

AU - Vähänen, Sami

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AU - Heikkinen, Hannele

AU - Pohjonen, Harri

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AB - Modeling of the underfilling process of the flip chip bonded components has been studied. The size of the hybridized pixel detectors used in the flip chip bonding process varied up to 1 cm * 1.6 cm. An underfill was required to enhance the mechanical properties of the bonded component. An imidazole based epoxy resin was used as the underfill polymer. Computational methods were considered to be highly attractive in order to reduce failure in testing of limited number of available experimental samples. In addition, the computational methods permit rapid definition of suitable process parameters. The polymer was modeled as a non-Newtonian fluid, which agreed with the actual material properties. The modeling was also selected as simple as possible. The obtained values were replicated as close as possible during the actual dispensing of the underfill material. The viscosity of the underfill material was adjusted by heating. The modeled parameters were validated by positive results on the bonded components.

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