Abstract
The paper presents a new 3-D hybrid micromachining integration concept. The concept includes splitting the radio system in functional modules. Each module is fabricated separately with usage of DRIE micromachining and Au-Au wafer bonding. Then, Si modules are mechanically integrated in the final system. The hybrid integration technology is demonstrated with in an example of a millimeter wave transmitter with an antenna array at frequency range 235 -255 GHz.
| Original language | English |
|---|---|
| Title of host publication | 2024 Asia-Pacific Microwave Conference |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Pages | 61-63 |
| Number of pages | 3 |
| ISBN (Electronic) | 9798350363548 |
| DOIs | |
| Publication status | Published - 2024 |
| MoE publication type | A4 Article in a conference publication |
| Event | 2024 IEEE Asia-Pacific Microwave Conference, APMC 2024 - Bali, Indonesia Duration: 17 Nov 2024 → 20 Nov 2024 |
Conference
| Conference | 2024 IEEE Asia-Pacific Microwave Conference, APMC 2024 |
|---|---|
| Country/Territory | Indonesia |
| City | Bali |
| Period | 17/11/24 → 20/11/24 |
Funding
This work was supported by the Academy of Finland through MilliRAD (decision no 314542), TeraCom (decision no 319681), and MIDERI (decision no 310234) projects, and by Business Finland through TeraFront project (decision number 8398/31/2022).
Keywords
- integration
- micromachining
- terahertz (THz)
