Multi-layer stubs in LTCC technology

A. Panther, M.G. Stubbs, Kari Kautio, Malcom G. Stubbs

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)


Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
Original languageEnglish
Title of host publication34th European Microwave Conference, 2004
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
Event34th European Microwave Conference - Amsterdam, Netherlands
Duration: 12 Oct 200414 Oct 2004


Conference34th European Microwave Conference

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