Multi-layer stubs in LTCC technology

A. Panther, M.G. Stubbs, Kari Kautio, Malcom G. Stubbs

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    1 Citation (Scopus)

    Abstract

    Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
    Original languageEnglish
    Title of host publication34th European Microwave Conference, 2004
    Pages617-620
    Publication statusPublished - 2004
    MoE publication typeA4 Article in a conference publication
    Event34th European Microwave Conference - Amsterdam, Netherlands
    Duration: 12 Oct 200414 Oct 2004

    Conference

    Conference34th European Microwave Conference
    CountryNetherlands
    CityAmsterdam
    Period12/10/0414/10/04

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