Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
|Title of host publication||34th European Microwave Conference, 2004|
|Publication status||Published - 2004|
|MoE publication type||A4 Article in a conference publication|
|Event||34th European Microwave Conference - Amsterdam, Netherlands|
Duration: 12 Oct 2004 → 14 Oct 2004
|Conference||34th European Microwave Conference|
|Period||12/10/04 → 14/10/04|