Abstract
Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
| Original language | English |
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| Title of host publication | 34th European Microwave Conference, 2004 |
| Pages | 617-620 |
| Publication status | Published - 2004 |
| MoE publication type | A4 Article in a conference publication |
| Event | 34th European Microwave Conference - Amsterdam, Netherlands Duration: 12 Oct 2004 → 14 Oct 2004 |
Conference
| Conference | 34th European Microwave Conference |
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| Country/Territory | Netherlands |
| City | Amsterdam |
| Period | 12/10/04 → 14/10/04 |