Multi-layer stubs in LTCC technology

A. Panther, M.G. Stubbs, Kari Kautio, Malcom G. Stubbs

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

1 Citation (Scopus)

Abstract

Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.
Original languageEnglish
Title of host publication34th European Microwave Conference, 2004
Pages617-620
Publication statusPublished - 2004
MoE publication typeA4 Article in a conference publication
Event34th European Microwave Conference - Amsterdam, Netherlands
Duration: 12 Oct 200414 Oct 2004

Conference

Conference34th European Microwave Conference
CountryNetherlands
CityAmsterdam
Period12/10/0414/10/04

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  • Cite this

    Panther, A., Stubbs, M. G., Kautio, K., & Stubbs, M. G. (2004). Multi-layer stubs in LTCC technology. In 34th European Microwave Conference, 2004 (pp. 617-620) https://ieeexplore.ieee.org/document/1418892