Multi-layer stubs in LTCC technology

A. Panther; M.G. Stubbs; Kari Kautio; Malcom G. Stubbs

Multi-layer stubs in LTCC technology

A. Panther
, M.G. Stubbs
, Kari Kautio
, Malcom G. Stubbs

Communications Research Centre Canada

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

1 Citation (Scopus)

Abstract

Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.

Original language	English
Title of host publication	34th European Microwave Conference, 2004
Pages	617-620
Publication status	Published - 2004
MoE publication type	A4 Article in a conference publication
Event	34th European Microwave Conference - Amsterdam, Netherlands Duration: 12 Oct 2004 → 14 Oct 2004

Conference

Conference	34th European Microwave Conference
Country/Territory	Netherlands
City	Amsterdam
Period	12/10/04 → 14/10/04

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https://ieeexplore.ieee.org/document/1418892

Cite this

@inproceedings{24490041b1f44895a11c39e76533005d,

title = "Multi-layer stubs in LTCC technology",

abstract = "Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.",

author = "A. Panther and M.G. Stubbs and Kari Kautio and Stubbs, \{Malcom G.\}",

year = "2004",

language = "English",

isbn = "1-58053-992-0",

pages = "617--620",

booktitle = "34th European Microwave Conference, 2004",

note = "34th European Microwave Conference ; Conference date: 12-10-2004 Through 14-10-2004",

}

TY - GEN

T1 - Multi-layer stubs in LTCC technology

AU - Panther, A.

AU - Stubbs, M.G.

AU - Kautio, Kari

AU - Stubbs, Malcom G.

PY - 2004

Y1 - 2004

N2 - Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.

AB - Multi-layer structures using multiple conductor layers in LTCC technology are examined for use as microwave stubs. Novel, multi-layer stubs are designed and tested for both microstrip and coplanar systems. Circuit models of multi-layer stubs are presented snd compared with measured data and a bandstop fdter using multi-layer stubs is presented to demonstrate application of the concept.

M3 - Conference article in proceedings

SN - 1-58053-992-0

SP - 617

EP - 620

BT - 34th European Microwave Conference, 2004

T2 - 34th European Microwave Conference

Y2 - 12 October 2004 through 14 October 2004

ER -

Multi-layer stubs in LTCC technology

Abstract

Conference

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Cite this