Multi-wavelength transceiver integration on SOI for high-performance computing system applications

Timo Aalto; Mikko Harjanne; Sami Ylinen; Markku Kapulainen; Tapani Vehmas; Matteo Cherchi; Christian Neumeyr; Markus Ortsiefer; Antonio Malacarne

doi:10.1117/12.2079682

Multi-wavelength transceiver integration on SOI for high-performance computing system applications

Timo Aalto, Mikko Harjanne, Sami Ylinen, Markku Kapulainen, Tapani Vehmas, Matteo Cherchi, Christian Neumeyr, Markus Ortsiefer, Antonio Malacarne

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

5 Citations (Scopus)

Abstract

We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm² footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.

Original language	English
Title of host publication	Optical Interconnects XV
Editors	Henning Schröder, Ray T. Chen
Publisher	International Society for Optics and Photonics SPIE
ISBN (Print)	978-1-6284-1458-5
DOIs	https://doi.org/10.1117/12.2079682
Publication status	Published - 3 Apr 2015
MoE publication type	A4 Article in a conference publication
Event	SPIE OPTO, Optical Interconnects XV - San Francisco, United States Duration: 7 Feb 2015 → 12 Feb 2015

Publication series

Series	Proceedings of SPIE
Volume	9368
ISSN	0277-786X

Conference

Conference	SPIE OPTO, Optical Interconnects XV
Abbreviated title	SPIE OPTO
Country	United States
City	San Francisco
Period	7/02/15 → 12/02/15

Keywords

arrayed waveguide grating
electro absorption modulator
hybrid integration
optical interconnect
optical interposer
optical packet switching
optoelectronics
semiconductor optical amplifier
silicon photonics
silicon-on-insulator
VCSEL

Access to Document

10.1117/12.2079682

Fingerprint Dive into the research topics of 'Multi-wavelength transceiver integration on SOI for high-performance computing system applications'. Together they form a unique fingerprint.

Cite this

Aalto, T., Harjanne, M., Ylinen, S., Kapulainen, M., Vehmas, T., Cherchi, M., Neumeyr, C., Ortsiefer, M., & Malacarne, A. (2015). Multi-wavelength transceiver integration on SOI for high-performance computing system applications. In H. Schröder, & R. T. Chen (Eds.), Optical Interconnects XV International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 9368 https://doi.org/10.1117/12.2079682

Aalto, Timo ; Harjanne, Mikko ; Ylinen, Sami ; Kapulainen, Markku ; Vehmas, Tapani ; Cherchi, Matteo ; Neumeyr, Christian ; Ortsiefer, Markus ; Malacarne, Antonio. / Multi-wavelength transceiver integration on SOI for high-performance computing system applications. Optical Interconnects XV. editor / Henning Schröder ; Ray T. Chen. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9368).

@inproceedings{b9b2c467d5cd4054b528fcb69fbe391c,

title = "Multi-wavelength transceiver integration on SOI for high-performance computing system applications",

abstract = "We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.",

keywords = "arrayed waveguide grating, electro absorption modulator, hybrid integration, optical interconnect, optical interposer, optical packet switching, optoelectronics, semiconductor optical amplifier, silicon photonics, silicon-on-insulator, VCSEL",

author = "Timo Aalto and Mikko Harjanne and Sami Ylinen and Markku Kapulainen and Tapani Vehmas and Matteo Cherchi and Christian Neumeyr and Markus Ortsiefer and Antonio Malacarne",

year = "2015",

month = apr,

day = "3",

doi = "10.1117/12.2079682",

language = "English",

isbn = "978-1-6284-1458-5",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

editor = "Henning Schr{\"o}der and Chen, {Ray T.}",

booktitle = "Optical Interconnects XV",

address = "United States",

note = "SPIE OPTO, Optical Interconnects XV, SPIE OPTO ; Conference date: 07-02-2015 Through 12-02-2015",

}

Aalto, T , Harjanne, M , Ylinen, S , Kapulainen, M , Vehmas, T , Cherchi, M, Neumeyr, C, Ortsiefer, M & Malacarne, A 2015, Multi-wavelength transceiver integration on SOI for high-performance computing system applications. in H Schröder & RT Chen (eds), Optical Interconnects XV. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 9368, SPIE OPTO, Optical Interconnects XV, San Francisco, United States, 7/02/15. https://doi.org/10.1117/12.2079682

Multi-wavelength transceiver integration on SOI for high-performance computing system applications. / Aalto, Timo ; Harjanne, Mikko ; Ylinen, Sami ; Kapulainen, Markku ; Vehmas, Tapani ; Cherchi, Matteo; Neumeyr, Christian; Ortsiefer, Markus; Malacarne, Antonio.

Optical Interconnects XV. ed. / Henning Schröder; Ray T. Chen. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9368).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Multi-wavelength transceiver integration on SOI for high-performance computing system applications

AU - Aalto, Timo

AU - Harjanne, Mikko

AU - Ylinen, Sami

AU - Kapulainen, Markku

AU - Vehmas, Tapani

AU - Cherchi, Matteo

AU - Neumeyr, Christian

AU - Ortsiefer, Markus

AU - Malacarne, Antonio

PY - 2015/4/3

Y1 - 2015/4/3

N2 - We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.

AB - We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.

KW - arrayed waveguide grating

KW - electro absorption modulator

KW - hybrid integration

KW - optical interconnect

KW - optical interposer

KW - optical packet switching

KW - optoelectronics

KW - semiconductor optical amplifier

KW - silicon photonics

KW - silicon-on-insulator

KW - VCSEL

U2 - 10.1117/12.2079682

DO - 10.1117/12.2079682

M3 - Conference article in proceedings

SN - 978-1-6284-1458-5

T3 - Proceedings of SPIE

BT - Optical Interconnects XV

A2 - Schröder, Henning

A2 - Chen, Ray T.

PB - International Society for Optics and Photonics SPIE

T2 - SPIE OPTO, Optical Interconnects XV

Y2 - 7 February 2015 through 12 February 2015

ER -