Multi-wavelength transceiver integration on SOI for high-performance computing system applications

Timo Aalto, Mikko Harjanne, Sami Ylinen, Markku Kapulainen, Tapani Vehmas, Matteo Cherchi, Christian Neumeyr, Markus Ortsiefer, Antonio Malacarne

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

    5 Citations (Scopus)

    Abstract

    We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.
    Original languageEnglish
    Title of host publicationOptical Interconnects XV
    EditorsHenning Schröder, Ray T. Chen
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-1-6284-1458-5
    DOIs
    Publication statusPublished - 3 Apr 2015
    MoE publication typeA4 Article in a conference publication
    EventSPIE OPTO, Optical Interconnects XV - San Francisco, United States
    Duration: 7 Feb 2015 → 12 Feb 2015

    Publication series

    SeriesProceedings of SPIE
    Volume9368
    ISSN0277-786X

    Conference

    ConferenceSPIE OPTO, Optical Interconnects XV
    Abbreviated titleSPIE OPTO
    CountryUnited States
    CitySan Francisco
    Period7/02/15 → 12/02/15

    Fingerprint

    SOI (semiconductors)
    transmitter receivers
    wavelengths
    chips
    waveguides
    packet switching
    fibers
    footprints
    crosstalk
    format
    flat surfaces
    platforms
    spacing
    modulation

    Keywords

    • arrayed waveguide grating
    • electro absorption modulator
    • hybrid integration
    • optical interconnect
    • optical interposer
    • optical packet switching
    • optoelectronics
    • semiconductor optical amplifier
    • silicon photonics
    • silicon-on-insulator
    • VCSEL

    Cite this

    Aalto, T., Harjanne, M., Ylinen, S., Kapulainen, M., Vehmas, T., Cherchi, M., ... Malacarne, A. (2015). Multi-wavelength transceiver integration on SOI for high-performance computing system applications. In H. Schröder, & R. T. Chen (Eds.), Optical Interconnects XV International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 9368 https://doi.org/10.1117/12.2079682
    Aalto, Timo ; Harjanne, Mikko ; Ylinen, Sami ; Kapulainen, Markku ; Vehmas, Tapani ; Cherchi, Matteo ; Neumeyr, Christian ; Ortsiefer, Markus ; Malacarne, Antonio. / Multi-wavelength transceiver integration on SOI for high-performance computing system applications. Optical Interconnects XV. editor / Henning Schröder ; Ray T. Chen. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9368).
    @inproceedings{b9b2c467d5cd4054b528fcb69fbe391c,
    title = "Multi-wavelength transceiver integration on SOI for high-performance computing system applications",
    abstract = "We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.",
    keywords = "arrayed waveguide grating, electro absorption modulator, hybrid integration, optical interconnect, optical interposer, optical packet switching, optoelectronics, semiconductor optical amplifier, silicon photonics, silicon-on-insulator, VCSEL",
    author = "Timo Aalto and Mikko Harjanne and Sami Ylinen and Markku Kapulainen and Tapani Vehmas and Matteo Cherchi and Christian Neumeyr and Markus Ortsiefer and Antonio Malacarne",
    year = "2015",
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    series = "Proceedings of SPIE",
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    Aalto, T, Harjanne, M, Ylinen, S, Kapulainen, M, Vehmas, T, Cherchi, M, Neumeyr, C, Ortsiefer, M & Malacarne, A 2015, Multi-wavelength transceiver integration on SOI for high-performance computing system applications. in H Schröder & RT Chen (eds), Optical Interconnects XV. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 9368, SPIE OPTO, Optical Interconnects XV, San Francisco, United States, 7/02/15. https://doi.org/10.1117/12.2079682

    Multi-wavelength transceiver integration on SOI for high-performance computing system applications. / Aalto, Timo; Harjanne, Mikko; Ylinen, Sami; Kapulainen, Markku; Vehmas, Tapani; Cherchi, Matteo; Neumeyr, Christian; Ortsiefer, Markus; Malacarne, Antonio.

    Optical Interconnects XV. ed. / Henning Schröder; Ray T. Chen. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9368).

    Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

    TY - GEN

    T1 - Multi-wavelength transceiver integration on SOI for high-performance computing system applications

    AU - Aalto, Timo

    AU - Harjanne, Mikko

    AU - Ylinen, Sami

    AU - Kapulainen, Markku

    AU - Vehmas, Tapani

    AU - Cherchi, Matteo

    AU - Neumeyr, Christian

    AU - Ortsiefer, Markus

    AU - Malacarne, Antonio

    PY - 2015/4/3

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    N2 - We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.

    AB - We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.

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    KW - electro absorption modulator

    KW - hybrid integration

    KW - optical interconnect

    KW - optical interposer

    KW - optical packet switching

    KW - optoelectronics

    KW - semiconductor optical amplifier

    KW - silicon photonics

    KW - silicon-on-insulator

    KW - VCSEL

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    M3 - Conference article in proceedings

    SN - 978-1-6284-1458-5

    T3 - Proceedings of SPIE

    BT - Optical Interconnects XV

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    Aalto T, Harjanne M, Ylinen S, Kapulainen M, Vehmas T, Cherchi M et al. Multi-wavelength transceiver integration on SOI for high-performance computing system applications. In Schröder H, Chen RT, editors, Optical Interconnects XV. International Society for Optics and Photonics SPIE. 2015. (Proceedings of SPIE, Vol. 9368). https://doi.org/10.1117/12.2079682

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