Multi-wavelength transceiver integration on SOI for high-performance computing system applications

Timo Aalto, Mikko Harjanne, Sami Ylinen, Markku Kapulainen, Tapani Vehmas, Matteo Cherchi, Christian Neumeyr, Markus Ortsiefer, Antonio Malacarne

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)

Abstract

We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.
Original languageEnglish
Title of host publicationOptical Interconnects XV
EditorsHenning Schröder, Ray T. Chen
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-1-6284-1458-5
DOIs
Publication statusPublished - 3 Apr 2015
MoE publication typeA4 Article in a conference publication
EventSPIE OPTO, Optical Interconnects XV - San Francisco, United States
Duration: 7 Feb 201512 Feb 2015

Publication series

SeriesProceedings of SPIE
Volume9368
ISSN0277-786X

Conference

ConferenceSPIE OPTO, Optical Interconnects XV
Abbreviated titleSPIE OPTO
CountryUnited States
CitySan Francisco
Period7/02/1512/02/15

Fingerprint

SOI (semiconductors)
transmitter receivers
wavelengths
chips
waveguides
packet switching
fibers
footprints
crosstalk
format
flat surfaces
platforms
spacing
modulation

Keywords

  • arrayed waveguide grating
  • electro absorption modulator
  • hybrid integration
  • optical interconnect
  • optical interposer
  • optical packet switching
  • optoelectronics
  • semiconductor optical amplifier
  • silicon photonics
  • silicon-on-insulator
  • VCSEL

Cite this

Aalto, T., Harjanne, M., Ylinen, S., Kapulainen, M., Vehmas, T., Cherchi, M., ... Malacarne, A. (2015). Multi-wavelength transceiver integration on SOI for high-performance computing system applications. In H. Schröder, & R. T. Chen (Eds.), Optical Interconnects XV International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 9368 https://doi.org/10.1117/12.2079682
Aalto, Timo ; Harjanne, Mikko ; Ylinen, Sami ; Kapulainen, Markku ; Vehmas, Tapani ; Cherchi, Matteo ; Neumeyr, Christian ; Ortsiefer, Markus ; Malacarne, Antonio. / Multi-wavelength transceiver integration on SOI for high-performance computing system applications. Optical Interconnects XV. editor / Henning Schröder ; Ray T. Chen. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9368).
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abstract = "We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.",
keywords = "arrayed waveguide grating, electro absorption modulator, hybrid integration, optical interconnect, optical interposer, optical packet switching, optoelectronics, semiconductor optical amplifier, silicon photonics, silicon-on-insulator, VCSEL",
author = "Timo Aalto and Mikko Harjanne and Sami Ylinen and Markku Kapulainen and Tapani Vehmas and Matteo Cherchi and Christian Neumeyr and Markus Ortsiefer and Antonio Malacarne",
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Aalto, T, Harjanne, M, Ylinen, S, Kapulainen, M, Vehmas, T, Cherchi, M, Neumeyr, C, Ortsiefer, M & Malacarne, A 2015, Multi-wavelength transceiver integration on SOI for high-performance computing system applications. in H Schröder & RT Chen (eds), Optical Interconnects XV. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 9368, SPIE OPTO, Optical Interconnects XV, San Francisco, United States, 7/02/15. https://doi.org/10.1117/12.2079682

Multi-wavelength transceiver integration on SOI for high-performance computing system applications. / Aalto, Timo; Harjanne, Mikko; Ylinen, Sami; Kapulainen, Markku; Vehmas, Tapani; Cherchi, Matteo; Neumeyr, Christian; Ortsiefer, Markus; Malacarne, Antonio.

Optical Interconnects XV. ed. / Henning Schröder; Ray T. Chen. International Society for Optics and Photonics SPIE, 2015. (Proceedings of SPIE, Vol. 9368).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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AU - Neumeyr, Christian

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AU - Malacarne, Antonio

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KW - VCSEL

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Aalto T, Harjanne M, Ylinen S, Kapulainen M, Vehmas T, Cherchi M et al. Multi-wavelength transceiver integration on SOI for high-performance computing system applications. In Schröder H, Chen RT, editors, Optical Interconnects XV. International Society for Optics and Photonics SPIE. 2015. (Proceedings of SPIE, Vol. 9368). https://doi.org/10.1117/12.2079682