Multi-wavelength transceiver integration on SOI for high-performance computing system applications

Timo Aalto, Mikko Harjanne, Sami Ylinen, Markku Kapulainen, Tapani Vehmas, Matteo Cherchi, Christian Neumeyr, Markus Ortsiefer, Antonio Malacarne

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    5 Citations (Scopus)

    Abstract

    We present a vision for transceiver integration on a 3 µm SOI waveguide platform for systems scalable to Pb/s. We also present experimental results from the first building blocks developed in the EU-funded RAPIDO project. At 1.3 µm wavelength 80 Gb/s per wavelength is to be achieved using hybrid integration of III-V optoelectronics on SOI. Goals include athermal operation, low-loss I/O coupling, advanced modulation formats and packet switching. An example of the design results is an interposer chip that consists of 12 µm thick SOI waveguides locally tapered down to 3 µm to provide low-loss coupling between an optical single-mode fiber array and the 3 µm SOI chip. First example of experimental results is a 4x4 cyclic AWGs with 5 nm channel spacing, 0.4 dB/facet fiber coupling loss, 3.5 dB center-tocenter loss, and -23 dB adjacent channel crosstalk in 3.5x1.5 mm2 footprint. The second example result is a new VCSEL design that was demonstrated to have up to 40 Gb/s operation at 1.55 µm.
    Original languageEnglish
    Title of host publicationOptical Interconnects XV
    EditorsHenning Schröder, Ray T. Chen
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-1-6284-1458-5
    DOIs
    Publication statusPublished - 3 Apr 2015
    MoE publication typeA4 Article in a conference publication
    EventSPIE OPTO, Optical Interconnects XV - San Francisco, United States
    Duration: 7 Feb 201512 Feb 2015

    Publication series

    SeriesProceedings of SPIE
    Volume9368
    ISSN0277-786X

    Conference

    ConferenceSPIE OPTO, Optical Interconnects XV
    Abbreviated titleSPIE OPTO
    Country/TerritoryUnited States
    CitySan Francisco
    Period7/02/1512/02/15

    Keywords

    • arrayed waveguide grating
    • electro absorption modulator
    • hybrid integration
    • optical interconnect
    • optical interposer
    • optical packet switching
    • optoelectronics
    • semiconductor optical amplifier
    • silicon photonics
    • silicon-on-insulator
    • VCSEL

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