Multilayer flexible wiring board based on screen printed conductors

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publication16th European Microelectronics and Packaging Conference and Exhibition
Subtitle of host publicationEMPC 2007
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007
Conference number: 16

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated titleEMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Petäjä, J., Kautio, K., Funck, H., Karppinen, M., Karioja, P., & Vatanparast, R. (2007). Multilayer flexible wiring board based on screen printed conductors. In 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007
Petäjä, Jarno ; Kautio, Kari ; Funck, H. ; Karppinen, Mikko ; Karioja, Pentti ; Vatanparast, R. / Multilayer flexible wiring board based on screen printed conductors. 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. 2007.
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title = "Multilayer flexible wiring board based on screen printed conductors",
author = "Jarno Pet{\"a}j{\"a} and Kari Kautio and H. Funck and Mikko Karppinen and Pentti Karioja and R. Vatanparast",
year = "2007",
language = "English",
isbn = "9781622764662",
booktitle = "16th European Microelectronics and Packaging Conference and Exhibition",

}

Petäjä, J, Kautio, K, Funck, H, Karppinen, M, Karioja, P & Vatanparast, R 2007, Multilayer flexible wiring board based on screen printed conductors. in 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. 16th European Microelectronics and Packaging Conference and Exhibition, Oulu, Finland, 17/06/07.

Multilayer flexible wiring board based on screen printed conductors. / Petäjä, Jarno; Kautio, Kari; Funck, H.; Karppinen, Mikko; Karioja, Pentti; Vatanparast, R.

16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. 2007.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Multilayer flexible wiring board based on screen printed conductors

AU - Petäjä, Jarno

AU - Kautio, Kari

AU - Funck, H.

AU - Karppinen, Mikko

AU - Karioja, Pentti

AU - Vatanparast, R.

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 9781622764662

BT - 16th European Microelectronics and Packaging Conference and Exhibition

ER -

Petäjä J, Kautio K, Funck H, Karppinen M, Karioja P, Vatanparast R. Multilayer flexible wiring board based on screen printed conductors. In 16th European Microelectronics and Packaging Conference and Exhibition: EMPC 2007. 2007