Multilayer flexible wiring board based on screen printed conductors

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    2 Citations (Scopus)
    Original languageEnglish
    Title of host publication16th European Microelectronics and Packaging Conference and Exhibition
    Subtitle of host publicationEMPC 2007
    Publication statusPublished - 2007
    MoE publication typeA4 Article in a conference publication
    Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
    Duration: 17 Jun 200720 Jun 2007
    Conference number: 16

    Conference

    Conference16th European Microelectronics and Packaging Conference and Exhibition
    Abbreviated titleEMPC 2007
    Country/TerritoryFinland
    CityOulu
    Period17/06/0720/06/07

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