Multilayer flexible wiring board based on screen printed conductors

Jarno Petäjä, Kari Kautio, H. Funck, Mikko Karppinen, Pentti Karioja, R. Vatanparast

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

3 Citations (Scopus)

Original language	English
Title of host publication	16th European Microelectronics and Packaging Conference and Exhibition
Subtitle of host publication	EMPC 2007
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 Conference number: 16

Conference	16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated title	EMPC 2007
Country/Territory	Finland
City	Oulu
Period	17/06/07 → 20/06/07

Cite this

@inproceedings{d6385112f0d342b69c848258e9e5be92,

title = "Multilayer flexible wiring board based on screen printed conductors",

author = "Jarno Pet{\"a}j{\"a} and Kari Kautio and H. Funck and Mikko Karppinen and Pentti Karioja and R. Vatanparast",

year = "2007",

language = "English",

isbn = "9781622764662",

booktitle = "16th European Microelectronics and Packaging Conference and Exhibition",

note = "16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 ; Conference date: 17-06-2007 Through 20-06-2007",

}

TY - GEN

T1 - Multilayer flexible wiring board based on screen printed conductors

AU - Petäjä, Jarno

AU - Kautio, Kari

AU - Funck, H.

AU - Karppinen, Mikko

AU - Karioja, Pentti

AU - Vatanparast, R.

N1 - Conference code: 16

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 9781622764662

BT - 16th European Microelectronics and Packaging Conference and Exhibition

T2 - 16th European Microelectronics and Packaging Conference and Exhibition

Y2 - 17 June 2007 through 20 June 2007

ER -