Multilayer plastic substrate for electronics

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

This work demonstrates the making of four-layer wiring design on a flexible plastic substrate by laminating together individual printed sheets. Overmolding of the device into plastic is also experimented. In printed electronics, multilayer wiring is often avoided because of the technological difficulties in making several conductor layers. Yet many electrical designs require multiple layers and are therefore out of reach for printed and plastic electronics. In this work, multilayer wiring in the form of four-layer laminated structure was studied. Via filling in plastic foils was studied with different silver based pastes and it was found that most pastes fill vias well while simultaneously printing the wiring. Method for making multilayer boards by laminating polymer sheets together was explored by testing a range of plastic materials for their lamination adhesion and then producing a test structure on polyethylene terephthalate (PET) with wiring running through the substrate. Finally, this demo device with LED components was overmolded with thermoplastic polyurethane (TPU) to form a sealed structure with integrated lenses for LEDs. The final structure is sealed, flexible and transparent, which is desirable for example in display applications.
Original languageEnglish
Title of host publication2018 7th Electronic System-Integration Technology Conference (ESTC)
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1-6
ISBN (Electronic)978-1-5386-6814-6, 978-1-5386-6813-9
ISBN (Print)978-1-5386-6815-3
DOIs
Publication statusPublished - 29 Nov 2018
MoE publication typeNot Eligible
Event7th Electronic System-Integration Technology Conference, ESTC 2018 - Westin Bellevue Hotel and Conference Center Dresden, Dresden, Germany
Duration: 18 Sep 201821 Sep 2018
Conference number: 7

Conference

Conference7th Electronic System-Integration Technology Conference, ESTC 2018
Abbreviated titleESTC 2018
CountryGermany
CityDresden
Period18/09/1821/09/18

Fingerprint

Electric wiring
Multilayers
Electronic equipment
Plastics
Substrates
Laminating
Light emitting diodes
Adhesive pastes
Printed circuit boards
Polyethylene terephthalates
Metal foil
Thermoplastics
Polyurethanes
Printing
Lenses
Silver
Adhesion
Display devices
Testing
Polymers

Keywords

  • Substrates
  • Lamination
  • Plastics
  • Printing
  • Filling

Cite this

Huttunen, A., Kurkela, T., Väisänen, K-L., & Juntunen, E. (2018). Multilayer plastic substrate for electronics. In 2018 7th Electronic System-Integration Technology Conference (ESTC) (pp. 1-6). [8546335] IEEE Institute of Electrical and Electronic Engineers . https://doi.org/10.1109/ESTC.2018.8546335
Huttunen, Arttu ; Kurkela, Timo ; Väisänen, Kaisa-Leena ; Juntunen, Eveliina. / Multilayer plastic substrate for electronics. 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers , 2018. pp. 1-6
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Huttunen, A, Kurkela, T, Väisänen, K-L & Juntunen, E 2018, Multilayer plastic substrate for electronics. in 2018 7th Electronic System-Integration Technology Conference (ESTC)., 8546335, IEEE Institute of Electrical and Electronic Engineers , pp. 1-6, 7th Electronic System-Integration Technology Conference, ESTC 2018, Dresden, Germany, 18/09/18. https://doi.org/10.1109/ESTC.2018.8546335

Multilayer plastic substrate for electronics. / Huttunen, Arttu; Kurkela, Timo; Väisänen, Kaisa-Leena; Juntunen, Eveliina.

2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers , 2018. p. 1-6 8546335.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Huttunen A, Kurkela T, Väisänen K-L, Juntunen E. Multilayer plastic substrate for electronics. In 2018 7th Electronic System-Integration Technology Conference (ESTC). IEEE Institute of Electrical and Electronic Engineers . 2018. p. 1-6. 8546335 https://doi.org/10.1109/ESTC.2018.8546335