Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

Pai Lu, Per A. Ohlckers, Lutz Müller, Steffen Leopold, Martin J. F. Hoffmann, Kestutis Grigoras, Jouni Ahopelto, Mika Prunnila, Xuyuan Chen

    Research output: Contribution to journalArticleScientificpeer-review

    27 Citations (Scopus)

    Abstract

    We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.
    Original languageEnglish
    Pages (from-to)51-55
    JournalElectrochemistry Communications
    Volume70
    DOIs
    Publication statusPublished - 2016
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Titanium nitride
    Silicon
    Nanorods
    Coatings
    Electrodes
    Atomic layer deposition
    Reactive ion etching
    Scaffolds
    Aspect ratio
    Capacitance
    Supercapacitor
    titanium nitride

    Keywords

    • aspect ratio
    • atomic layer deposition
    • electrodes
    • reactive ion etching
    • scaffolds
    • silicon
    • titanium compounds
    • titanium nitride
    • deep reactive Ion etching
    • DRIE
    • nano films
    • nano-rod arrays
    • super capacitor
    • supercapacitor electrodes
    • tin film electrodes
    • titanium nitride coating

    Cite this

    Lu, Pai ; Ohlckers, Per A. ; Müller, Lutz ; Leopold, Steffen ; Hoffmann, Martin J. F. ; Grigoras, Kestutis ; Ahopelto, Jouni ; Prunnila, Mika ; Chen, Xuyuan. / Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors. In: Electrochemistry Communications. 2016 ; Vol. 70. pp. 51-55.
    @article{12c52c56880c4713ad8e17b2b1ba6a34,
    title = "Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors",
    abstract = "We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.",
    keywords = "aspect ratio, atomic layer deposition, electrodes, reactive ion etching, scaffolds, silicon, titanium compounds, titanium nitride, deep reactive Ion etching, DRIE, nano films, nano-rod arrays, super capacitor, supercapacitor electrodes, tin film electrodes, titanium nitride coating",
    author = "Pai Lu and Ohlckers, {Per A.} and Lutz M{\"u}ller and Steffen Leopold and Hoffmann, {Martin J. F.} and Kestutis Grigoras and Jouni Ahopelto and Mika Prunnila and Xuyuan Chen",
    year = "2016",
    doi = "10.1016/j.elecom.2016.07.002",
    language = "English",
    volume = "70",
    pages = "51--55",
    journal = "Electrochemistry Communications",
    issn = "1388-2481",
    publisher = "Elsevier",

    }

    Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors. / Lu, Pai; Ohlckers, Per A.; Müller, Lutz; Leopold, Steffen; Hoffmann, Martin J. F.; Grigoras, Kestutis; Ahopelto, Jouni; Prunnila, Mika; Chen, Xuyuan.

    In: Electrochemistry Communications, Vol. 70, 2016, p. 51-55.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

    AU - Lu, Pai

    AU - Ohlckers, Per A.

    AU - Müller, Lutz

    AU - Leopold, Steffen

    AU - Hoffmann, Martin J. F.

    AU - Grigoras, Kestutis

    AU - Ahopelto, Jouni

    AU - Prunnila, Mika

    AU - Chen, Xuyuan

    PY - 2016

    Y1 - 2016

    N2 - We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.

    AB - We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.

    KW - aspect ratio

    KW - atomic layer deposition

    KW - electrodes

    KW - reactive ion etching

    KW - scaffolds

    KW - silicon

    KW - titanium compounds

    KW - titanium nitride

    KW - deep reactive Ion etching

    KW - DRIE

    KW - nano films

    KW - nano-rod arrays

    KW - super capacitor

    KW - supercapacitor electrodes

    KW - tin film electrodes

    KW - titanium nitride coating

    U2 - 10.1016/j.elecom.2016.07.002

    DO - 10.1016/j.elecom.2016.07.002

    M3 - Article

    VL - 70

    SP - 51

    EP - 55

    JO - Electrochemistry Communications

    JF - Electrochemistry Communications

    SN - 1388-2481

    ER -