Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

Pai Lu, Per A. Ohlckers, Lutz Müller, Steffen Leopold, Martin J. F. Hoffmann, Kestutis Grigoras, Jouni Ahopelto, Mika Prunnila, Xuyuan Chen

Research output: Contribution to journalArticleScientificpeer-review

23 Citations (Scopus)

Abstract

We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.
Original languageEnglish
Pages (from-to)51-55
JournalElectrochemistry Communications
Volume70
DOIs
Publication statusPublished - 2016
MoE publication typeA1 Journal article-refereed

Fingerprint

Titanium nitride
Silicon
Nanorods
Coatings
Electrodes
Atomic layer deposition
Reactive ion etching
Scaffolds
Aspect ratio
Capacitance
Supercapacitor
titanium nitride

Keywords

  • aspect ratio
  • atomic layer deposition
  • electrodes
  • reactive ion etching
  • scaffolds
  • silicon
  • titanium compounds
  • titanium nitride
  • deep reactive Ion etching
  • DRIE
  • nano films
  • nano-rod arrays
  • super capacitor
  • supercapacitor electrodes
  • tin film electrodes
  • titanium nitride coating

Cite this

Lu, Pai ; Ohlckers, Per A. ; Müller, Lutz ; Leopold, Steffen ; Hoffmann, Martin J. F. ; Grigoras, Kestutis ; Ahopelto, Jouni ; Prunnila, Mika ; Chen, Xuyuan. / Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors. In: Electrochemistry Communications. 2016 ; Vol. 70. pp. 51-55.
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abstract = "We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.",
keywords = "aspect ratio, atomic layer deposition, electrodes, reactive ion etching, scaffolds, silicon, titanium compounds, titanium nitride, deep reactive Ion etching, DRIE, nano films, nano-rod arrays, super capacitor, supercapacitor electrodes, tin film electrodes, titanium nitride coating",
author = "Pai Lu and Ohlckers, {Per A.} and Lutz M{\"u}ller and Steffen Leopold and Hoffmann, {Martin J. F.} and Kestutis Grigoras and Jouni Ahopelto and Mika Prunnila and Xuyuan Chen",
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language = "English",
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Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors. / Lu, Pai; Ohlckers, Per A.; Müller, Lutz; Leopold, Steffen; Hoffmann, Martin J. F.; Grigoras, Kestutis; Ahopelto, Jouni; Prunnila, Mika; Chen, Xuyuan.

In: Electrochemistry Communications, Vol. 70, 2016, p. 51-55.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

AU - Lu, Pai

AU - Ohlckers, Per A.

AU - Müller, Lutz

AU - Leopold, Steffen

AU - Hoffmann, Martin J. F.

AU - Grigoras, Kestutis

AU - Ahopelto, Jouni

AU - Prunnila, Mika

AU - Chen, Xuyuan

PY - 2016

Y1 - 2016

N2 - We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.

AB - We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.

KW - aspect ratio

KW - atomic layer deposition

KW - electrodes

KW - reactive ion etching

KW - scaffolds

KW - silicon

KW - titanium compounds

KW - titanium nitride

KW - deep reactive Ion etching

KW - DRIE

KW - nano films

KW - nano-rod arrays

KW - super capacitor

KW - supercapacitor electrodes

KW - tin film electrodes

KW - titanium nitride coating

U2 - 10.1016/j.elecom.2016.07.002

DO - 10.1016/j.elecom.2016.07.002

M3 - Article

VL - 70

SP - 51

EP - 55

JO - Electrochemistry Communications

JF - Electrochemistry Communications

SN - 1388-2481

ER -