Nano fabricated silicon nanorod array with titanium nitride coating for on-chip supercapacitors

Pai Lu, Per A. Ohlckers, Lutz Müller, Steffen Leopold, Martin J. F. Hoffmann, Kestutis Grigoras, Jouni Ahopelto, Mika Prunnila, Xuyuan Chen

    Research output: Contribution to journalArticleScientificpeer-review

    29 Citations (Scopus)

    Abstract

    We demonstrate high aspect ratio silicon nanorod arrays by cyclic deep reactive ion etching (DRIE) process as a scaffold to enhance the energy density of a Si-based supercapacitor. By unique atomic layer deposition (ALD) technology, a conformal nanolayer of TiN was deposited on the silicon nanorod arrays as the active material. The TiN coated silicon nanorods as a supercapacitor electrode lead to a 6 times improvement in capacitance compared to flat TiN film electrode.
    Original languageEnglish
    Pages (from-to)51-55
    JournalElectrochemistry Communications
    Volume70
    DOIs
    Publication statusPublished - 2016
    MoE publication typeA1 Journal article-refereed

    Keywords

    • aspect ratio
    • atomic layer deposition
    • electrodes
    • reactive ion etching
    • scaffolds
    • silicon
    • titanium compounds
    • titanium nitride
    • deep reactive Ion etching
    • DRIE
    • nano films
    • nano-rod arrays
    • super capacitor
    • supercapacitor electrodes
    • tin film electrodes
    • titanium nitride coating

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