Nanoscale Electromechanics to Measure Thermal Conductivity, Expansion, and Interfacial Losses

John P. Mathew, Raj Patel, Abhinandan Borah, Carina B. Maliakkal, T. S. Abhilash, Mandar M. Deshmukh

Research output: Contribution to journalArticleScientificpeer-review

10 Citations (Scopus)

Abstract

We study the effect of localized Joule heating on the mechanical properties of doubly clamped nanowires under tensile stress. Local heating results in systematic variation of the resonant frequency; these frequency changes result from thermal stresses that depend on temperature dependent thermal conductivity and expansion coefficient. The change in sign of the linear expansion coefficient of InAs is reflected in the resonant response of the system near a bath temperature of 20 K. Using finite element simulations to model the experimentally observed frequency shifts, we show that the thermal conductivity of a nanowire can be approximated in the 10-60 K temperature range by the empirical form κ = bT W/mK, where the value of b for a nanowire was found to be b = 0.035 W/mK2, significantly lower than bulk values. Also, local heating allows us to independently vary the temperature of the nanowire relative to the clamping points pinned to the bath temperature. We suggest a loss mechanism (dissipation ∼10-4-10-5) originating from the interfacial clamping losses between the metal and the semiconductor nanostructure.

Original languageEnglish
Pages (from-to)7621-7626
Number of pages6
JournalNano Letters
Volume15
Issue number11
DOIs
Publication statusPublished - 11 Nov 2015
MoE publication typeA1 Journal article-refereed

Fingerprint

electromechanics
Thermal conductivity
thermal conductivity
Nanowires
nanowires
expansion
baths
Temperature
temperature
Heating
heating
Joule heating
coefficients
thermal stresses
tensile stress
Thermal stress
Tensile stress
frequency shift
Thermal expansion
resonant frequencies

Keywords

  • clamping loss
  • Nanowire resonator
  • negative thermal expansion
  • thermal conductivity

Cite this

Mathew, John P. ; Patel, Raj ; Borah, Abhinandan ; Maliakkal, Carina B. ; Abhilash, T. S. ; Deshmukh, Mandar M. / Nanoscale Electromechanics to Measure Thermal Conductivity, Expansion, and Interfacial Losses. In: Nano Letters. 2015 ; Vol. 15, No. 11. pp. 7621-7626.
@article{c9722e234bad4476907e94278a394d94,
title = "Nanoscale Electromechanics to Measure Thermal Conductivity, Expansion, and Interfacial Losses",
abstract = "We study the effect of localized Joule heating on the mechanical properties of doubly clamped nanowires under tensile stress. Local heating results in systematic variation of the resonant frequency; these frequency changes result from thermal stresses that depend on temperature dependent thermal conductivity and expansion coefficient. The change in sign of the linear expansion coefficient of InAs is reflected in the resonant response of the system near a bath temperature of 20 K. Using finite element simulations to model the experimentally observed frequency shifts, we show that the thermal conductivity of a nanowire can be approximated in the 10-60 K temperature range by the empirical form κ = bT W/mK, where the value of b for a nanowire was found to be b = 0.035 W/mK2, significantly lower than bulk values. Also, local heating allows us to independently vary the temperature of the nanowire relative to the clamping points pinned to the bath temperature. We suggest a loss mechanism (dissipation ∼10-4-10-5) originating from the interfacial clamping losses between the metal and the semiconductor nanostructure.",
keywords = "clamping loss, Nanowire resonator, negative thermal expansion, thermal conductivity",
author = "Mathew, {John P.} and Raj Patel and Abhinandan Borah and Maliakkal, {Carina B.} and Abhilash, {T. S.} and Deshmukh, {Mandar M.}",
year = "2015",
month = "11",
day = "11",
doi = "10.1021/acs.nanolett.5b03451",
language = "English",
volume = "15",
pages = "7621--7626",
journal = "Nano Letters",
issn = "1530-6984",
publisher = "American Chemical Society ACS",
number = "11",

}

Nanoscale Electromechanics to Measure Thermal Conductivity, Expansion, and Interfacial Losses. / Mathew, John P.; Patel, Raj; Borah, Abhinandan; Maliakkal, Carina B.; Abhilash, T. S.; Deshmukh, Mandar M.

In: Nano Letters, Vol. 15, No. 11, 11.11.2015, p. 7621-7626.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Nanoscale Electromechanics to Measure Thermal Conductivity, Expansion, and Interfacial Losses

AU - Mathew, John P.

AU - Patel, Raj

AU - Borah, Abhinandan

AU - Maliakkal, Carina B.

AU - Abhilash, T. S.

AU - Deshmukh, Mandar M.

PY - 2015/11/11

Y1 - 2015/11/11

N2 - We study the effect of localized Joule heating on the mechanical properties of doubly clamped nanowires under tensile stress. Local heating results in systematic variation of the resonant frequency; these frequency changes result from thermal stresses that depend on temperature dependent thermal conductivity and expansion coefficient. The change in sign of the linear expansion coefficient of InAs is reflected in the resonant response of the system near a bath temperature of 20 K. Using finite element simulations to model the experimentally observed frequency shifts, we show that the thermal conductivity of a nanowire can be approximated in the 10-60 K temperature range by the empirical form κ = bT W/mK, where the value of b for a nanowire was found to be b = 0.035 W/mK2, significantly lower than bulk values. Also, local heating allows us to independently vary the temperature of the nanowire relative to the clamping points pinned to the bath temperature. We suggest a loss mechanism (dissipation ∼10-4-10-5) originating from the interfacial clamping losses between the metal and the semiconductor nanostructure.

AB - We study the effect of localized Joule heating on the mechanical properties of doubly clamped nanowires under tensile stress. Local heating results in systematic variation of the resonant frequency; these frequency changes result from thermal stresses that depend on temperature dependent thermal conductivity and expansion coefficient. The change in sign of the linear expansion coefficient of InAs is reflected in the resonant response of the system near a bath temperature of 20 K. Using finite element simulations to model the experimentally observed frequency shifts, we show that the thermal conductivity of a nanowire can be approximated in the 10-60 K temperature range by the empirical form κ = bT W/mK, where the value of b for a nanowire was found to be b = 0.035 W/mK2, significantly lower than bulk values. Also, local heating allows us to independently vary the temperature of the nanowire relative to the clamping points pinned to the bath temperature. We suggest a loss mechanism (dissipation ∼10-4-10-5) originating from the interfacial clamping losses between the metal and the semiconductor nanostructure.

KW - clamping loss

KW - Nanowire resonator

KW - negative thermal expansion

KW - thermal conductivity

UR - http://www.scopus.com/inward/record.url?scp=84946924471&partnerID=8YFLogxK

U2 - 10.1021/acs.nanolett.5b03451

DO - 10.1021/acs.nanolett.5b03451

M3 - Article

AN - SCOPUS:84946924471

VL - 15

SP - 7621

EP - 7626

JO - Nano Letters

JF - Nano Letters

SN - 1530-6984

IS - 11

ER -