Projects per year
Abstract
Superconducting qubits in today’s quantum processing units are typically fabricated with angle-evaporated aluminum–aluminum-oxide–aluminum Josephson junctions. However, there is a need for higher yield and tighter parameter control when scaling up the number of qubits and junctions into tens of thousands and beyond. Fabrication methods based on subtractive patterning of superconductor-insulator-superconductor trilayers, used for more classical large-scale Josephson junction circuits, could provide the solution but they in turn often suffer from lossy dielectrics incompatible with high qubit coherence. In this work, we utilize native aluminum oxide as a sidewall passivation layer for junctions based on aluminum–aluminum-oxide–niobium trilayers, and use such junctions in qubits. We design the fabrication process such that the few-nanometer-thin native oxide is not exposed to oxide removal steps that could increase its defect density or hinder its ability to prevent shorting between the leads of the junction. With these junctions, we design and fabricate transmonlike qubits and measure time-averaged coherence times up to 30μs at a qubit frequency of 5 GHz, corresponding to a qubit quality factor of one million. Our process uses subtractive patterning and optical lithography on wafer scale, enabling high throughput in patterning. This approach provides a scalable path toward fabrication of superconducting qubits on industry-standard platforms.
| Original language | English |
|---|---|
| Article number | 064056 |
| Journal | Physical Review Applied |
| Volume | 24 |
| Issue number | 6 |
| DOIs | |
| Publication status | Published - Dec 2025 |
| MoE publication type | A1 Journal article-refereed |
Funding
The research was funded by the European Union’s Horizon RIA, EIC and ECSEL programmes under Grants No. 824109 European Microkelvin Platform (EMP), No. 101113086 SoCool, No. 101007322 MatQu, No. 899558 aCryComm and No. 101113983 Qu-Pilot. We also acknowledge financial support of Research Council of Finland through projects No. 322580 ETHEC, No. 356542 SUPSI, the QTF Centre of Excellence project No. 336817, and Business Finland through Quantum Technologies Industrial (QuTI) No. 128291 and Technology Industries of Finland Centennial Foundation and Chips JU project Arctic No. 101139908.
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ARCTIC: Advanced Research on Cryogenic Technologies for Innovative Computing
Tuominen, E. (CoPI)
1/04/24 → 31/03/27
Project: EU project
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SUPSI: Si-based Josephson field-effect transistors
Ronzani, A. (PI)
1/09/23 → 31/08/27
Project: Research Council of Finland
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SoCool: Solid-State Cooling Technology for Cryogenic Devices
Loreto, R. (Manager), Prunnila, M. (PI), Ronzani, A. (Participant), Viisanen, K. (Participant), Hätinen, J. (Participant), Mykkänen, E. (Participant), Rantanen, T. (Participant) & Kanniainen, T. (Participant)
1/06/23 → 31/05/26
Project: EU project