Non-destructive 3D measurement of microchannels

V. Heikkinen, A. Nolvi, I. Kassamakov, Kestutis Grigoras, S. Franssila, E Hæggström

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

Microfluidic devices allow experimentation in smaller space using small amounts of liquid, resulting in improved reaction rates, cheaper equipment, reduced amount of expensive reagents. Very precise channel shape measurements are needed to assure the designed flow pattern. Several 3D imaging devices provide the necessary precision but typically they cannot image inside closed devices. Hence it is difficult to measure the shape of a microfluidic channel without destroying it. We fabricated and investigated samples with different microchannels. Several types of microfluidic channels were prepared in silicon wafer with a subsequent covering by bonding glass wafer on top. Microchannels in polymer have been done using epoxy-type photoresist SU-8. The internal geometry of the channels was measured using a Scanning White Light Interferometer (SWLI) equipped with optics that compensates for the effects of the top glass of the channels. The geometry of the interior of the channels can be measured with a precision similar to surface layer SWLI measurements without destroying the channels.
Original languageEnglish
Title of host publicationProceedings of SPIE 8466
Subtitle of host publicationInstrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI
EditorsMichael T. Postek
PublisherInternational Society for Optics and Photonics SPIE
ISBN (Print)978-0-8194-9183-1
DOIs
Publication statusPublished - 2012
MoE publication typeNot Eligible
EventInstrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI - San Diego, United States
Duration: 13 Aug 201214 Aug 2012

Publication series

NameProceedings of SPIE
PublisherSPIE
Volume8466
ISSN (Print)0277-786X

Conference

ConferenceInstrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI
CountryUnited States
CitySan Diego
Period13/08/1214/08/12

Fingerprint

microchannels
interferometers
wafers
scanning
glass
microfluidic devices
experimentation
geometry
photoresists
reagents
surface layers
flow distribution
reaction kinetics
coverings
optics
polymers
silicon
liquids

Keywords

  • microchannels
  • multilayer
  • scanning white light interferometry

Cite this

Heikkinen, V., Nolvi, A., Kassamakov, I., Grigoras, K., Franssila, S., & Hæggström, E. (2012). Non-destructive 3D measurement of microchannels. In M. T. Postek (Ed.), Proceedings of SPIE 8466: Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI [84660R] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 8466 https://doi.org/10.1117/12.930080
Heikkinen, V. ; Nolvi, A. ; Kassamakov, I. ; Grigoras, Kestutis ; Franssila, S. ; Hæggström, E. / Non-destructive 3D measurement of microchannels. Proceedings of SPIE 8466: Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI. editor / Michael T. Postek. International Society for Optics and Photonics SPIE, 2012. (Proceedings of SPIE, Vol. 8466).
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Heikkinen, V, Nolvi, A, Kassamakov, I, Grigoras, K, Franssila, S & Hæggström, E 2012, Non-destructive 3D measurement of microchannels. in MT Postek (ed.), Proceedings of SPIE 8466: Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI., 84660R, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 8466, Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI, San Diego, United States, 13/08/12. https://doi.org/10.1117/12.930080

Non-destructive 3D measurement of microchannels. / Heikkinen, V.; Nolvi, A.; Kassamakov, I.; Grigoras, Kestutis; Franssila, S.; Hæggström, E.

Proceedings of SPIE 8466: Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI. ed. / Michael T. Postek. International Society for Optics and Photonics SPIE, 2012. 84660R (Proceedings of SPIE, Vol. 8466).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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Heikkinen V, Nolvi A, Kassamakov I, Grigoras K, Franssila S, Hæggström E. Non-destructive 3D measurement of microchannels. In Postek MT, editor, Proceedings of SPIE 8466: Instrumentation, Metrology, and Standards for Nanomanufacturing, Optics, and Semiconductors VI. International Society for Optics and Photonics SPIE. 2012. 84660R. (Proceedings of SPIE, Vol. 8466). https://doi.org/10.1117/12.930080