Non-destructive piezoelectric characterisation of Sc doped aluminium nitride thin films at wafer level

  • Stefan Mertin
  • , Clemens Nyffeler
  • , Tapani Makkonen
  • , Bernd Heinz
  • , Andrea Mazzalai
  • , Thorsten Schmitz-Kempen
  • , Stephan Tiedke
  • , Tuomas Pensala
  • , Paul Muralt

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    12 Citations (Scopus)

    Abstract

    Scandium doped aluminium nitride (ScAlN) gained much attention during last years, since its piezoelectric response is much enlarged as compared to pure AlN films. Above 30% Sc the films are of high interest for piezoMEMS sensing and actuation, ultrasound generation, as well as energy harvesting applications. In this work, piezo-performance uniformity maps are presented for 20% and 33% Sc containing films, sputter deposited on 200-mm wafers. Furthermore, we employ a new method to determine the electro-mechanical coupling k t 2 . Coupling results for various Sc/(Sc+Al) concentration (0, 6, 20, 26, 33%) are shown. In addition, the dielectric constant ε r and dielectric loss tanδ, and the transversal and the longitudinal piezoelectric coefficients, e 31,f and d 33,f , were measured. The wafers show a high with-in-wafer uniformity (1s uniformity < 2% for Sc 20 Al 80 N and < 1% for Sc 33 Al 67 N). The highest coupling k t 2 = 21.2% was achieved for a 33% Sc film. The presented Al–Sc property–uniformity maps provide a good foundation for ScAlN based MEMS device design and manufacturing.
    Original languageEnglish
    Title of host publication2019 IEEE International Ultrasonics Symposium, IUS 2019
    PublisherIEEE Institute of Electrical and Electronic Engineers
    Pages2592-2595
    Number of pages4
    ISBN (Electronic)978-1-7281-4596-9, 978-1-7281-4596-9
    ISBN (Print)978-1-7281-4597-6
    DOIs
    Publication statusPublished - Oct 2019
    MoE publication typeA4 Article in a conference publication
    Event2019 IEEE International Ultrasonics Symposium, IUS 2019 - Glasgow, United Kingdom
    Duration: 6 Oct 20199 Oct 2019

    Conference

    Conference2019 IEEE International Ultrasonics Symposium, IUS 2019
    Country/TerritoryUnited Kingdom
    CityGlasgow
    Period6/10/199/10/19

    Keywords

    • OtaNano

    Fingerprint

    Dive into the research topics of 'Non-destructive piezoelectric characterisation of Sc doped aluminium nitride thin films at wafer level'. Together they form a unique fingerprint.

    Cite this