Nondestructive inspection of buried channels and cavities in silicon

I. Kassamakov, Kestutis Grigoras, V. Heikkinen, K. Hanhijärvi, J. Aaltonen, S. Franssila, E. Haeggstrom

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)

    Abstract

    Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.
    Original languageEnglish
    Pages (from-to)438-442
    Number of pages5
    JournalJournal of Microelectromechanical Systems
    Volume22
    Issue number2
    DOIs
    Publication statusPublished - 2013
    MoE publication typeA1 Journal article-refereed

    Keywords

    • infrared imaging
    • microelectromechanical systems
    • optical interferometry
    • thickness measurement

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