Nondestructive inspection of buried channels and cavities in silicon

I. Kassamakov, Kestutis Grigoras, V. Heikkinen, K. Hanhijärvi, J. Aaltonen, S. Franssila, E. Haeggstrom

Research output: Contribution to journalArticleScientificpeer-review

4 Citations (Scopus)

Abstract

Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.
Original languageEnglish
Pages (from-to)438-442
Number of pages5
JournalJournal of Microelectromechanical Systems
Volume22
Issue number2
DOIs
Publication statusPublished - 2013
MoE publication typeA1 Journal article-refereed

Fingerprint

Microchannels
Inspection
Silicon
Microfluidics
Interferometry
Roofs
MEMS
Surface properties
Infrared radiation
Imaging techniques
Microstructure

Keywords

  • infrared imaging
  • microelectromechanical systems
  • optical interferometry
  • thickness measurement

Cite this

Kassamakov, I., Grigoras, K., Heikkinen, V., Hanhijärvi, K., Aaltonen, J., Franssila, S., & Haeggstrom, E. (2013). Nondestructive inspection of buried channels and cavities in silicon. Journal of Microelectromechanical Systems, 22(2), 438-442. https://doi.org/10.1109/JMEMS.2012.2227460
Kassamakov, I. ; Grigoras, Kestutis ; Heikkinen, V. ; Hanhijärvi, K. ; Aaltonen, J. ; Franssila, S. ; Haeggstrom, E. / Nondestructive inspection of buried channels and cavities in silicon. In: Journal of Microelectromechanical Systems. 2013 ; Vol. 22, No. 2. pp. 438-442.
@article{a705e5d14a6f4e13b10886464a03c264,
title = "Nondestructive inspection of buried channels and cavities in silicon",
abstract = "Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.",
keywords = "infrared imaging, microelectromechanical systems, optical interferometry, thickness measurement",
author = "I. Kassamakov and Kestutis Grigoras and V. Heikkinen and K. Hanhij{\"a}rvi and J. Aaltonen and S. Franssila and E. Haeggstrom",
year = "2013",
doi = "10.1109/JMEMS.2012.2227460",
language = "English",
volume = "22",
pages = "438--442",
journal = "Journal of Microelectromechanical Systems",
issn = "1057-7157",
publisher = "Wiley",
number = "2",

}

Kassamakov, I, Grigoras, K, Heikkinen, V, Hanhijärvi, K, Aaltonen, J, Franssila, S & Haeggstrom, E 2013, 'Nondestructive inspection of buried channels and cavities in silicon', Journal of Microelectromechanical Systems, vol. 22, no. 2, pp. 438-442. https://doi.org/10.1109/JMEMS.2012.2227460

Nondestructive inspection of buried channels and cavities in silicon. / Kassamakov, I.; Grigoras, Kestutis; Heikkinen, V.; Hanhijärvi, K.; Aaltonen, J.; Franssila, S.; Haeggstrom, E.

In: Journal of Microelectromechanical Systems, Vol. 22, No. 2, 2013, p. 438-442.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Nondestructive inspection of buried channels and cavities in silicon

AU - Kassamakov, I.

AU - Grigoras, Kestutis

AU - Heikkinen, V.

AU - Hanhijärvi, K.

AU - Aaltonen, J.

AU - Franssila, S.

AU - Haeggstrom, E.

PY - 2013

Y1 - 2013

N2 - Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.

AB - Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.

KW - infrared imaging

KW - microelectromechanical systems

KW - optical interferometry

KW - thickness measurement

U2 - 10.1109/JMEMS.2012.2227460

DO - 10.1109/JMEMS.2012.2227460

M3 - Article

VL - 22

SP - 438

EP - 442

JO - Journal of Microelectromechanical Systems

JF - Journal of Microelectromechanical Systems

SN - 1057-7157

IS - 2

ER -