Nondestructive inspection of buried channels and cavities in silicon

I. Kassamakov, Kestutis Grigoras, V. Heikkinen, K. Hanhijärvi, J. Aaltonen, S. Franssila, E. Haeggstrom

    Research output: Contribution to journalArticleScientificpeer-review

    4 Citations (Scopus)

    Abstract

    Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.
    Original languageEnglish
    Pages (from-to)438-442
    Number of pages5
    JournalJournal of Microelectromechanical Systems
    Volume22
    Issue number2
    DOIs
    Publication statusPublished - 2013
    MoE publication typeA1 Journal article-refereed

    Fingerprint

    Microchannels
    Inspection
    Silicon
    Microfluidics
    Interferometry
    Roofs
    MEMS
    Surface properties
    Infrared radiation
    Imaging techniques
    Microstructure

    Keywords

    • infrared imaging
    • microelectromechanical systems
    • optical interferometry
    • thickness measurement

    Cite this

    Kassamakov, I., Grigoras, K., Heikkinen, V., Hanhijärvi, K., Aaltonen, J., Franssila, S., & Haeggstrom, E. (2013). Nondestructive inspection of buried channels and cavities in silicon. Journal of Microelectromechanical Systems, 22(2), 438-442. https://doi.org/10.1109/JMEMS.2012.2227460
    Kassamakov, I. ; Grigoras, Kestutis ; Heikkinen, V. ; Hanhijärvi, K. ; Aaltonen, J. ; Franssila, S. ; Haeggstrom, E. / Nondestructive inspection of buried channels and cavities in silicon. In: Journal of Microelectromechanical Systems. 2013 ; Vol. 22, No. 2. pp. 438-442.
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    abstract = "Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.",
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    author = "I. Kassamakov and Kestutis Grigoras and V. Heikkinen and K. Hanhij{\"a}rvi and J. Aaltonen and S. Franssila and E. Haeggstrom",
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    Kassamakov, I, Grigoras, K, Heikkinen, V, Hanhijärvi, K, Aaltonen, J, Franssila, S & Haeggstrom, E 2013, 'Nondestructive inspection of buried channels and cavities in silicon', Journal of Microelectromechanical Systems, vol. 22, no. 2, pp. 438-442. https://doi.org/10.1109/JMEMS.2012.2227460

    Nondestructive inspection of buried channels and cavities in silicon. / Kassamakov, I.; Grigoras, Kestutis; Heikkinen, V.; Hanhijärvi, K.; Aaltonen, J.; Franssila, S.; Haeggstrom, E.

    In: Journal of Microelectromechanical Systems, Vol. 22, No. 2, 2013, p. 438-442.

    Research output: Contribution to journalArticleScientificpeer-review

    TY - JOUR

    T1 - Nondestructive inspection of buried channels and cavities in silicon

    AU - Kassamakov, I.

    AU - Grigoras, Kestutis

    AU - Heikkinen, V.

    AU - Hanhijärvi, K.

    AU - Aaltonen, J.

    AU - Franssila, S.

    AU - Haeggstrom, E.

    PY - 2013

    Y1 - 2013

    N2 - Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.

    AB - Microelectromechanical systems and microfluidic devices feature buried channels, cavities, and other embedded microstructures. These features are usually examined by breaking the wafer and by imaging the revealed cross section. We propose a nondestructive technique to evaluate the shape and surface quality of buried microchannels with submicrometer resolution. The technique relies on infrared light interferometry. We employed the technique to nondestructively examine channels and cavities through a silicon roof. With the proposed technique, we can quantitatively examine the size and shape of microchannels that are hidden to visible light.

    KW - infrared imaging

    KW - microelectromechanical systems

    KW - optical interferometry

    KW - thickness measurement

    U2 - 10.1109/JMEMS.2012.2227460

    DO - 10.1109/JMEMS.2012.2227460

    M3 - Article

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    SP - 438

    EP - 442

    JO - Journal of Microelectromechanical Systems

    JF - Journal of Microelectromechanical Systems

    SN - 1057-7157

    IS - 2

    ER -