Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate

Esa Kunnari, Mikko Karttunen, Tero Kumpulainen, Satu Kortet, Teija Laine-Ma, Matti Mäntysalo, Matti Smalen, Pekka Ruuskanen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Abstract

Printed electronics is considered one of the emerging technologies in electronics manufacturing and packaging industry. Utilization of inkjet printing has been studied at Tampere University of Technology in cooperation with the Technical Research Centre of Finland (VTT). The target of this project was to manufacture an existing application by substituting traditional manufacturing processes and materials with additive inkjet printing and a novel polymer substrate. The substrate material was developed by VTT. The base material of the test substrates was a new high temperature thermoplastic Polyphenylenesulphide (PPS) - Polyphenylene oxide (PPO) compound. This compound has a good wide-ranging property profile for electrical applications, e.g., low dielectric permittivity and dielectric losses, high modulus at elevated temperatures and a low melt viscosity suitable for injection moulding. The surface energy of the substrates was increased by a corona treatment. The designed application includes unique features in terms of additive electronics manufacturing solutions. Laser ablation is used to create vias through the polymer substrate. While multilayer structures can be created by printing a dielectric layer between two conductive layers, in this case another approach was preferred. Vias were made through the substrate to use both sides of the substrate instead of printed multilayer structures. All interconnections are inkjet printed using inorganic silver nano ink. Isotropically conductive adhesive was used to create electrical paths through the vias as well as to attach discrete components to the substrate. This study discusses both benefits and challenges of the additive approach and novel substrate material use in specific application manufacturing.
Original languageEnglish
Title of host publicationProceedings
Subtitle of host publicationInternational Conference on Electronics Packaging, ICEP2010
Pages249-254
Publication statusPublished - 2010
MoE publication typeB3 Non-refereed article in conference proceedings
EventInternational Conference on Electronic Packaging, ICEP2010 - Hokkaido, Japan
Duration: 12 May 201014 May 2010

Conference

ConferenceInternational Conference on Electronic Packaging, ICEP2010
Abbreviated titleICEP 2010
CountryJapan
CityHokkaido
Period12/05/1014/05/10

Fingerprint

Laser ablation
Printing
Polymers
Substrates
Electronic equipment
Multilayers
Polyphenylene oxides
Dielectric losses
Interfacial energy
Ink
Injection molding
Thermoplastics
Adhesives
Packaging
Silver
Permittivity
Viscosity
Temperature

Cite this

Kunnari, E., Karttunen, M., Kumpulainen, T., Kortet, S., Laine-Ma, T., Mäntysalo, M., ... Ruuskanen, P. (2010). Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate. In Proceedings: International Conference on Electronics Packaging, ICEP2010 (pp. 249-254)
Kunnari, Esa ; Karttunen, Mikko ; Kumpulainen, Tero ; Kortet, Satu ; Laine-Ma, Teija ; Mäntysalo, Matti ; Smalen, Matti ; Ruuskanen, Pekka. / Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate. Proceedings: International Conference on Electronics Packaging, ICEP2010. 2010. pp. 249-254
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abstract = "Printed electronics is considered one of the emerging technologies in electronics manufacturing and packaging industry. Utilization of inkjet printing has been studied at Tampere University of Technology in cooperation with the Technical Research Centre of Finland (VTT). The target of this project was to manufacture an existing application by substituting traditional manufacturing processes and materials with additive inkjet printing and a novel polymer substrate. The substrate material was developed by VTT. The base material of the test substrates was a new high temperature thermoplastic Polyphenylenesulphide (PPS) - Polyphenylene oxide (PPO) compound. This compound has a good wide-ranging property profile for electrical applications, e.g., low dielectric permittivity and dielectric losses, high modulus at elevated temperatures and a low melt viscosity suitable for injection moulding. The surface energy of the substrates was increased by a corona treatment. The designed application includes unique features in terms of additive electronics manufacturing solutions. Laser ablation is used to create vias through the polymer substrate. While multilayer structures can be created by printing a dielectric layer between two conductive layers, in this case another approach was preferred. Vias were made through the substrate to use both sides of the substrate instead of printed multilayer structures. All interconnections are inkjet printed using inorganic silver nano ink. Isotropically conductive adhesive was used to create electrical paths through the vias as well as to attach discrete components to the substrate. This study discusses both benefits and challenges of the additive approach and novel substrate material use in specific application manufacturing.",
author = "Esa Kunnari and Mikko Karttunen and Tero Kumpulainen and Satu Kortet and Teija Laine-Ma and Matti M{\"a}ntysalo and Matti Smalen and Pekka Ruuskanen",
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Kunnari, E, Karttunen, M, Kumpulainen, T, Kortet, S, Laine-Ma, T, Mäntysalo, M, Smalen, M & Ruuskanen, P 2010, Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate. in Proceedings: International Conference on Electronics Packaging, ICEP2010. pp. 249-254, International Conference on Electronic Packaging, ICEP2010, Hokkaido, Japan, 12/05/10.

Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate. / Kunnari, Esa; Karttunen, Mikko; Kumpulainen, Tero; Kortet, Satu; Laine-Ma, Teija; Mäntysalo, Matti; Smalen, Matti; Ruuskanen, Pekka.

Proceedings: International Conference on Electronics Packaging, ICEP2010. 2010. p. 249-254.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

TY - GEN

T1 - Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate

AU - Kunnari, Esa

AU - Karttunen, Mikko

AU - Kumpulainen, Tero

AU - Kortet, Satu

AU - Laine-Ma, Teija

AU - Mäntysalo, Matti

AU - Smalen, Matti

AU - Ruuskanen, Pekka

PY - 2010

Y1 - 2010

N2 - Printed electronics is considered one of the emerging technologies in electronics manufacturing and packaging industry. Utilization of inkjet printing has been studied at Tampere University of Technology in cooperation with the Technical Research Centre of Finland (VTT). The target of this project was to manufacture an existing application by substituting traditional manufacturing processes and materials with additive inkjet printing and a novel polymer substrate. The substrate material was developed by VTT. The base material of the test substrates was a new high temperature thermoplastic Polyphenylenesulphide (PPS) - Polyphenylene oxide (PPO) compound. This compound has a good wide-ranging property profile for electrical applications, e.g., low dielectric permittivity and dielectric losses, high modulus at elevated temperatures and a low melt viscosity suitable for injection moulding. The surface energy of the substrates was increased by a corona treatment. The designed application includes unique features in terms of additive electronics manufacturing solutions. Laser ablation is used to create vias through the polymer substrate. While multilayer structures can be created by printing a dielectric layer between two conductive layers, in this case another approach was preferred. Vias were made through the substrate to use both sides of the substrate instead of printed multilayer structures. All interconnections are inkjet printed using inorganic silver nano ink. Isotropically conductive adhesive was used to create electrical paths through the vias as well as to attach discrete components to the substrate. This study discusses both benefits and challenges of the additive approach and novel substrate material use in specific application manufacturing.

AB - Printed electronics is considered one of the emerging technologies in electronics manufacturing and packaging industry. Utilization of inkjet printing has been studied at Tampere University of Technology in cooperation with the Technical Research Centre of Finland (VTT). The target of this project was to manufacture an existing application by substituting traditional manufacturing processes and materials with additive inkjet printing and a novel polymer substrate. The substrate material was developed by VTT. The base material of the test substrates was a new high temperature thermoplastic Polyphenylenesulphide (PPS) - Polyphenylene oxide (PPO) compound. This compound has a good wide-ranging property profile for electrical applications, e.g., low dielectric permittivity and dielectric losses, high modulus at elevated temperatures and a low melt viscosity suitable for injection moulding. The surface energy of the substrates was increased by a corona treatment. The designed application includes unique features in terms of additive electronics manufacturing solutions. Laser ablation is used to create vias through the polymer substrate. While multilayer structures can be created by printing a dielectric layer between two conductive layers, in this case another approach was preferred. Vias were made through the substrate to use both sides of the substrate instead of printed multilayer structures. All interconnections are inkjet printed using inorganic silver nano ink. Isotropically conductive adhesive was used to create electrical paths through the vias as well as to attach discrete components to the substrate. This study discusses both benefits and challenges of the additive approach and novel substrate material use in specific application manufacturing.

M3 - Conference article in proceedings

SP - 249

EP - 254

BT - Proceedings

ER -

Kunnari E, Karttunen M, Kumpulainen T, Kortet S, Laine-Ma T, Mäntysalo M et al. Novel Approach on Application Manufacturing Using Inkjet Printing, Laser Ablation and New Polymer Substrate. In Proceedings: International Conference on Electronics Packaging, ICEP2010. 2010. p. 249-254