Novel thermoplastic polymers with improved release properties for thermal NIL

H. Atasoy (Corresponding Author), M. Vogler, Tomi Haatainen, A. Schleunitz, D. Jarzabek, H. Schift, F. Reuther, G. Gruetzner, Z. Rymuza

Research output: Contribution to journalArticleScientificpeer-review

12 Citations (Scopus)

Abstract

In the nanoimprint lithography (NIL) process the mould release is a limiting step. Regardless of the carefully designed special properties a resist may have, it has to come over this challenging process step to be employed in a NIL process. Generally, the moulds are coated with anti-sticking layers. Here, an alternative solution is developed by modification of two well-established NIL polymers through integration of fluorinated additives in their formulation. An effective additive concentration window was successfully defined, in which the substrate adhesion and imprint behaviour is not influenced. Defect-free patterning down to 30 nm is possible. A release force reduction of about 40% was observed with the modified polymer mr-I 7000R compared to the unmodified original.
Original languageEnglish
Pages (from-to)1902-1905
Number of pages4
JournalMicroelectronic Engineering
Volume88
Issue number8
DOIs
Publication statusPublished - 2011
MoE publication typeA1 Journal article-refereed
Event36th International Conference on Micro- and Nano-Engineering, MNE 2010 - Genoa, Italy
Duration: 19 Sep 201022 Sep 2010

Fingerprint

Nanoimprint lithography
Thermoplastics
Polymers
lithography
polymers
adhesion
Adhesion
formulations
Defects
defects
Substrates
Hot Temperature

Keywords

  • NIL polymers
  • fluorinated additives
  • release forces

Cite this

Atasoy, H., Vogler, M., Haatainen, T., Schleunitz, A., Jarzabek, D., Schift, H., ... Rymuza, Z. (2011). Novel thermoplastic polymers with improved release properties for thermal NIL. Microelectronic Engineering, 88(8), 1902-1905. https://doi.org/10.1016/j.mee.2011.01.080
Atasoy, H. ; Vogler, M. ; Haatainen, Tomi ; Schleunitz, A. ; Jarzabek, D. ; Schift, H. ; Reuther, F. ; Gruetzner, G. ; Rymuza, Z. / Novel thermoplastic polymers with improved release properties for thermal NIL. In: Microelectronic Engineering. 2011 ; Vol. 88, No. 8. pp. 1902-1905.
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Atasoy, H, Vogler, M, Haatainen, T, Schleunitz, A, Jarzabek, D, Schift, H, Reuther, F, Gruetzner, G & Rymuza, Z 2011, 'Novel thermoplastic polymers with improved release properties for thermal NIL', Microelectronic Engineering, vol. 88, no. 8, pp. 1902-1905. https://doi.org/10.1016/j.mee.2011.01.080

Novel thermoplastic polymers with improved release properties for thermal NIL. / Atasoy, H. (Corresponding Author); Vogler, M.; Haatainen, Tomi; Schleunitz, A.; Jarzabek, D.; Schift, H.; Reuther, F.; Gruetzner, G.; Rymuza, Z.

In: Microelectronic Engineering, Vol. 88, No. 8, 2011, p. 1902-1905.

Research output: Contribution to journalArticleScientificpeer-review

TY - JOUR

T1 - Novel thermoplastic polymers with improved release properties for thermal NIL

AU - Atasoy, H.

AU - Vogler, M.

AU - Haatainen, Tomi

AU - Schleunitz, A.

AU - Jarzabek, D.

AU - Schift, H.

AU - Reuther, F.

AU - Gruetzner, G.

AU - Rymuza, Z.

PY - 2011

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AB - In the nanoimprint lithography (NIL) process the mould release is a limiting step. Regardless of the carefully designed special properties a resist may have, it has to come over this challenging process step to be employed in a NIL process. Generally, the moulds are coated with anti-sticking layers. Here, an alternative solution is developed by modification of two well-established NIL polymers through integration of fluorinated additives in their formulation. An effective additive concentration window was successfully defined, in which the substrate adhesion and imprint behaviour is not influenced. Defect-free patterning down to 30 nm is possible. A release force reduction of about 40% was observed with the modified polymer mr-I 7000R compared to the unmodified original.

KW - NIL polymers

KW - fluorinated additives

KW - release forces

U2 - 10.1016/j.mee.2011.01.080

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JO - Microelectronic Engineering

JF - Microelectronic Engineering

SN - 0167-9317

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