Abstract
In the nanoimprint lithography (NIL) process the mould release is a
limiting step. Regardless of the carefully designed special properties a
resist may have, it has to come over this challenging process step to
be employed in a NIL process. Generally, the moulds are coated with
anti-sticking layers. Here, an alternative solution is developed by
modification of two well-established NIL polymers through integration of
fluorinated additives in their formulation. An effective additive
concentration window was successfully defined, in which the substrate
adhesion and imprint behaviour is not influenced. Defect-free patterning
down to 30 nm is possible. A release force reduction of about 40% was
observed with the modified polymer mr-I 7000R compared to the unmodified
original.
Original language | English |
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Pages (from-to) | 1902-1905 |
Number of pages | 4 |
Journal | Microelectronic Engineering |
Volume | 88 |
Issue number | 8 |
DOIs | |
Publication status | Published - 2011 |
MoE publication type | A1 Journal article-refereed |
Event | 36th International Conference on Micro- and Nano-Engineering, MNE 2010 - Genoa, Italy Duration: 19 Sept 2010 → 22 Sept 2010 |
Keywords
- NIL polymers
- fluorinated additives
- release forces