Novel thermoplastic polymers with improved release properties for thermal NIL

H. Atasoy (Corresponding Author), M. Vogler, Tomi Haatainen, A. Schleunitz, D. Jarzabek, H. Schift, F. Reuther, G. Gruetzner, Z. Rymuza

    Research output: Contribution to journalArticleScientificpeer-review

    14 Citations (Scopus)


    In the nanoimprint lithography (NIL) process the mould release is a limiting step. Regardless of the carefully designed special properties a resist may have, it has to come over this challenging process step to be employed in a NIL process. Generally, the moulds are coated with anti-sticking layers. Here, an alternative solution is developed by modification of two well-established NIL polymers through integration of fluorinated additives in their formulation. An effective additive concentration window was successfully defined, in which the substrate adhesion and imprint behaviour is not influenced. Defect-free patterning down to 30 nm is possible. A release force reduction of about 40% was observed with the modified polymer mr-I 7000R compared to the unmodified original.
    Original languageEnglish
    Pages (from-to)1902-1905
    Number of pages4
    JournalMicroelectronic Engineering
    Issue number8
    Publication statusPublished - 2011
    MoE publication typeA1 Journal article-refereed
    Event36th International Conference on Micro- and Nano-Engineering, MNE 2010 - Genoa, Italy
    Duration: 19 Sept 201022 Sept 2010


    • NIL polymers
    • fluorinated additives
    • release forces


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