Numerically analysed applications of transparent insulations

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    Abstract

    Numerical simulation model TCCC2D (Transient Coupled Convection and Conduction in 2-Dimensions) has been used to study the thermal behaviour of building structures with and without transparent thermal insluations.
    Original languageEnglish
    Title of host publicationFourth International Workshop on Transparent Insulation Technology
    Subtitle of host publicationProceedings
    EditorsLeslie F. Jesch
    Place of PublicationBirmingham
    Pages111-114
    Publication statusPublished - 1991
    MoE publication typeA4 Article in a conference publication
    Event4th International Workshop on Transparent Insulation Technology (T14) - Birmingham, United Kingdom
    Duration: 28 May 199130 May 1991

    Workshop

    Workshop4th International Workshop on Transparent Insulation Technology (T14)
    CountryUnited Kingdom
    CityBirmingham
    Period28/05/9130/05/91

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  • Cite this

    Ojanen, T. (1991). Numerically analysed applications of transparent insulations. In L. F. Jesch (Ed.), Fourth International Workshop on Transparent Insulation Technology: Proceedings (pp. 111-114). https://www.aivc.org/resource/numerically-analysed-applications-transparent-insulations