Projects per year
Abstract
Circuit-based quantum devices rely on keeping electrons at millikelvin temperatures. Improved coherence and sensitivity as well as discovering new physical phenomena motivate pursuing ever lower electron temperatures, accessible using on-chip cooling techniques. Here we show that a two-dimensional electron gas (2DEG), with the sub-band populations manipulated using gate voltages, works as an on-chip cooler only limited by a fundamental phonon heat leak. The 2DEG can, for example, be realized in a silicon-based double-gate complementary metal oxide semiconductor (CMOS) transistor. A single-shot 2DEG cooler can reduce the electron temperature by a factor of 2 with a hold time up to a second, achieved by expanding the electron gas into an additional sub-band. Integrating an array of such coolers - using, e.g., CMOS fabrication techniques - to obtain continuous cooldown may allow reaching down to microkelvin device temperatures.
Original language | English |
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Article number | L161404 |
Journal | Physical Review B |
Volume | 111 |
Issue number | 16 |
DOIs | |
Publication status | Published - 14 Apr 2025 |
MoE publication type | A1 Journal article-refereed |
Funding
This research is supported by the U.K. EPSRC (EP/W015730/1), the European Union's Horizon 2020 research and innovation program (European Microkelvin Platform 824109 and EFINED 766853) and EIC Transition program (SoCool 101113086), by the Academy of Finland through the Centre of Excellence program (Projects No. 336817 and No. 312294), and by Business Finland through QuTI project (40562/31/2020) and Technology Industries of Finland Centennial Foundation.
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Dive into the research topics of 'On-chip quantum confinement refrigeration overcoming electron-phonon heat leaks'. Together they form a unique fingerprint.Projects
- 1 Active
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SoCool: Solid-State Cooling Technology for Cryogenic Devices
Loreto, R. (Manager), Prunnila, M. (PI), Ronzani, A. (Participant), Viisanen, K. (Participant), Hätinen, J. (Participant), Mykkänen, E. (Participant), Rantanen, T. (Participant) & Kanniainen, T. (Participant)
1/06/23 → 31/05/26
Project: EU project