Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits

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    Abstract

    This paper gives an overview of the 3 μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150 mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs and small-to-medium volume manufacturing.
    Original languageEnglish
    Article number8678404
    Number of pages9
    JournalIEEE Journal on Selected Topics in Quantum Electronics
    Volume25
    Issue number5
    Early online date1 Apr 2019
    DOIs
    Publication statusPublished - 1 Sep 2019
    MoE publication typeA1 Journal article-refereed

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    Keywords

    • silicon photonics
    • silicon-on-insulator
    • gratings
    • strips
    • ribs
    • waveguide gratings
    • silicon
    • mirrors
    • integrated optics

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