Projects per year
Abstract
Original language | English |
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Article number | 8678404 |
Number of pages | 9 |
Journal | IEEE Journal of Selected Topics in Quantum Electronics |
Volume | 25 |
Issue number | 5 |
DOIs | |
Publication status | Published - 1 Sept 2019 |
MoE publication type | A1 Journal article-refereed |
Funding
Abstract\u2014This paper gives an overview of the 3-\u00B5m silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (\u223C0.1 dB/cm), ultradense integration (\u00B5m-scale bends), small polarization dependency (down-to-zero birefringence), and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150-mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs, and small-to-medium volume manufacturing.
Keywords
- silicon photonics
- silicon-on-insulator
- gratings
- strips
- ribs
- waveguide gratings
- silicon
- mirrors
- integrated optics
- OtaNano
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- 1 Finished
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Photonic technologies for progrAmmable transmission and switching modular systems based on Scalable Spectrum/space aggregation for future agIle high capacity metrO Networks
Delrosso, G. (Manager), Bhat, S. (Participant) & Aalto, T. (Owner)
1/12/17 → 31/05/21
Project: EU project