Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits

Timo Aalto; Matteo Cherchi; Mikko Harjanne; Srivathsa Bhat; Paivi Heimala; Fei Sun; Markku Kapulainen; Tomi Hassinen; Tapani Vehmas

doi:10.1109/JSTQE.2019.2908551

Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits

Timo Aalto, Matteo Cherchi, Mikko Harjanne, Srivathsa Bhat, Paivi Heimala, Fei Sun, Markku Kapulainen, Tomi Hassinen, Tapani Vehmas

Research output: Contribution to journal › Article

1 Citation (Scopus)

Abstract

This paper gives an overview of the 3 μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150 mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs and small-to-medium volume manufacturing.

Original language	English
Article number	8678404
Number of pages	9
Journal	IEEE Journal on Selected Topics in Quantum Electronics
Volume	25
Issue number	5
Early online date	1 Apr 2019
DOIs	https://doi.org/10.1109/JSTQE.2019.2908551
Publication status	Published - 1 Sep 2019
MoE publication type	A1 Journal article-refereed

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Keywords

silicon photonics
silicon-on-insulator
gratings
strips
ribs
waveguide gratings
silicon
mirrors
integrated optics

Cite this

Aalto, T., Cherchi, M., Harjanne, M., Bhat, S., Heimala, P., Sun, F., Kapulainen, M., Hassinen, T., & Vehmas, T. (2019). Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits. IEEE Journal on Selected Topics in Quantum Electronics, 25(5), [8678404]. https://doi.org/10.1109/JSTQE.2019.2908551

@article{b1c13e82c6de4176b838af550f645067,

title = "Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits",

abstract = "This paper gives an overview of the 3 μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150 mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs and small-to-medium volume manufacturing.",

keywords = "silicon photonics, silicon-on-insulator, gratings, strips, ribs, waveguide gratings, silicon, mirrors, integrated optics",

author = "Timo Aalto and Matteo Cherchi and Mikko Harjanne and Srivathsa Bhat and Paivi Heimala and Fei Sun and Markku Kapulainen and Tomi Hassinen and Tapani Vehmas",

note = "Project 118851",

year = "2019",

month = sep

day = "1",

doi = "10.1109/JSTQE.2019.2908551",

language = "English",

volume = "25",

journal = "IEEE Journal on Selected Topics in Quantum Electronics",

issn = "1077-260X",

publisher = "IEEE Institute of Electrical and Electronic Engineers ",

number = "5",

}

Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits. / Aalto, Timo ; Cherchi, Matteo ; Harjanne, Mikko ; Bhat, Srivathsa ; Heimala, Paivi ; Sun, Fei ; Kapulainen, Markku ; Hassinen, Tomi ; Vehmas, Tapani.

In: IEEE Journal on Selected Topics in Quantum Electronics, Vol. 25, No. 5, 8678404, 01.09.2019.

Research output: Contribution to journal › Article

TY - JOUR

T1 - Open-access 3 μm SOI waveguide platform for dense photonic integrated circuits

AU - Aalto, Timo

AU - Cherchi, Matteo

AU - Harjanne, Mikko

AU - Bhat, Srivathsa

AU - Heimala, Paivi

AU - Sun, Fei

AU - Kapulainen, Markku

AU - Hassinen, Tomi

AU - Vehmas, Tapani

N1 - Project 118851

PY - 2019/9/1

Y1 - 2019/9/1

N2 - This paper gives an overview of the 3 μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150 mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs and small-to-medium volume manufacturing.

AB - This paper gives an overview of the 3 μm silicon-on-insulator (SOI) platform that is openly available from VTT and suitable for the realization of photonic integrated circuits (PICs) for near and mid-infrared applications. Specific benefits of this thick-SOI PIC platform include low optical losses (~0.1 dB/cm), ultra-dense integration (μm-scale bends), small polarization dependency (down-to-zero birefringence) and ability to tolerate relatively high optical powers (>1 W). Fabrication technology is based on an i-line stepper and 150 mm wafer size. Open access to the waveguide platform is supported by design kits, wafer-level testing, multi-project wafer runs, dedicated R&D runs and small-to-medium volume manufacturing.

KW - silicon photonics

KW - silicon-on-insulator

KW - gratings

KW - strips

KW - ribs

KW - waveguide gratings

KW - silicon

KW - mirrors

KW - integrated optics

UR - http://www.scopus.com/inward/record.url?scp=85068130869&partnerID=8YFLogxK

U2 - 10.1109/JSTQE.2019.2908551

DO - 10.1109/JSTQE.2019.2908551

M3 - Article

VL - 25

JO - IEEE Journal on Selected Topics in Quantum Electronics

JF - IEEE Journal on Selected Topics in Quantum Electronics

SN - 1077-260X

IS - 5

M1 - 8678404

ER -

Access to Document

10.1109/JSTQE.2019.2908551

Link to publication in Scopus