Optical and thermal simulation chain for LED package

Olli Tapaninen; Petri Myöhänen; Mikko Majanen; Aila Sitomaniemi; Juuso Olkkonen; Volker Hildenbrand; Alexander W. J. Gielen; Fidel Valega Mackenzie; Marco Barink; Vít Šmilauer; Bořek Patzák

doi:10.1109/EuroSimE.2016.7463349

Optical and thermal simulation chain for LED package

Olli Tapaninen, Petri Myöhänen, Mikko Majanen, Aila Sitomaniemi, Juuso Olkkonen, Volker Hildenbrand, Alexander W. J. Gielen, Fidel Valega Mackenzie, Marco Barink, Vít Šmilauer, Bořek Patzák

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

9 Citations (Scopus)

Abstract

This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

Original language	English
Title of host publication	Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on
Publisher	IEEE Institute of Electrical and Electronic Engineers
Pages	1-6
ISBN (Electronic)	978-1-5090-2106-2, 978-1-5090-2120-8
DOIs	https://doi.org/10.1109/EuroSimE.2016.7463349
Publication status	Published - 5 May 2016
MoE publication type	A4 Article in a conference publication
Event	17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, France Duration: 18 Apr 2016 → 20 Apr 2016

Conference

Conference	17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Abbreviated title	EuroSimE 2016
Country/Territory	France
City	Montpellier
Period	18/04/16 → 20/04/16

Keywords

computer programming
microelectronics
microsystems
open source software
open systems

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10.1109/EuroSimE.2016.7463349

Cite this

Tapaninen, O., Myöhänen, P., Majanen, M., Sitomaniemi, A., Olkkonen, J., Hildenbrand, V., Gielen, A. W. J., Mackenzie, F. V., Barink, M., Šmilauer, V., & Patzák, B. (2016). Optical and thermal simulation chain for LED package. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on (pp. 1-6). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/EuroSimE.2016.7463349

@inproceedings{df37576cad87479fb0fcc5109d07b85c,

title = "Optical and thermal simulation chain for LED package",

abstract = "This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.",

keywords = "computer programming, microelectronics, microsystems, open source software, open systems",

author = "Olli Tapaninen and Petri My{\"o}h{\"a}nen and Mikko Majanen and Aila Sitomaniemi and Juuso Olkkonen and Volker Hildenbrand and Gielen, {Alexander W. J.} and Mackenzie, {Fidel Valega} and Marco Barink and V{\'i}t {\v S}milauer and Bo{\v r}ek Patz{\'a}k",

year = "2016",

month = may,

day = "5",

doi = "10.1109/EuroSimE.2016.7463349",

language = "English",

pages = "1--6",

booktitle = "Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on",

publisher = "IEEE Institute of Electrical and Electronic Engineers",

address = "United States",

note = "17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016, EuroSimE 2016 ; Conference date: 18-04-2016 Through 20-04-2016",

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Tapaninen, O, Myöhänen, P, Majanen, M , Sitomaniemi, A, Olkkonen, J, Hildenbrand, V, Gielen, AWJ, Mackenzie, FV, Barink, M, Šmilauer, V & Patzák, B 2016, Optical and thermal simulation chain for LED package. in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. IEEE Institute of Electrical and Electronic Engineers, pp. 1-6, 17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016, Montpellier, France, 18/04/16. https://doi.org/10.1109/EuroSimE.2016.7463349

Optical and thermal simulation chain for LED package. / Tapaninen, Olli; Myöhänen, Petri; Majanen, Mikko et al.
Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. IEEE Institute of Electrical and Electronic Engineers, 2016. p. 1-6.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Optical and thermal simulation chain for LED package

AU - Tapaninen, Olli

AU - Myöhänen, Petri

AU - Majanen, Mikko

AU - Sitomaniemi, Aila

AU - Olkkonen, Juuso

AU - Hildenbrand, Volker

AU - Gielen, Alexander W. J.

AU - Mackenzie, Fidel Valega

AU - Barink, Marco

AU - Šmilauer, Vít

AU - Patzák, Bořek

PY - 2016/5/5

Y1 - 2016/5/5

N2 - This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

AB - This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

KW - computer programming

KW - microelectronics

KW - microsystems

KW - open source software

KW - open systems

U2 - 10.1109/EuroSimE.2016.7463349

DO - 10.1109/EuroSimE.2016.7463349

M3 - Conference article in proceedings

SP - 1

EP - 6

BT - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on

PB - IEEE Institute of Electrical and Electronic Engineers

T2 - 17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016

Y2 - 18 April 2016 through 20 April 2016

ER -

Tapaninen O, Myöhänen P, Majanen M , Sitomaniemi A, Olkkonen J, Hildenbrand V et al. Optical and thermal simulation chain for LED package. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. IEEE Institute of Electrical and Electronic Engineers. 2016. p. 1-6 doi: 10.1109/EuroSimE.2016.7463349

Optical and thermal simulation chain for LED package

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