Optical and thermal simulation chain for LED package

Olli Tapaninen, Petri Myöhänen, Mikko Majanen, Aila Sitomaniemi, Juuso Olkkonen, Volker Hildenbrand, Alexander W. J. Gielen, Fidel Valega Mackenzie, Marco Barink, Vít Šmilauer, Bořek Patzák

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

8 Citations (Scopus)

Abstract

This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.
Original languageEnglish
Title of host publicationThermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on
PublisherIEEE Institute of Electrical and Electronic Engineers
Pages1-6
ISBN (Electronic)978-1-5090-2106-2, 978-1-5090-2120-8
DOIs
Publication statusPublished - 5 May 2016
MoE publication typeA4 Article in a conference publication
Event17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, France
Duration: 18 Apr 201620 Apr 2016

Conference

Conference17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Abbreviated titleEuroSimE 2016
CountryFrance
CityMontpellier
Period18/04/1620/04/16

Keywords

  • computer programming
  • microelectronics
  • microsystems
  • open source software
  • open systems

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  • Cite this

    Tapaninen, O., Myöhänen, P., Majanen, M., Sitomaniemi, A., Olkkonen, J., Hildenbrand, V., Gielen, A. W. J., Mackenzie, F. V., Barink, M., Šmilauer, V., & Patzák, B. (2016). Optical and thermal simulation chain for LED package. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on (pp. 1-6). IEEE Institute of Electrical and Electronic Engineers. https://doi.org/10.1109/EuroSimE.2016.7463349