Optical and thermal simulation chain for LED package

Olli Tapaninen, Petri Myöhänen, Mikko Majanen, Aila Sitomaniemi, Juuso Olkkonen, Volker Hildenbrand, Alexander W. J. Gielen, Fidel Valega Mackenzie, Marco Barink, Vít Šmilauer, Bořek Patzák

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

6 Citations (Scopus)

Abstract

This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.
Original languageEnglish
Title of host publicationThermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on
PublisherInstitute of Electrical and Electronic Engineers IEEE
Pages1-6
ISBN (Electronic)978-1-5090-2106-2, 978-1-5090-2120-8
DOIs
Publication statusPublished - 5 May 2016
MoE publication typeA4 Article in a conference publication
Event17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016 - Montpellier, France
Duration: 18 Apr 201620 Apr 2016

Conference

Conference17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016
Abbreviated titleEuroSimE 2016
CountryFrance
CityMontpellier
Period18/04/1620/04/16

Fingerprint

thermal simulation
light emitting diodes
tracers
rays
simulation
computer programs
calculators
programming languages
glues
Mie scattering
platforms
physics
scattering

Keywords

  • computer programming
  • microelectronics
  • microsystems
  • open source software
  • open systems

Cite this

Tapaninen, O., Myöhänen, P., Majanen, M., Sitomaniemi, A., Olkkonen, J., Hildenbrand, V., ... Patzák, B. (2016). Optical and thermal simulation chain for LED package. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on (pp. 1-6). Institute of Electrical and Electronic Engineers IEEE. https://doi.org/10.1109/EuroSimE.2016.7463349
Tapaninen, Olli ; Myöhänen, Petri ; Majanen, Mikko ; Sitomaniemi, Aila ; Olkkonen, Juuso ; Hildenbrand, Volker ; Gielen, Alexander W. J. ; Mackenzie, Fidel Valega ; Barink, Marco ; Šmilauer, Vít ; Patzák, Bořek. / Optical and thermal simulation chain for LED package. Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. Institute of Electrical and Electronic Engineers IEEE, 2016. pp. 1-6
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abstract = "This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3{\%} consistent with the measurements.",
keywords = "computer programming, microelectronics, microsystems, open source software, open systems",
author = "Olli Tapaninen and Petri My{\"o}h{\"a}nen and Mikko Majanen and Aila Sitomaniemi and Juuso Olkkonen and Volker Hildenbrand and Gielen, {Alexander W. J.} and Mackenzie, {Fidel Valega} and Marco Barink and V{\'i}t Šmilauer and Bořek Patz{\'a}k",
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doi = "10.1109/EuroSimE.2016.7463349",
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Tapaninen, O, Myöhänen, P, Majanen, M, Sitomaniemi, A, Olkkonen, J, Hildenbrand, V, Gielen, AWJ, Mackenzie, FV, Barink, M, Šmilauer, V & Patzák, B 2016, Optical and thermal simulation chain for LED package. in Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. Institute of Electrical and Electronic Engineers IEEE, pp. 1-6, 17th International Conference on Thermal Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems, EuroSimE 2016, Montpellier, France, 18/04/16. https://doi.org/10.1109/EuroSimE.2016.7463349

Optical and thermal simulation chain for LED package. / Tapaninen, Olli; Myöhänen, Petri; Majanen, Mikko; Sitomaniemi, Aila; Olkkonen, Juuso; Hildenbrand, Volker; Gielen, Alexander W. J.; Mackenzie, Fidel Valega; Barink, Marco; Šmilauer, Vít; Patzák, Bořek.

Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. Institute of Electrical and Electronic Engineers IEEE, 2016. p. 1-6.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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T1 - Optical and thermal simulation chain for LED package

AU - Tapaninen, Olli

AU - Myöhänen, Petri

AU - Majanen, Mikko

AU - Sitomaniemi, Aila

AU - Olkkonen, Juuso

AU - Hildenbrand, Volker

AU - Gielen, Alexander W. J.

AU - Mackenzie, Fidel Valega

AU - Barink, Marco

AU - Šmilauer, Vít

AU - Patzák, Bořek

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N2 - This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

AB - This paper presents a test case for coupling two physical aspects of an LED, optical and thermal, using specific simulation models coupled through an open source platform for distributed multi-physics modelling. The glue code for coupling is written with Python programming language including routines to interface specific simulation models. This approach can also be used for any other software. The main optical simulations are performed with an open source ray tracer software and the main thermal simulations are performed with Comsol Multiphysics. We show how to connect a Mie theory based scattering calculator with the ray tracer. Simulation results are compared to measured samples. The total radiant power emitted by the modelled LED is shown to be up to 3% consistent with the measurements.

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KW - microelectronics

KW - microsystems

KW - open source software

KW - open systems

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DO - 10.1109/EuroSimE.2016.7463349

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BT - Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on

PB - Institute of Electrical and Electronic Engineers IEEE

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Tapaninen O, Myöhänen P, Majanen M, Sitomaniemi A, Olkkonen J, Hildenbrand V et al. Optical and thermal simulation chain for LED package. In Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE), 2016 17th International Conference on. Institute of Electrical and Electronic Engineers IEEE. 2016. p. 1-6 https://doi.org/10.1109/EuroSimE.2016.7463349