| Original language | English |
|---|---|
| Title of host publication | 16th European Microelectronics and Packaging Conference and Exhibition 2007 |
| Subtitle of host publication | EMPC 2007 |
| Publisher | Curran Associates Inc. |
| Pages | 258-261 |
| ISBN (Print) | 978-1-62276-466-2 |
| Publication status | Published - 2007 |
| MoE publication type | A4 Article in a conference publication |
| Event | 16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 Conference number: 16 |
Conference
| Conference | 16th European Microelectronics and Packaging Conference and Exhibition |
|---|---|
| Abbreviated title | EMPC 2007 |
| Country | Finland |
| City | Oulu |
| Period | 17/06/07 → 20/06/07 |
Cite this
}
Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. / Alajoki, Teemu; Hendrickx, Nina; Van Erps, Jurgen; Obi, Samuel; Park, Sang-Hyun; Karppinen, Mikko; Thienpont, Hugo; Van Daele, Peter; Karioja, Pentti.
16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., 2007. p. 258-261.Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board
AU - Alajoki, Teemu
AU - Hendrickx, Nina
AU - Van Erps, Jurgen
AU - Obi, Samuel
AU - Park, Sang-Hyun
AU - Karppinen, Mikko
AU - Thienpont, Hugo
AU - Van Daele, Peter
AU - Karioja, Pentti
PY - 2007
Y1 - 2007
M3 - Conference article in proceedings
SN - 978-1-62276-466-2
SP - 258
EP - 261
BT - 16th European Microelectronics and Packaging Conference and Exhibition 2007
PB - Curran Associates Inc.
ER -