Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board

Teemu Alajoki, Nina Hendrickx, Jurgen Van Erps, Samuel Obi, Sang-Hyun Park, Mikko Karppinen, Hugo Thienpont, Peter Van Daele, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publication16th European Microelectronics and Packaging Conference and Exhibition 2007
Subtitle of host publicationEMPC 2007
PublisherCurran Associates Inc.
Pages258-261
ISBN (Print)978-1-62276-466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007
Conference number: 16

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated titleEMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Alajoki, T., Hendrickx, N., Van Erps, J., Obi, S., Park, S-H., Karppinen, M., ... Karioja, P. (2007). Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. In 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007 (pp. 258-261). Curran Associates Inc..
Alajoki, Teemu ; Hendrickx, Nina ; Van Erps, Jurgen ; Obi, Samuel ; Park, Sang-Hyun ; Karppinen, Mikko ; Thienpont, Hugo ; Van Daele, Peter ; Karioja, Pentti. / Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., 2007. pp. 258-261
@inproceedings{5a914ae85050457b923de2decb434804,
title = "Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board",
author = "Teemu Alajoki and Nina Hendrickx and {Van Erps}, Jurgen and Samuel Obi and Sang-Hyun Park and Mikko Karppinen and Hugo Thienpont and {Van Daele}, Peter and Pentti Karioja",
year = "2007",
language = "English",
isbn = "978-1-62276-466-2",
pages = "258--261",
booktitle = "16th European Microelectronics and Packaging Conference and Exhibition 2007",
publisher = "Curran Associates Inc.",
address = "United States",

}

Alajoki, T, Hendrickx, N, Van Erps, J, Obi, S, Park, S-H, Karppinen, M, Thienpont, H, Van Daele, P & Karioja, P 2007, Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. in 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., pp. 258-261, 16th European Microelectronics and Packaging Conference and Exhibition, Oulu, Finland, 17/06/07.

Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. / Alajoki, Teemu; Hendrickx, Nina; Van Erps, Jurgen; Obi, Samuel; Park, Sang-Hyun; Karppinen, Mikko; Thienpont, Hugo; Van Daele, Peter; Karioja, Pentti.

16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., 2007. p. 258-261.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board

AU - Alajoki, Teemu

AU - Hendrickx, Nina

AU - Van Erps, Jurgen

AU - Obi, Samuel

AU - Park, Sang-Hyun

AU - Karppinen, Mikko

AU - Thienpont, Hugo

AU - Van Daele, Peter

AU - Karioja, Pentti

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 978-1-62276-466-2

SP - 258

EP - 261

BT - 16th European Microelectronics and Packaging Conference and Exhibition 2007

PB - Curran Associates Inc.

ER -

Alajoki T, Hendrickx N, Van Erps J, Obi S, Park S-H, Karppinen M et al. Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. In 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc. 2007. p. 258-261