Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board

Teemu Alajoki, Nina Hendrickx, Jurgen Van Erps, Samuel Obi, Sang-Hyun Park, Mikko Karppinen, Hugo Thienpont, Peter Van Daele, Pentti Karioja

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

2 Citations (Scopus)
Original languageEnglish
Title of host publication16th European Microelectronics and Packaging Conference and Exhibition 2007
Subtitle of host publicationEMPC 2007
PublisherCurran Associates Inc.
Pages258-261
ISBN (Print)978-1-62276-466-2
Publication statusPublished - 2007
MoE publication typeA4 Article in a conference publication
Event16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland
Duration: 17 Jun 200720 Jun 2007
Conference number: 16

Conference

Conference16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated titleEMPC 2007
CountryFinland
CityOulu
Period17/06/0720/06/07

Cite this

Alajoki, T., Hendrickx, N., Van Erps, J., Obi, S., Park, S-H., Karppinen, M., Thienpont, H., Van Daele, P., & Karioja, P. (2007). Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. In 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007 (pp. 258-261). Curran Associates Inc..