Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board

Teemu Alajoki; Nina Hendrickx; Jurgen Van Erps; Samuel Obi; Sang-Hyun Park; Mikko Karppinen; Hugo Thienpont; Peter Van Daele; Pentti Karioja

Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board

Teemu Alajoki, Nina Hendrickx, Jurgen Van Erps, Samuel Obi, Sang-Hyun Park, Mikko Karppinen, Hugo Thienpont, Peter Van Daele, Pentti Karioja

BA1406 Flexible electronics integration

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

2 Citations (Scopus)

Original language	English
Title of host publication	16th European Microelectronics and Packaging Conference and Exhibition 2007
Subtitle of host publication	EMPC 2007
Publisher	Curran Associates Inc.
Pages	258-261
ISBN (Print)	978-1-62276-466-2
Publication status	Published - 2007
MoE publication type	A4 Article in a conference publication
Event	16th European Microelectronics and Packaging Conference and Exhibition - Oulu, Finland Duration: 17 Jun 2007 → 20 Jun 2007 Conference number: 16

Conference

Conference	16th European Microelectronics and Packaging Conference and Exhibition
Abbreviated title	EMPC 2007
Country	Finland
City	Oulu
Period	17/06/07 → 20/06/07

Cite this

Alajoki, Teemu ; Hendrickx, Nina ; Van Erps, Jurgen ; Obi, Samuel ; Park, Sang-Hyun ; Karppinen, Mikko ; Thienpont, Hugo ; Van Daele, Peter ; Karioja, Pentti. / Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., 2007. pp. 258-261

@inproceedings{5a914ae85050457b923de2decb434804,

title = "Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board",

author = "Teemu Alajoki and Nina Hendrickx and {Van Erps}, Jurgen and Samuel Obi and Sang-Hyun Park and Mikko Karppinen and Hugo Thienpont and {Van Daele}, Peter and Pentti Karioja",

year = "2007",

language = "English",

isbn = "978-1-62276-466-2",

pages = "258--261",

booktitle = "16th European Microelectronics and Packaging Conference and Exhibition 2007",

publisher = "Curran Associates Inc.",

address = "United States",

note = "16th European Microelectronics and Packaging Conference and Exhibition, EMPC 2007 ; Conference date: 17-06-2007 Through 20-06-2007",

}

Alajoki, T, Hendrickx, N, Van Erps, J, Obi, S, Park, S-H, Karppinen, M, Thienpont, H, Van Daele, P & Karioja, P 2007, Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. in 16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., pp. 258-261, 16th European Microelectronics and Packaging Conference and Exhibition, Oulu, Finland, 17/06/07.

Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board. / Alajoki, Teemu; Hendrickx, Nina; Van Erps, Jurgen; Obi, Samuel; Park, Sang-Hyun; Karppinen, Mikko; Thienpont, Hugo; Van Daele, Peter; Karioja, Pentti.

16th European Microelectronics and Packaging Conference and Exhibition 2007 : EMPC 2007. Curran Associates Inc., 2007. p. 258-261.

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

TY - GEN

T1 - Optical coupling and optoelectronics integration studied on demonstrator for optical interconnects on board

AU - Alajoki, Teemu

AU - Hendrickx, Nina

AU - Van Erps, Jurgen

AU - Obi, Samuel

AU - Park, Sang-Hyun

AU - Karppinen, Mikko

AU - Thienpont, Hugo

AU - Van Daele, Peter

AU - Karioja, Pentti

N1 - Conference code: 16

PY - 2007

Y1 - 2007

M3 - Conference article in proceedings

SN - 978-1-62276-466-2

SP - 258

EP - 261

BT - 16th European Microelectronics and Packaging Conference and Exhibition 2007

PB - Curran Associates Inc.

T2 - 16th European Microelectronics and Packaging Conference and Exhibition

Y2 - 17 June 2007 through 20 June 2007

ER -