Abstract
The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.
Original language | English |
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Title of host publication | Photonic Instrumentation Engineering IX |
Editors | Lynda E. Busse, Yakov Soskind, Patrick C. Mock |
Publisher | International Society for Optics and Photonics SPIE |
Number of pages | 8 |
ISBN (Electronic) | 9781510648876 |
DOIs | |
Publication status | Published - 2022 |
MoE publication type | A4 Article in a conference publication |
Event | Photonic Instrumentation Engineering IX: Online - Virtual, San Francisco, United States Duration: 20 Feb 2022 → 24 Feb 2022 |
Publication series
Series | Proceedings of SPIE |
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Volume | 12008 |
ISSN | 0277-786X |
Conference
Conference | Photonic Instrumentation Engineering IX |
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Country/Territory | United States |
City | San Francisco |
Period | 20/02/22 → 24/02/22 |
Funding
The authors wish to thank Mr. Ali Bider for carrying out part of the laboratory work and Ms. Zahra Ghaderi for helping with figure graphics and finalizing the text.
Keywords
- ALD
- Conformal
- High Aspect Ratio
- LHAR