@inproceedings{d73708472eec4a068789c357d57596e2,
title = "Optical metrology of 3D thin film conformality by LHAR chip assisted method",
abstract = "The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level. ",
keywords = "ALD, Conformal, High Aspect Ratio, LHAR",
author = "Mikko Utriainen and Kimmo Saastamoinen and Heikki Rekola and Ylivaara, {Oili M.E.} and Puurunen, {Riikka L.} and Pasi Hyttinen",
note = "Funding Information: The authors wish to thank Mr. Ali Bider for carrying out part of the laboratory work and Ms. Zahra Ghaderi for helping with figure graphics and finalizing the text. Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; Photonic Instrumentation Engineering IX : Online ; Conference date: 20-02-2022 Through 24-02-2022",
year = "2022",
doi = "10.1117/12.2609643",
language = "English",
series = "Proceedings of SPIE - The International Society for Optical Engineering",
publisher = "International Society for Optics and Photonics SPIE",
editor = "Busse, {Lynda E.} and Yakov Soskind and Mock, {Patrick C.}",
booktitle = "Photonic Instrumentation Engineering IX",
address = "United States",
}