The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.
|Series||Proceedings of SPIE - The International Society for Optical Engineering|
|Conference||Photonic Instrumentation Engineering IX|
|Period||20/02/22 → 24/02/22|
- High Aspect Ratio