Optical metrology of 3D thin film conformality by LHAR chip assisted method

Mikko Utriainen, Kimmo Saastamoinen, Heikki Rekola, Oili M.E. Ylivaara, Riikka L. Puurunen, Pasi Hyttinen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

5 Citations (Scopus)


The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.
Original languageEnglish
Title of host publicationPhotonic Instrumentation Engineering IX
EditorsLynda E. Busse, Yakov Soskind, Patrick C. Mock
PublisherInternational Society for Optics and Photonics SPIE
Number of pages8
ISBN (Electronic)9781510648876
Publication statusPublished - 2022
MoE publication typeA4 Article in a conference publication
EventPhotonic Instrumentation Engineering IX: Online - Virtual, San Francisco, United States
Duration: 20 Feb 202224 Feb 2022

Publication series

SeriesProceedings of SPIE - The International Society for Optical Engineering


ConferencePhotonic Instrumentation Engineering IX
Country/TerritoryUnited States
CitySan Francisco


  • ALD
  • Conformal
  • High Aspect Ratio
  • LHAR


Dive into the research topics of 'Optical metrology of 3D thin film conformality by LHAR chip assisted method'. Together they form a unique fingerprint.

Cite this