Optical metrology of 3D thin film conformality by LHAR chip assisted method

Mikko Utriainen; Kimmo Saastamoinen; Heikki Rekola; Oili M.E. Ylivaara; Riikka L. Puurunen; Pasi Hyttinen

doi:10.1117/12.2609643

Optical metrology of 3D thin film conformality by LHAR chip assisted method

Mikko Utriainen, Kimmo Saastamoinen, Heikki Rekola, Oili M.E. Ylivaara, Riikka L. Puurunen, Pasi Hyttinen

BA6201 RF microsystems

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

7 Citations (Scopus)

Abstract

The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.

Original language	English
Title of host publication	Photonic Instrumentation Engineering IX
Editors	Lynda E. Busse, Yakov Soskind, Patrick C. Mock
Publisher	International Society for Optics and Photonics SPIE
Number of pages	8
ISBN (Electronic)	9781510648876
DOIs	https://doi.org/10.1117/12.2609643
Publication status	Published - 2022
MoE publication type	A4 Article in a conference publication
Event	Photonic Instrumentation Engineering IX: Online - Virtual, San Francisco, United States Duration: 20 Feb 2022 → 24 Feb 2022

Publication series

Series	Proceedings of SPIE
Volume	12008
ISSN	0277-786X

Conference

Conference	Photonic Instrumentation Engineering IX
Country/Territory	United States
City	San Francisco
Period	20/02/22 → 24/02/22

Funding

The authors wish to thank Mr. Ali Bider for carrying out part of the laboratory work and Ms. Zahra Ghaderi for helping with figure graphics and finalizing the text.

Keywords

ALD
Conformal
High Aspect Ratio
LHAR

Access to Document

10.1117/12.2609643

Cite this

Utriainen, M., Saastamoinen, K., Rekola, H., Ylivaara, O. M. E., Puurunen, R. L., & Hyttinen, P. (2022). Optical metrology of 3D thin film conformality by LHAR chip assisted method. In L. E. Busse, Y. Soskind, & P. C. Mock (Eds.), Photonic Instrumentation Engineering IX Article 120080D International Society for Optics and Photonics SPIE. https://doi.org/10.1117/12.2609643

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title = "Optical metrology of 3D thin film conformality by LHAR chip assisted method",

abstract = "The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level. ",

keywords = "ALD, Conformal, High Aspect Ratio, LHAR",

author = "Mikko Utriainen and Kimmo Saastamoinen and Heikki Rekola and Ylivaara, {Oili M.E.} and Puurunen, {Riikka L.} and Pasi Hyttinen",

note = "Funding Information: The authors wish to thank Mr. Ali Bider for carrying out part of the laboratory work and Ms. Zahra Ghaderi for helping with figure graphics and finalizing the text. Publisher Copyright: {\textcopyright} COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.; Photonic Instrumentation Engineering IX : Online ; Conference date: 20-02-2022 Through 24-02-2022",

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publisher = "International Society for Optics and Photonics SPIE",

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Utriainen, M, Saastamoinen, K, Rekola, H, Ylivaara, OME, Puurunen, RL & Hyttinen, P 2022, Optical metrology of 3D thin film conformality by LHAR chip assisted method. in LE Busse, Y Soskind & PC Mock (eds), Photonic Instrumentation Engineering IX., 120080D, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 12008, Photonic Instrumentation Engineering IX, San Francisco, California, United States, 20/02/22. https://doi.org/10.1117/12.2609643

Optical metrology of 3D thin film conformality by LHAR chip assisted method. / Utriainen, Mikko; Saastamoinen, Kimmo; Rekola, Heikki et al.
Photonic Instrumentation Engineering IX. ed. / Lynda E. Busse; Yakov Soskind; Patrick C. Mock. International Society for Optics and Photonics SPIE, 2022. 120080D (Proceedings of SPIE, Vol. 12008).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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AU - Puurunen, Riikka L.

AU - Hyttinen, Pasi

N1 - Funding Information: The authors wish to thank Mr. Ali Bider for carrying out part of the laboratory work and Ms. Zahra Ghaderi for helping with figure graphics and finalizing the text. Publisher Copyright: © COPYRIGHT SPIE. Downloading of the abstract is permitted for personal use only.

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N2 - The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.

AB - The paper presents a novel and fast method to characterize thin film conformality on microscopic 3D High Aspect Ratio substrates. The thin film deposition experiment uses specially designed PillarHall(TM) Lateral High Aspect Ratio (LHAR) silicon chip as a substrate. The measurement on a chip relies on the conventional planar surface characterization tools such as optical microscopy, line-scan reflectometry and ellipsometry. The results show that the method is fast and accurate way to characterize thin film conformality as well as other film properties, and also in wafer-level.

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Optical metrology of 3D thin film conformality by LHAR chip assisted method

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