Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

Michael Vervaeke, Markku Lahti, Mikko Karppinen, Christof Debaes, Bart Volckaerts, Pentti Karioja, Hugo Thienpont

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)
    Original languageEnglish
    Title of host publicationMicro-Optics, VCSELs, and Photonic Interconnects II
    Subtitle of host publicationFabrication, Packaging, and Integration
    PublisherInternational Society for Optics and Photonics SPIE
    Pages201-213
    DOIs
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication
    EventMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration - Strasbourg, France
    Duration: 3 Apr 20065 Apr 2006

    Publication series

    SeriesProceedings of SPIE
    Volume6185

    Conference

    ConferenceMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
    CountryFrance
    CityStrasbourg
    Period3/04/065/04/06

    Cite this

    Vervaeke, M., Lahti, M., Karppinen, M., Debaes, C., Volckaerts, B., Karioja, P., & Thienpont, H. (2006). Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration (pp. 201-213). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 6185 https://doi.org/10.1117/12.662812