Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

Michael Vervaeke; Markku Lahti; Mikko Karppinen; Christof Debaes; Bart Volckaerts; Pentti Karioja; Hugo Thienpont

doi:10.1117/12.662812

Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

Michael Vervaeke, Markku Lahti, Mikko Karppinen, Christof Debaes, Bart Volckaerts, Pentti Karioja, Hugo Thienpont

Vrije Universiteit Brussel

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

4 Citations (Scopus)

Original language	English
Title of host publication	Micro-Optics, VCSELs, and Photonic Interconnects II
Subtitle of host publication	Fabrication, Packaging, and Integration
Publisher	International Society for Optics and Photonics SPIE
Pages	201-213
DOIs	https://doi.org/10.1117/12.662812
Publication status	Published - 2006
MoE publication type	A4 Article in a conference publication
Event	Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration - Strasbourg, France Duration: 3 Apr 2006 → 5 Apr 2006

Publication series

Series	Proceedings of SPIE
Volume	6185

Conference

Conference	Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
Country/Territory	France
City	Strasbourg
Period	3/04/06 → 5/04/06

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

Access to Document

10.1117/12.662812

Cite this

Vervaeke, M., Lahti, M., Karppinen, M., Debaes, C., Volckaerts, B., Karioja, P., & Thienpont, H. (2006). Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration (pp. 201-213). International Society for Optics and Photonics SPIE. https://doi.org/10.1117/12.662812

Vervaeke, Michael ; Lahti, Markku ; Karppinen, Mikko et al. / Packaging a free-space intra-chip optical interconnect module : Monte Carlo tolerance study and assembly results. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. pp. 201-213 (Proceedings of SPIE, Vol. 6185).

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title = "Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results",

author = "Michael Vervaeke and Markku Lahti and Mikko Karppinen and Christof Debaes and Bart Volckaerts and Pentti Karioja and Hugo Thienpont",

year = "2006",

doi = "10.1117/12.662812",

language = "English",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "201--213",

booktitle = "Micro-Optics, VCSELs, and Photonic Interconnects II",

address = "United States",

note = "Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration ; Conference date: 03-04-2006 Through 05-04-2006",

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Vervaeke, M, Lahti, M , Karppinen, M, Debaes, C, Volckaerts, B, Karioja, P & Thienpont, H 2006, Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. in Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 6185, pp. 201-213, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, Strasbourg, France, 3/04/06. https://doi.org/10.1117/12.662812

Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. / Vervaeke, Michael; Lahti, Markku ; Karppinen, Mikko et al.
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. p. 201-213 (Proceedings of SPIE, Vol. 6185).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review

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T2 - Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration

AU - Vervaeke, Michael

AU - Lahti, Markku

AU - Karppinen, Mikko

AU - Debaes, Christof

AU - Volckaerts, Bart

AU - Karioja, Pentti

AU - Thienpont, Hugo

PY - 2006

Y1 - 2006

U2 - 10.1117/12.662812

DO - 10.1117/12.662812

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

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EP - 213

BT - Micro-Optics, VCSELs, and Photonic Interconnects II

PB - International Society for Optics and Photonics SPIE

Y2 - 3 April 2006 through 5 April 2006

ER -

Vervaeke M, Lahti M , Karppinen M, Debaes C, Volckaerts B, Karioja P et al. Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE. 2006. p. 201-213. (Proceedings of SPIE, Vol. 6185). doi: 10.1117/12.662812