@inproceedings{c38940f592f64fd48101e8d0dea7cc17,
title = "Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results",
author = "Michael Vervaeke and Markku Lahti and Mikko Karppinen and Christof Debaes and Bart Volckaerts and Pentti Karioja and Hugo Thienpont",
year = "2006",
doi = "10.1117/12.662812",
language = "English",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
pages = "201--213",
booktitle = "Micro-Optics, VCSELs, and Photonic Interconnects II",
address = "United States",
note = "Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration ; Conference date: 03-04-2006 Through 05-04-2006",
}