Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

Michael Vervaeke, Markku Lahti, Mikko Karppinen, Christof Debaes, Bart Volckaerts, Pentti Karioja, Hugo Thienpont

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    4 Citations (Scopus)
    Original languageEnglish
    Title of host publicationMicro-Optics, VCSELs, and Photonic Interconnects II
    Subtitle of host publicationFabrication, Packaging, and Integration
    PublisherInternational Society for Optics and Photonics SPIE
    Pages201-213
    DOIs
    Publication statusPublished - 2006
    MoE publication typeA4 Article in a conference publication
    EventMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration - Strasbourg, France
    Duration: 3 Apr 20065 Apr 2006

    Publication series

    SeriesProceedings of SPIE
    Volume6185

    Conference

    ConferenceMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
    CountryFrance
    CityStrasbourg
    Period3/04/065/04/06

    Cite this

    Vervaeke, M., Lahti, M., Karppinen, M., Debaes, C., Volckaerts, B., Karioja, P., & Thienpont, H. (2006). Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration (pp. 201-213). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 6185 https://doi.org/10.1117/12.662812
    Vervaeke, Michael ; Lahti, Markku ; Karppinen, Mikko ; Debaes, Christof ; Volckaerts, Bart ; Karioja, Pentti ; Thienpont, Hugo. / Packaging a free-space intra-chip optical interconnect module : Monte Carlo tolerance study and assembly results. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. pp. 201-213 (Proceedings of SPIE, Vol. 6185).
    @inproceedings{c38940f592f64fd48101e8d0dea7cc17,
    title = "Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results",
    author = "Michael Vervaeke and Markku Lahti and Mikko Karppinen and Christof Debaes and Bart Volckaerts and Pentti Karioja and Hugo Thienpont",
    year = "2006",
    doi = "10.1117/12.662812",
    language = "English",
    series = "Proceedings of SPIE",
    publisher = "International Society for Optics and Photonics SPIE",
    pages = "201--213",
    booktitle = "Micro-Optics, VCSELs, and Photonic Interconnects II",
    address = "United States",

    }

    Vervaeke, M, Lahti, M, Karppinen, M, Debaes, C, Volckaerts, B, Karioja, P & Thienpont, H 2006, Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. in Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 6185, pp. 201-213, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, Strasbourg, France, 3/04/06. https://doi.org/10.1117/12.662812

    Packaging a free-space intra-chip optical interconnect module : Monte Carlo tolerance study and assembly results. / Vervaeke, Michael; Lahti, Markku; Karppinen, Mikko; Debaes, Christof; Volckaerts, Bart; Karioja, Pentti; Thienpont, Hugo.

    Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. p. 201-213 (Proceedings of SPIE, Vol. 6185).

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

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    T1 - Packaging a free-space intra-chip optical interconnect module

    T2 - Monte Carlo tolerance study and assembly results

    AU - Vervaeke, Michael

    AU - Lahti, Markku

    AU - Karppinen, Mikko

    AU - Debaes, Christof

    AU - Volckaerts, Bart

    AU - Karioja, Pentti

    AU - Thienpont, Hugo

    PY - 2006

    Y1 - 2006

    U2 - 10.1117/12.662812

    DO - 10.1117/12.662812

    M3 - Conference article in proceedings

    T3 - Proceedings of SPIE

    SP - 201

    EP - 213

    BT - Micro-Optics, VCSELs, and Photonic Interconnects II

    PB - International Society for Optics and Photonics SPIE

    ER -

    Vervaeke M, Lahti M, Karppinen M, Debaes C, Volckaerts B, Karioja P et al. Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE. 2006. p. 201-213. (Proceedings of SPIE, Vol. 6185). https://doi.org/10.1117/12.662812