Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results

Michael Vervaeke, Markku Lahti, Mikko Karppinen, Christof Debaes, Bart Volckaerts, Pentti Karioja, Hugo Thienpont

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

4 Citations (Scopus)
Original languageEnglish
Title of host publicationMicro-Optics, VCSELs, and Photonic Interconnects II
Subtitle of host publicationFabrication, Packaging, and Integration
PublisherInternational Society for Optics and Photonics SPIE
Pages201-213
DOIs
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
EventMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration - Strasbourg, France
Duration: 3 Apr 20065 Apr 2006

Publication series

SeriesProceedings of SPIE
Volume6185

Conference

ConferenceMicro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration
CountryFrance
CityStrasbourg
Period3/04/065/04/06

Cite this

Vervaeke, M., Lahti, M., Karppinen, M., Debaes, C., Volckaerts, B., Karioja, P., & Thienpont, H. (2006). Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration (pp. 201-213). International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 6185 https://doi.org/10.1117/12.662812
Vervaeke, Michael ; Lahti, Markku ; Karppinen, Mikko ; Debaes, Christof ; Volckaerts, Bart ; Karioja, Pentti ; Thienpont, Hugo. / Packaging a free-space intra-chip optical interconnect module : Monte Carlo tolerance study and assembly results. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. pp. 201-213 (Proceedings of SPIE, Vol. 6185).
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title = "Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results",
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Vervaeke, M, Lahti, M, Karppinen, M, Debaes, C, Volckaerts, B, Karioja, P & Thienpont, H 2006, Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. in Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 6185, pp. 201-213, Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration, Strasbourg, France, 3/04/06. https://doi.org/10.1117/12.662812

Packaging a free-space intra-chip optical interconnect module : Monte Carlo tolerance study and assembly results. / Vervaeke, Michael; Lahti, Markku; Karppinen, Mikko; Debaes, Christof; Volckaerts, Bart; Karioja, Pentti; Thienpont, Hugo.

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. p. 201-213 (Proceedings of SPIE, Vol. 6185).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Packaging a free-space intra-chip optical interconnect module

T2 - Monte Carlo tolerance study and assembly results

AU - Vervaeke, Michael

AU - Lahti, Markku

AU - Karppinen, Mikko

AU - Debaes, Christof

AU - Volckaerts, Bart

AU - Karioja, Pentti

AU - Thienpont, Hugo

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DO - 10.1117/12.662812

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

SP - 201

EP - 213

BT - Micro-Optics, VCSELs, and Photonic Interconnects II

PB - International Society for Optics and Photonics SPIE

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Vervaeke M, Lahti M, Karppinen M, Debaes C, Volckaerts B, Karioja P et al. Packaging a free-space intra-chip optical interconnect module: Monte Carlo tolerance study and assembly results. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE. 2006. p. 201-213. (Proceedings of SPIE, Vol. 6185). https://doi.org/10.1117/12.662812