Packaging considerations of fiber optic laser sources

Veli Heikkinen, Kari Tukkiniemi, Jouko Vähäkangas, Tapio Hannula

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    40 Citations (Scopus)


    The continuous progress in material and component technology has generated new laser-based applications that require special packaging techniques. Hybrid integration offers a flexible method to accomplish custom design needs. This paper discusses several aspects in fiber optic packaging including optical, thermal, and mechanical issues. Special emphasis is on optical coupling between a laser diode and a single-mode fiber.
    Original languageEnglish
    Title of host publicationOptomechanics and Dimensional Stability
    EditorsRoger A. Paquin, Daniel Vukobratovich
    PublisherInternational Society for Optics and Photonics SPIE
    ISBN (Print)978-0-8194-0661-3
    Publication statusPublished - 1991
    MoE publication typeA4 Article in a conference publication
    EventOptomechanics and Dimensional Stability: San Diego '91 - San Diego, United States
    Duration: 21 Jul 199126 Jul 1991

    Publication series

    SeriesProceedings of SPIE


    ConferenceOptomechanics and Dimensional Stability
    Abbreviated titleSan Diego '91
    CountryUnited States
    CitySan Diego

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