Packaging of microelectromechanical system devices

Jae-Wung Lee

Packaging of microelectromechanical system devices

Jae-Wung Lee (Inventor)

BA6215 Photonics and superconductive electronics

Research output: Patent › Patent

Abstract

According to an example aspect of the present invention, there is provided a package for a Microelectromechanical System, MEMS, device comprising a cap layer and the MEMS device below the cap layer, at least two electrodes on a surface of the MEMS device to enable electrical functioning of the MEMS device, wherein each electrode is located on a horizontal plane and comprises metal to enable formation of an air-path, the air-path between the cap layer and the MEMS device to enable releasing of the MEMS device, at least a part of the air-path being on the same horizontal plane wherein the at least two electrodes are located and a side access port connected to the air-path to enable releasing of the MEMS device, wherein the side access port goes through the cap layer.

Patent family as of 17.7.2026
EP4412946 A1, FI131471 B, FI20216035 A, US2024391762 AA, WO23057685 A1

Original language	English
Patent number	FI131471 B1
IPC	B81B7/00
Priority date	6/10/21
Filing date	6/10/21
Publication status	Published - 9 May 2025
MoE publication type	H1 Granted patent

Cite this

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title = "Packaging of microelectromechanical system devices",

abstract = "According to an example aspect of the present invention, there is provided a package for a Microelectromechanical System, MEMS, device comprising a cap layer and the MEMS device below the cap layer, at least two electrodes on a surface of the MEMS device to enable electrical functioning of the MEMS device, wherein each electrode is located on a horizontal plane and comprises metal to enable formation of an air-path, the air-path between the cap layer and the MEMS device to enable releasing of the MEMS device, at least a part of the air-path being on the same horizontal plane wherein the at least two electrodes are located and a side access port connected to the air-path to enable releasing of the MEMS device, wherein the side access port goes through the cap layer. Patent family as of 17.7.2026 EP4412946 A1, FI131471 B, FI20216035 A, US2024391762 AA, WO23057685 A1",

author = "Jae-Wung Lee",

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N2 - According to an example aspect of the present invention, there is provided a package for a Microelectromechanical System, MEMS, device comprising a cap layer and the MEMS device below the cap layer, at least two electrodes on a surface of the MEMS device to enable electrical functioning of the MEMS device, wherein each electrode is located on a horizontal plane and comprises metal to enable formation of an air-path, the air-path between the cap layer and the MEMS device to enable releasing of the MEMS device, at least a part of the air-path being on the same horizontal plane wherein the at least two electrodes are located and a side access port connected to the air-path to enable releasing of the MEMS device, wherein the side access port goes through the cap layer. Patent family as of 17.7.2026 EP4412946 A1, FI131471 B, FI20216035 A, US2024391762 AA, WO23057685 A1

AB - According to an example aspect of the present invention, there is provided a package for a Microelectromechanical System, MEMS, device comprising a cap layer and the MEMS device below the cap layer, at least two electrodes on a surface of the MEMS device to enable electrical functioning of the MEMS device, wherein each electrode is located on a horizontal plane and comprises metal to enable formation of an air-path, the air-path between the cap layer and the MEMS device to enable releasing of the MEMS device, at least a part of the air-path being on the same horizontal plane wherein the at least two electrodes are located and a side access port connected to the air-path to enable releasing of the MEMS device, wherein the side access port goes through the cap layer. Patent family as of 17.7.2026 EP4412946 A1, FI131471 B, FI20216035 A, US2024391762 AA, WO23057685 A1

UR - https://fi.espacenet.com/publicationDetails/biblio?II=0&ND=3&adjacent=true&locale=fi_FI&FT=D&date=20241128&CC=US&NR=2024391762A1&KC=A1

M3 - Patent

M1 - FI131471 B1

Y2 - 2021/10/06

ER -

Packaging of microelectromechanical system devices

Abstract

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