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Packaging of microelectromechanical system devices
Jae-Wung Lee
(Inventor)
BA7502 Photonics and superconducting electronics
Research output
:
Patent
›
Patent
Overview
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Dive into the research topics of 'Packaging of microelectromechanical system devices'. Together they form a unique fingerprint.
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INIS
devices
100%
packaging
100%
microelectromechanical systems
100%
layers
50%
air
50%
electrodes
37%
ports
25%
surfaces
12%
patents
12%
metals
12%
inventions
12%
Keyphrases
Micro-electro-mechanical Systems
100%
MEMS Devices
100%
Airway
66%
Capping Layer
66%
Horizontal Plane
33%
Two-electrode
33%
Access Port
33%
Patent Family
16%
Microelectromechanical System (MEMS) Devices
16%
Engineering
Microelectromechanical System
100%
Air Path
44%
Cap Layer
44%
Horizontal Plane
22%
Patent Family
11%