Abstract
Photonic Integrated Circuits (PIC) technology is experiencing strong growth. PICs are advantageous by integrating a lot of photonics functionality on chip-scale and by enabling mass production using wafer processes. PICs are already produced in many foundries. However, the market growth is hindered by the limited packaging competences and capacities. Also packaging costs are relatively high, although PICs can reduce packaging cost per optical functionality and enable standardization of the interfaces. Main challenges in PIC packaging are presented as well as recently developed solutions applied mainly for VTT-made 3-μm Silicon-on-Insulator PICs.
Original language | English |
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Title of host publication | 2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2023) |
Publisher | IEEE Institute of Electrical and Electronic Engineers |
Number of pages | 2 |
ISBN (Electronic) | 978-91-89821-06-4 |
ISBN (Print) | 979-8-3503-2842-4 |
Publication status | Published - 2023 |
MoE publication type | Not Eligible |
Event | IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2023 - Oslo, Norway Duration: 12 Jun 2023 → 14 Jun 2023 |
Conference
Conference | IMAPS Nordic Conference on Microelectronics Packaging, NordPac 2023 |
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Country/Territory | Norway |
City | Oslo |
Period | 12/06/23 → 14/06/23 |
Keywords
- photonics packaging
- photonic integrated circuit
- silicon photonics
- fiber optics
- hybrid integration