Packaging of Photonic Integrated Circuits: Extended Abstract

Research output: Chapter in Book/Report/Conference proceedingConference abstract in proceedingsScientific


Photonic Integrated Circuits (PIC) technology is experiencing strong growth. PICs are advantageous by integrating a lot of photonics functionality on chip-scale and by enabling mass production using wafer processes. PICs are already produced in many foundries. However, the market growth is hindered by the limited packaging competences and capacities. Also packaging costs are relatively high, although PICs can reduce packaging cost per optical functionality and enable standardization of the interfaces. Main challenges in PIC packaging are presented as well as recently developed solutions applied mainly for VTT-made 3-μm Silicon-on-Insulator PICs.
Original languageEnglish
Title of host publication2023 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2023)
PublisherIEEE Institute of Electrical and Electronic Engineers
Number of pages2
ISBN (Electronic)978-91-89821-06-4
ISBN (Print)979-8-3503-2842-4
Publication statusPublished - 2023
MoE publication typeNot Eligible
EventIMAPS Nordic Conference on Microelectronics Packaging, NordPac 2023 - Oslo, Norway
Duration: 12 Jun 202314 Jun 2023


ConferenceIMAPS Nordic Conference on Microelectronics Packaging, NordPac 2023


  • photonics packaging
  • photonic integrated circuit
  • silicon photonics
  • fiber optics
  • hybrid integration


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