Packaging of RF MEMS switches in LTCC

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationProceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference
Pages167-170
Publication statusPublished - 2008
MoE publication typeB3 Non-refereed article in conference proceedings
EventCeramic Interconnects and Ceramic Microsystems Technologies Conference - Munich, Germany
Duration: 21 Apr 200824 Apr 2008

Conference

ConferenceCeramic Interconnects and Ceramic Microsystems Technologies Conference
CountryGermany
CityMunich
Period21/04/0824/04/08

Cite this

Lahti, M., Lenkkeri, J., Kautio, K., Lahdes, M., & Vähä-Heikkilä, T. (2008). Packaging of RF MEMS switches in LTCC. In Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference (pp. 167-170)
Lahti, Markku ; Lenkkeri, Jaakko ; Kautio, Kari ; Lahdes, Manu ; Vähä-Heikkilä, Tauno. / Packaging of RF MEMS switches in LTCC. Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference. 2008. pp. 167-170
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title = "Packaging of RF MEMS switches in LTCC",
author = "Markku Lahti and Jaakko Lenkkeri and Kari Kautio and Manu Lahdes and Tauno V{\"a}h{\"a}-Heikkil{\"a}",
year = "2008",
language = "English",
pages = "167--170",
booktitle = "Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference",

}

Lahti, M, Lenkkeri, J, Kautio, K, Lahdes, M & Vähä-Heikkilä, T 2008, Packaging of RF MEMS switches in LTCC. in Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference. pp. 167-170, Ceramic Interconnects and Ceramic Microsystems Technologies Conference, Munich, Germany, 21/04/08.

Packaging of RF MEMS switches in LTCC. / Lahti, Markku; Lenkkeri, Jaakko; Kautio, Kari; Lahdes, Manu; Vähä-Heikkilä, Tauno.

Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference. 2008. p. 167-170.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

TY - GEN

T1 - Packaging of RF MEMS switches in LTCC

AU - Lahti, Markku

AU - Lenkkeri, Jaakko

AU - Kautio, Kari

AU - Lahdes, Manu

AU - Vähä-Heikkilä, Tauno

PY - 2008

Y1 - 2008

M3 - Conference article in proceedings

SP - 167

EP - 170

BT - Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference

ER -

Lahti M, Lenkkeri J, Kautio K, Lahdes M, Vähä-Heikkilä T. Packaging of RF MEMS switches in LTCC. In Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference. 2008. p. 167-170