Packaging of RF MEMS switches in LTCC

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

Original languageEnglish
Title of host publicationProceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference
Pages167-170
Publication statusPublished - 2008
MoE publication typeB3 Non-refereed article in conference proceedings
EventCeramic Interconnects and Ceramic Microsystems Technologies Conference - Munich, Germany
Duration: 21 Apr 200824 Apr 2008

Conference

ConferenceCeramic Interconnects and Ceramic Microsystems Technologies Conference
CountryGermany
CityMunich
Period21/04/0824/04/08

Cite this

Lahti, M., Lenkkeri, J., Kautio, K., Lahdes, M., & Vähä-Heikkilä, T. (2008). Packaging of RF MEMS switches in LTCC. In Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference (pp. 167-170)