Packaging of RF MEMS switches in LTCC

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationProceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference
    Pages167-170
    Publication statusPublished - 2008
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventCeramic Interconnects and Ceramic Microsystems Technologies Conference - Munich, Germany
    Duration: 21 Apr 200824 Apr 2008

    Conference

    ConferenceCeramic Interconnects and Ceramic Microsystems Technologies Conference
    Country/TerritoryGermany
    CityMunich
    Period21/04/0824/04/08

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