Packaging of RF MEMS switches in LTCC

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference
Pages	167-170
Publication status	Published - 2008
MoE publication type	B3 Non-refereed article in conference proceedings
Event	Ceramic Interconnects and Ceramic Microsystems Technologies Conference - Munich, Germany Duration: 21 Apr 2008 → 24 Apr 2008

Conference	Ceramic Interconnects and Ceramic Microsystems Technologies Conference
Country/Territory	Germany
City	Munich
Period	21/04/08 → 24/04/08

UN SDGs

This output contributes to the following UN Sustainable Development Goals (SDGs)

@inproceedings{d5de72f4b3164b9680fe98b410e8c31a,

title = "Packaging of RF MEMS switches in LTCC",

author = "Markku Lahti and Jaakko Lenkkeri and Kari Kautio and Manu Lahdes and Tauno V{\"a}h{\"a}-Heikkil{\"a}",

year = "2008",

language = "English",

pages = "167--170",

booktitle = "Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference",

note = "Ceramic Interconnects and Ceramic Microsystems Technologies Conference ; Conference date: 21-04-2008 Through 24-04-2008",

}

TY - GEN

T1 - Packaging of RF MEMS switches in LTCC

AU - Lahti, Markku

AU - Lenkkeri, Jaakko

AU - Kautio, Kari

AU - Lahdes, Manu

AU - Vähä-Heikkilä, Tauno

PY - 2008

Y1 - 2008

M3 - Conference article in proceedings

SP - 167

EP - 170

BT - Proceedings of the Ceramic Interconnects and Ceramic Microsystems Technologies Conference

T2 - Ceramic Interconnects and Ceramic Microsystems Technologies Conference

Y2 - 21 April 2008 through 24 April 2008

ER -