Paineanturi;Tryckgivare

Teuvo Sillanpää; Hannu Sipola; Heikki Seppä; Niklas Doktar

Paineanturi;Tryckgivare

Translated title of the contribution: Pressure sensor

Teuvo Sillanpää (Inventor), Hannu Sipola (Inventor), Heikki Seppä (Inventor), Niklas Doktar (Inventor)

Wärtsilä Oyj Abp

Research output: Patent › Patent

Abstract

The present invention concerns a pressure senso r(1) comprising an ultrasound transmitter (2), and a cavity (3) arranged in connection with this, which is in resonance mode at an ultrasound frequency used, and wherein the sensor (1) comprises a bending membrane (5), located at the opposite end of the cavity (3) to the ultrasound transmitter (2), and the ultrasound transmitter (2) comprises a diaphragm oscillator configured to operate either at a resonance frequency of a diaphragm or below, which oscillator is connected to the surrounding medium,and the sensor (1) contains means for measuring the interaction between the ultrasound transmitter (2) and the cavity (3), and a thermal insulation circuit board (4) is arranged between the ultrasound transmitter (2) and a readout circuit board (7), wherein the thermal insulation circuit board (4) is configured to cause a negative temperature flow gradient in a direction from the ultrasound transmitter (2) to the readout circuit board (7).

Patent family as of 17.12.2021
FI125492 B 20151030 FI20140005723 20140815
FI20145723 A 20151030 FI20140005723 20140815
WO16024041 A1 20160218 WO2015FI50508 20150721

Link to current patent family on right

Translated title of the contribution	Pressure sensor
Original language	Undefined
Patent number	FI20145723
IPC	G12B 7/ 00 A N
Priority date	15/08/14
Publication status	Published - 30 Oct 2015
MoE publication type	H1 Granted patent

Cite this

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abstract = "The present invention concerns a pressure senso r(1) comprising an ultrasound transmitter (2), and a cavity (3) arranged in connection with this, which is in resonance mode at an ultrasound frequency used, and wherein the sensor (1) comprises a bending membrane (5), located at the opposite end of the cavity (3) to the ultrasound transmitter (2), and the ultrasound transmitter (2) comprises a diaphragm oscillator configured to operate either at a resonance frequency of a diaphragm or below, which oscillator is connected to the surrounding medium,and the sensor (1) contains means for measuring the interaction between the ultrasound transmitter (2) and the cavity (3), and a thermal insulation circuit board (4) is arranged between the ultrasound transmitter (2) and a readout circuit board (7), wherein the thermal insulation circuit board (4) is configured to cause a negative temperature flow gradient in a direction from the ultrasound transmitter (2) to the readout circuit board (7).Patent family as of 17.12.2021FI125492 B 20151030 FI20140005723 20140815 FI20145723 A 20151030 FI20140005723 20140815 WO16024041 A1 20160218 WO2015FI50508 20150721Link to current patent family on right ",

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TY - PAT

T1 - Paineanturi;Tryckgivare

AU - Sillanpää, Teuvo

AU - Sipola, Hannu

AU - Seppä, Heikki

AU - Doktar, Niklas

PY - 2015/10/30

Y1 - 2015/10/30

N2 - The present invention concerns a pressure senso r(1) comprising an ultrasound transmitter (2), and a cavity (3) arranged in connection with this, which is in resonance mode at an ultrasound frequency used, and wherein the sensor (1) comprises a bending membrane (5), located at the opposite end of the cavity (3) to the ultrasound transmitter (2), and the ultrasound transmitter (2) comprises a diaphragm oscillator configured to operate either at a resonance frequency of a diaphragm or below, which oscillator is connected to the surrounding medium,and the sensor (1) contains means for measuring the interaction between the ultrasound transmitter (2) and the cavity (3), and a thermal insulation circuit board (4) is arranged between the ultrasound transmitter (2) and a readout circuit board (7), wherein the thermal insulation circuit board (4) is configured to cause a negative temperature flow gradient in a direction from the ultrasound transmitter (2) to the readout circuit board (7).Patent family as of 17.12.2021FI125492 B 20151030 FI20140005723 20140815 FI20145723 A 20151030 FI20140005723 20140815 WO16024041 A1 20160218 WO2015FI50508 20150721Link to current patent family on right

AB - The present invention concerns a pressure senso r(1) comprising an ultrasound transmitter (2), and a cavity (3) arranged in connection with this, which is in resonance mode at an ultrasound frequency used, and wherein the sensor (1) comprises a bending membrane (5), located at the opposite end of the cavity (3) to the ultrasound transmitter (2), and the ultrasound transmitter (2) comprises a diaphragm oscillator configured to operate either at a resonance frequency of a diaphragm or below, which oscillator is connected to the surrounding medium,and the sensor (1) contains means for measuring the interaction between the ultrasound transmitter (2) and the cavity (3), and a thermal insulation circuit board (4) is arranged between the ultrasound transmitter (2) and a readout circuit board (7), wherein the thermal insulation circuit board (4) is configured to cause a negative temperature flow gradient in a direction from the ultrasound transmitter (2) to the readout circuit board (7).Patent family as of 17.12.2021FI125492 B 20151030 FI20140005723 20140815 FI20145723 A 20151030 FI20140005723 20140815 WO16024041 A1 20160218 WO2015FI50508 20150721Link to current patent family on right

UR - https://worldwide.espacenet.com/patent/search/family/053762203/publication/FI125492B?q=FI125492

M3 - Patent

M1 - FI20145723

ER -

Paineanturi;Tryckgivare

Abstract

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