Translated title of the contribution: Pressure sensor

Teuvo Sillanpää (Inventor), Hannu Sipola (Inventor), Heikki Seppä (Inventor), Niklas Doktar (Inventor)

Research output: PatentPatent


The present invention concerns a pressure senso r(1) comprising an ultrasound transmitter (2), and a cavity (3) arranged in connection with this, which is in resonance mode at an ultrasound frequency used, and wherein the sensor (1) comprises a bending membrane (5), located at the opposite end of the cavity (3) to the ultrasound transmitter (2), and the ultrasound transmitter (2) comprises a diaphragm oscillator configured to operate either at a resonance frequency of a diaphragm or below, which oscillator is connected to the surrounding medium,and the sensor (1) contains means for measuring the interaction between the ultrasound transmitter (2) and the cavity (3), and a thermal insulation circuit board (4) is arranged between the ultrasound transmitter (2) and a readout circuit board (7), wherein the thermal insulation circuit board (4) is configured to cause a negative temperature flow gradient in a direction from the ultrasound transmitter (2) to the readout circuit board (7).

Patent family as of 17.12.2021
FI125492 B 20151030 FI20140005723 20140815      
FI20145723 A 20151030 FI20140005723 20140815      
WO16024041 A1 20160218 WO2015FI50508 20150721

Link to current patent family on right 

Translated title of the contributionPressure sensor
Original languageUndefined
Patent numberFI20145723
IPCG12B 7/ 00 A N
Priority date15/08/14
Publication statusPublished - 30 Oct 2015
MoE publication typeH1 Granted patent


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