Parallel Optical Interconnect between Ceramic BGA Packages on FR4 Board using Embedded Waveguides and Passive Optical Alignments

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

36 Citations (Scopus)
Original languageEnglish
Title of host publication56th Electronic Components and Technology Conference 2006
Pages799-805
DOIs
Publication statusPublished - 2006
MoE publication typeA4 Article in a conference publication
Event56th Electronic Components and Technology Conference Conference, ECTC - San Diego, United States
Duration: 30 May 20062 Jun 2006
Conference number: 56

Publication series

Name
ISSN (Print)0569-5503
ISSN (Electronic)2377-5726

Conference

Conference56th Electronic Components and Technology Conference Conference, ECTC
Abbreviated titleECTC
CountryUnited States
CitySan Diego
Period30/05/062/06/06

Keywords

  • optical interconnections
  • optical transmitters
  • surface-mount technology
  • optical arrays
  • optical coupling

Cite this

@inproceedings{3ce39e9b2db7423ab7e400990f0ede5d,
title = "Parallel Optical Interconnect between Ceramic BGA Packages on FR4 Board using Embedded Waveguides and Passive Optical Alignments",
keywords = "optical interconnections, optical transmitters, surface-mount technology, optical arrays, optical coupling",
author = "Mikko Karppinen and Teemu Alajoki and Antti Tanskanen and Kari Kataja and Jukka-Tapani Makinen and Kari Kautio and Pentti Karioja and Marika Immonen and Jorma Kivilahti",
year = "2006",
doi = "10.1109/ECTC.2006.1645749",
language = "English",
isbn = "1-4244-0152-6",
pages = "799--805",
booktitle = "56th Electronic Components and Technology Conference 2006",

}

Karppinen, M, Alajoki, T, Tanskanen, A, Kataja, K, Makinen, J-T, Kautio, K, Karioja, P, Immonen, M & Kivilahti, J 2006, Parallel Optical Interconnect between Ceramic BGA Packages on FR4 Board using Embedded Waveguides and Passive Optical Alignments. in 56th Electronic Components and Technology Conference 2006. pp. 799-805, 56th Electronic Components and Technology Conference Conference, ECTC, San Diego, United States, 30/05/06. https://doi.org/10.1109/ECTC.2006.1645749

Parallel Optical Interconnect between Ceramic BGA Packages on FR4 Board using Embedded Waveguides and Passive Optical Alignments. / Karppinen, Mikko; Alajoki, Teemu; Tanskanen, Antti; Kataja, Kari; Makinen, Jukka-Tapani; Kautio, Kari; Karioja, Pentti; Immonen, Marika; Kivilahti, Jorma.

56th Electronic Components and Technology Conference 2006. 2006. p. 799-805.

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Parallel Optical Interconnect between Ceramic BGA Packages on FR4 Board using Embedded Waveguides and Passive Optical Alignments

AU - Karppinen, Mikko

AU - Alajoki, Teemu

AU - Tanskanen, Antti

AU - Kataja, Kari

AU - Makinen, Jukka-Tapani

AU - Kautio, Kari

AU - Karioja, Pentti

AU - Immonen, Marika

AU - Kivilahti, Jorma

PY - 2006

Y1 - 2006

KW - optical interconnections

KW - optical transmitters

KW - surface-mount technology

KW - optical arrays

KW - optical coupling

U2 - 10.1109/ECTC.2006.1645749

DO - 10.1109/ECTC.2006.1645749

M3 - Conference article in proceedings

SN - 1-4244-0152-6

SP - 799

EP - 805

BT - 56th Electronic Components and Technology Conference 2006

ER -