Abstract
| Original language | English |
|---|---|
| Title of host publication | Micro-Optics, VCSELs, and Photonic Interconnects II |
| Subtitle of host publication | Fabrication, Packaging, and Integration |
| Publisher | International Society for Optics and Photonics SPIE |
| Number of pages | 11 |
| DOIs | |
| Publication status | Published - 2006 |
| MoE publication type | Not Eligible |
| Event | SPIE Photonics Europe, Fabrication, Packaging, and Integration - Strasbourg, France Duration: 3 Apr 2006 → 7 Apr 2006 |
Publication series
| Series | Proceedings of SPIE |
|---|---|
| Volume | 6185 |
Conference
| Conference | SPIE Photonics Europe, Fabrication, Packaging, and Integration |
|---|---|
| Country | France |
| City | Strasbourg |
| Period | 3/04/06 → 7/04/06 |
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Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments. / Karppinen, Mikko; Alajoki, Teemu; Tanskanen, Antti; Kataja, Kari; Mäkinen, Jukka-Tapani; Karioja, Pentti; Immonen, Marika; Kivilahti, Jorma.
Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. 618500 (Proceedings of SPIE, Vol. 6185).Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific › peer-review
TY - GEN
T1 - Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments
AU - Karppinen, Mikko
AU - Alajoki, Teemu
AU - Tanskanen, Antti
AU - Kataja, Kari
AU - Mäkinen, Jukka-Tapani
AU - Karioja, Pentti
AU - Immonen, Marika
AU - Kivilahti, Jorma
PY - 2006
Y1 - 2006
N2 - Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.
AB - Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.
U2 - 10.1117/12.664386
DO - 10.1117/12.664386
M3 - Conference article in proceedings
T3 - Proceedings of SPIE
BT - Micro-Optics, VCSELs, and Photonic Interconnects II
PB - International Society for Optics and Photonics SPIE
ER -