Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments

Mikko Karppinen, Teemu Alajoki, Antti Tanskanen, Kari Kataja, Jukka-Tapani Mäkinen, Pentti Karioja, Marika Immonen, Jorma Kivilahti

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

    7 Citations (Scopus)

    Abstract

    Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.
    Original languageEnglish
    Title of host publicationMicro-Optics, VCSELs, and Photonic Interconnects II
    Subtitle of host publicationFabrication, Packaging, and Integration
    PublisherInternational Society for Optics and Photonics SPIE
    Number of pages11
    DOIs
    Publication statusPublished - 2006
    MoE publication typeNot Eligible
    EventSPIE Photonics Europe, Fabrication, Packaging, and Integration - Strasbourg, France
    Duration: 3 Apr 20067 Apr 2006

    Publication series

    SeriesProceedings of SPIE
    Volume6185

    Conference

    ConferenceSPIE Photonics Europe, Fabrication, Packaging, and Integration
    Country/TerritoryFrance
    CityStrasbourg
    Period3/04/067/04/06

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