Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments

Mikko Karppinen, Teemu Alajoki, Antti Tanskanen, Kari Kataja, Jukka-Tapani Mäkinen, Pentti Karioja, Marika Immonen, Jorma Kivilahti

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

7 Citations (Scopus)

Abstract

Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.
Original languageEnglish
Title of host publicationMicro-Optics, VCSELs, and Photonic Interconnects II
Subtitle of host publicationFabrication, Packaging, and Integration
PublisherInternational Society for Optics and Photonics SPIE
Number of pages11
DOIs
Publication statusPublished - 2006
MoE publication typeNot Eligible
EventSPIE Photonics Europe, Fabrication, Packaging, and Integration - Strasbourg, France
Duration: 3 Apr 20067 Apr 2006

Publication series

SeriesProceedings of SPIE
Volume6185

Conference

ConferenceSPIE Photonics Europe, Fabrication, Packaging, and Integration
CountryFrance
CityStrasbourg
Period3/04/067/04/06

Fingerprint

optical interconnects
wiring
receivers
chips
alignment
waveguides
optical waveguides
transmitters
modules
ceramics
optical coupling
optoelectronic devices
ray tracing
photodiodes
mirrors
polymers

Cite this

Karppinen, M., Alajoki, T., Tanskanen, A., Kataja, K., Mäkinen, J-T., Karioja, P., ... Kivilahti, J. (2006). Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration [618500] International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 6185 https://doi.org/10.1117/12.664386
Karppinen, Mikko ; Alajoki, Teemu ; Tanskanen, Antti ; Kataja, Kari ; Mäkinen, Jukka-Tapani ; Karioja, Pentti ; Immonen, Marika ; Kivilahti, Jorma. / Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments. Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. (Proceedings of SPIE, Vol. 6185).
@inproceedings{2eb8476f3c9b425589a9a237a5d9ea58,
title = "Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments",
abstract = "Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.",
author = "Mikko Karppinen and Teemu Alajoki and Antti Tanskanen and Kari Kataja and Jukka-Tapani M{\"a}kinen and Pentti Karioja and Marika Immonen and Jorma Kivilahti",
year = "2006",
doi = "10.1117/12.664386",
language = "English",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
booktitle = "Micro-Optics, VCSELs, and Photonic Interconnects II",
address = "United States",

}

Karppinen, M, Alajoki, T, Tanskanen, A, Kataja, K, Mäkinen, J-T, Karioja, P, Immonen, M & Kivilahti, J 2006, Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments. in Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration., 618500, International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 6185, SPIE Photonics Europe, Fabrication, Packaging, and Integration, Strasbourg, France, 3/04/06. https://doi.org/10.1117/12.664386

Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments. / Karppinen, Mikko; Alajoki, Teemu; Tanskanen, Antti; Kataja, Kari; Mäkinen, Jukka-Tapani; Karioja, Pentti; Immonen, Marika; Kivilahti, Jorma.

Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE, 2006. 618500 (Proceedings of SPIE, Vol. 6185).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments

AU - Karppinen, Mikko

AU - Alajoki, Teemu

AU - Tanskanen, Antti

AU - Kataja, Kari

AU - Mäkinen, Jukka-Tapani

AU - Karioja, Pentti

AU - Immonen, Marika

AU - Kivilahti, Jorma

PY - 2006

Y1 - 2006

N2 - Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.

AB - Technologies to design and fabricate high-bit-rate chip-to-chip optical interconnects on printed wiring boards (PWB) are studied. The aim is to interconnect surface-mounted component packages or modules using board-embedded optical waveguides. In order to demonstrate the developed technologies, a parallel optical interconnect was integrated on a standard FR4-based PWB. It consists of 4-channel BGA-mounted transmitter and receiver modules as well as of four polymer multimode waveguides fabricated on top of the PWB using lithographic patterning. The transmitters and receivers built on low-temperature co-fired ceramic (LTCC) substrates include flip-chip mounted VCSEL or photodiode array and 4x10 Gb/s driver or receiver IC. Two microlens arrays and a surface-mounted micro-mirror enable optical coupling between the optoelectronic device and the waveguide array. The optical alignment is based on the marks and structures fabricated in both the LTCC and optical waveguide processes. The structures were optimized and studied by the use of optical tolerance analyses based on ray tracing. The characterized optical alignment tolerances are in the limits of the accuracy of the surface-mount technology.

U2 - 10.1117/12.664386

DO - 10.1117/12.664386

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

BT - Micro-Optics, VCSELs, and Photonic Interconnects II

PB - International Society for Optics and Photonics SPIE

ER -

Karppinen M, Alajoki T, Tanskanen A, Kataja K, Mäkinen J-T, Karioja P et al. Parallel optical interconnect between surface-mounted devices on FR4 printed wiring board using embedded waveguides and passive optical alignments. In Micro-Optics, VCSELs, and Photonic Interconnects II: Fabrication, Packaging, and Integration. International Society for Optics and Photonics SPIE. 2006. 618500. (Proceedings of SPIE, Vol. 6185). https://doi.org/10.1117/12.664386