Abstract
A fabrication method for parallel-plate structures and a parallel-plate structure arrangement, wherein the structures have a middle layer, grown on a substrate and disposed between top and bottom electrode layers, wherein the middle layer and the top and bottom electrode layers are deposited on a bottom substrate, and wherein the middle layer is grown first and the top and bottom electrodes are essentially deposited afterwards.
Patent family as of 1.9.2021
FI121722 B 20110315 FI20060000832 20060918
FI20060832 A 20080319 FI20060000832 20060918
FI20060832 A0 20060918 FI20060000832 20060918
US2010067167 AA 20100318 US20070440743 20070914
US8950057 BB 20150210 US20070440743 20070914
WO08034940 A1 20080327 WO2007FI00232 20070914
Link to current patent family on right
| Original language | English |
|---|---|
| Patent number | US2010067167 |
| IPC | H01L 41/ 39 A I |
| Priority date | 14/09/07 |
| Publication status | Published - 18 Mar 2010 |
| MoE publication type | H1 Granted patent |