Passive integration process on standard and high resistivity silicon

Hannu Kattelus; Hannu Ronkainen; Tarja Riihisaari

Passive integration process on standard and high resistivity silicon

Hannu Kattelus, Hannu Ronkainen, Tarja Riihisaari

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

Original language	English
Title of host publication	International Conference on High Density Packaging and MCM's
Publisher	International Society for Optics and Photonics SPIE
Pages	194 - 199
ISBN (Print)	978-0-930815-57-8
Publication status	Published - 1999
MoE publication type	B3 Non-refereed article in conference proceedings
Event	International Conference on High Density Packaging and MCMs - Denver, United States Duration: 6 Apr 1999 → 9 Apr 1999

Publication series

Series	Proceedings of SPIE
Volume	3830
ISSN	0277-786X

Conference

Conference	International Conference on High Density Packaging and MCMs
Country/Territory	United States
City	Denver
Period	6/04/99 → 9/04/99

Cite this

@inproceedings{6478bab5b1fb4eaabe0a4d0cb8806a0f,

title = "Passive integration process on standard and high resistivity silicon",

author = "Hannu Kattelus and Hannu Ronkainen and Tarja Riihisaari",

year = "1999",

language = "English",

isbn = "978-0-930815-57-8",

series = "Proceedings of SPIE",

publisher = "International Society for Optics and Photonics SPIE",

pages = "194 -- 199",

booktitle = "International Conference on High Density Packaging and MCM's",

address = "United States",

note = "International Conference on High Density Packaging and MCMs ; Conference date: 06-04-1999 Through 09-04-1999",

}

Kattelus, H, Ronkainen, H & Riihisaari, T 1999, Passive integration process on standard and high resistivity silicon. in International Conference on High Density Packaging and MCM's . International Society for Optics and Photonics SPIE, Proceedings of SPIE, vol. 3830, pp. 194 - 199, International Conference on High Density Packaging and MCMs, Denver, United States, 6/04/99.

Passive integration process on standard and high resistivity silicon. / Kattelus, Hannu; Ronkainen, Hannu; Riihisaari, Tarja.
International Conference on High Density Packaging and MCM's . International Society for Optics and Photonics SPIE, 1999. p. 194 - 199 (Proceedings of SPIE, Vol. 3830).

Research output: Chapter in Book/Report/Conference proceeding › Conference article in proceedings › Scientific

TY - GEN

T1 - Passive integration process on standard and high resistivity silicon

AU - Kattelus, Hannu

AU - Ronkainen, Hannu

AU - Riihisaari, Tarja

PY - 1999

Y1 - 1999

M3 - Conference article in proceedings

SN - 978-0-930815-57-8

T3 - Proceedings of SPIE

SP - 194

EP - 199

BT - International Conference on High Density Packaging and MCM's

PB - International Society for Optics and Photonics SPIE

T2 - International Conference on High Density Packaging and MCMs

Y2 - 6 April 1999 through 9 April 1999

ER -