Passive integration process on standard and high resistivity silicon

Hannu Kattelus, Hannu Ronkainen, Tarja Riihisaari

    Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientific

    Original languageEnglish
    Title of host publicationInternational Conference on High Density Packaging and MCM's
    PublisherInternational Society for Optics and Photonics SPIE
    Pages194 - 199
    ISBN (Print)978-0-930815-57-8
    Publication statusPublished - 1999
    MoE publication typeB3 Non-refereed article in conference proceedings
    EventInternational Conference on High Density Packaging and MCMs - Denver, United States
    Duration: 6 Apr 19999 Apr 1999

    Publication series

    SeriesProceedings of SPIE
    Volume3830
    ISSN0277-786X

    Conference

    ConferenceInternational Conference on High Density Packaging and MCMs
    CountryUnited States
    CityDenver
    Period6/04/999/04/99

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