Abstract
The resonance frequency of conventional PMUT varies with temperature. This paper discusses a passive method to reduce the temperature coefficient of resonance frequency (TCF) of PMUT. Temperature compensation is achieved by selecting surface areas, layer thickness and materials in such a way that the contribution of thermal expansion coefficient (α) is nullified by the contribution of temperature coefficient of young's modulus TC. Temperature compensated PMUTs are fabricated, and electrical, mechanical characterization is performed, and thermal stability is examined. Measurement results show that PMUTs with a TCF below 65 ppm/K can be developed using this technique.
| Original language | English |
|---|---|
| Title of host publication | IUS 2022 - IEEE International Ultrasonics Symposium |
| Publisher | IEEE Institute of Electrical and Electronic Engineers |
| Number of pages | 4 |
| ISBN (Electronic) | 978-1-6654-6657-8 |
| DOIs | |
| Publication status | Published - 1 Dec 2022 |
| MoE publication type | A4 Article in a conference publication |
| Event | IEEE International Ultrasonics Symposium (IUS) - Venice, Italy Duration: 10 Oct 2022 → 13 Oct 2022 |
Conference
| Conference | IEEE International Ultrasonics Symposium (IUS) |
|---|---|
| Abbreviated title | IEEE IUS |
| Country/Territory | Italy |
| City | Venice |
| Period | 10/10/22 → 13/10/22 |
Funding
This work is part of the of the Beyond SOI project funded by the Business Finland. The authors acknowledge Okmetic Oy for providing wafers for the PMUT fabrication.
Keywords
- Frequency variation
- PMUT
- Temperature compensation
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