TY - GEN
T1 - Passively aligned fiber-optic transmitter integrated into LTCC module
AU - Karppinen, Mikko
AU - Kautio, Kari
AU - Heikkinen, Mikko
AU - Häkkilä, Jonna
AU - Karioja, Pentti
AU - Jouhti, Tomi
AU - Tervonen, Ari
AU - Oksanen, Markku
PY - 2001
Y1 - 2001
N2 - We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.
AB - We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.
M3 - Conference article in proceedings
T3 - Proceedings of SPIE
SP - 293
EP - 302
BT - Micro- and Nano-optics for Optical Interconnection and Information
PB - International Society for Optics and Photonics SPIE
CY - Bellligham, Washington, US
T2 - International Symposium on Optical Science and Technology
Y2 - 29 July 2001 through 31 July 2001
ER -