Passively aligned fiber-optic transmitter integrated into LTCC module

Mikko Karppinen, Kari Kautio, Mikko Heikkinen, Jonna Häkkilä, Pentti Karioja, Tomi Jouhti, Ari Tervonen, Markku Oksanen

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

Abstract

We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.
Original languageEnglish
Title of host publicationMicro- and Nano-optics for Optical Interconnection and Information
Place of PublicationBellligham, Washington, US
PublisherInternational Society for Optics and Photonics SPIE
Pages293-302
Publication statusPublished - 2001
MoE publication typeA4 Article in a conference publication
EventInternational Symposium on Optical Science and Technology - San Diego, United States
Duration: 29 Jul 200131 Jul 2001

Publication series

NameProceedings of SPIE
PublisherSPIE
Volume4455

Conference

ConferenceInternational Symposium on Optical Science and Technology
CountryUnited States
CitySan Diego
Period29/07/0131/07/01

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transmitters
fiber optics
modules
ceramics
fibers
printed circuits
circuit boards
alignment
footprints
mounting
chips
prototypes
tubes
requirements
electronics
lasers
simulation

Cite this

Karppinen, M., Kautio, K., Heikkinen, M., Häkkilä, J., Karioja, P., Jouhti, T., ... Oksanen, M. (2001). Passively aligned fiber-optic transmitter integrated into LTCC module. In Micro- and Nano-optics for Optical Interconnection and Information (pp. 293-302). Bellligham, Washington, US: International Society for Optics and Photonics SPIE. Proceedings of SPIE, Vol.. 4455
Karppinen, Mikko ; Kautio, Kari ; Heikkinen, Mikko ; Häkkilä, Jonna ; Karioja, Pentti ; Jouhti, Tomi ; Tervonen, Ari ; Oksanen, Markku. / Passively aligned fiber-optic transmitter integrated into LTCC module. Micro- and Nano-optics for Optical Interconnection and Information . Bellligham, Washington, US : International Society for Optics and Photonics SPIE, 2001. pp. 293-302 (Proceedings of SPIE, Vol. 4455).
@inproceedings{fd443fda9c5b4873b12538ce70e76874,
title = "Passively aligned fiber-optic transmitter integrated into LTCC module",
abstract = "We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.",
author = "Mikko Karppinen and Kari Kautio and Mikko Heikkinen and Jonna H{\"a}kkil{\"a} and Pentti Karioja and Tomi Jouhti and Ari Tervonen and Markku Oksanen",
year = "2001",
language = "English",
series = "Proceedings of SPIE",
publisher = "International Society for Optics and Photonics SPIE",
pages = "293--302",
booktitle = "Micro- and Nano-optics for Optical Interconnection and Information",
address = "United States",

}

Karppinen, M, Kautio, K, Heikkinen, M, Häkkilä, J, Karioja, P, Jouhti, T, Tervonen, A & Oksanen, M 2001, Passively aligned fiber-optic transmitter integrated into LTCC module. in Micro- and Nano-optics for Optical Interconnection and Information . International Society for Optics and Photonics SPIE, Bellligham, Washington, US, Proceedings of SPIE, vol. 4455, pp. 293-302, International Symposium on Optical Science and Technology, San Diego, United States, 29/07/01.

Passively aligned fiber-optic transmitter integrated into LTCC module. / Karppinen, Mikko; Kautio, Kari; Heikkinen, Mikko; Häkkilä, Jonna; Karioja, Pentti; Jouhti, Tomi; Tervonen, Ari; Oksanen, Markku.

Micro- and Nano-optics for Optical Interconnection and Information . Bellligham, Washington, US : International Society for Optics and Photonics SPIE, 2001. p. 293-302 (Proceedings of SPIE, Vol. 4455).

Research output: Chapter in Book/Report/Conference proceedingConference article in proceedingsScientificpeer-review

TY - GEN

T1 - Passively aligned fiber-optic transmitter integrated into LTCC module

AU - Karppinen, Mikko

AU - Kautio, Kari

AU - Heikkinen, Mikko

AU - Häkkilä, Jonna

AU - Karioja, Pentti

AU - Jouhti, Tomi

AU - Tervonen, Ari

AU - Oksanen, Markku

PY - 2001

Y1 - 2001

N2 - We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.

AB - We studied the possibilities of LTCC (low temperature cofired ceramics) technology to fabricate transmitter arrays equipped with vertical-mounted multimode fiber pigtails. The developed LTCC module can be mounted vertically on a printed-circuit-board (PCB), thus providing small, essentially one-dimensional PCB footprint. The fiber is aligned and supported using a hole structure through the layers, and the surface-emitting source, such as a VCSEL, is flip-chipped on the other side of the substrate. Thus, this kind of module can be used as a detachable electrical interface between the fiber-optic and electronic media. To evaluate the feasibility of the system, a 5-channel transmitter based on a 4-layer LTCC substrate was designed and realized, and mounted vertically on a test board. Each transmitter, sized 5 mm X 5 mm2, included VCSEL and laser-driver chips as well as discrete passives. 62.5/125-micron fibers were used with metallic tubes as strain relieves. Before implementation, the optical alignment tolerances were examined by measurements and simulations, and the tolerances of fiber-mounting holes were evaluated by preparing test structures. The fiber alignment accuracy seemed adequate even for the first transmitter prototypes. Nevertheless, stringent requirements for the LTCC process control are necessary to achieve the needed accuracy.

M3 - Conference article in proceedings

T3 - Proceedings of SPIE

SP - 293

EP - 302

BT - Micro- and Nano-optics for Optical Interconnection and Information

PB - International Society for Optics and Photonics SPIE

CY - Bellligham, Washington, US

ER -

Karppinen M, Kautio K, Heikkinen M, Häkkilä J, Karioja P, Jouhti T et al. Passively aligned fiber-optic transmitter integrated into LTCC module. In Micro- and Nano-optics for Optical Interconnection and Information . Bellligham, Washington, US: International Society for Optics and Photonics SPIE. 2001. p. 293-302. (Proceedings of SPIE, Vol. 4455).