Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Antti Lamminen; Jussi Säily; Juha Ala-Laurinaho; Jesus de Cos; Vladimir Ermolov

doi:10.1109/OJAP.2020.3004533

Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Antti Lamminen (Corresponding Author), Jussi Säily, Juha Ala-Laurinaho, Jesus de Cos, Vladimir Ermolov

Research output: Contribution to journal › Article › Scientific › peer-review

49 Citations (Scopus)

Abstract

This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.

Original language	English
Article number	9123961
Pages (from-to)	396-403
Number of pages	8
Journal	IEEE Open Journal of Antennas and Propagation
Volume	1
Issue number	1
DOIs	https://doi.org/10.1109/OJAP.2020.3004533
Publication status	Published - 17 Aug 2020
MoE publication type	A1 Journal article-refereed

Keywords

D-band
antennas
antenna arrays
mSAP

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10.1109/OJAP.2020.3004533Licence: CC BY

Cite this

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title = "Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band",

abstract = "This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.",

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author = "Antti Lamminen and Jussi S{\"a}ily and Juha Ala-Laurinaho and {de Cos}, Jesus and Vladimir Ermolov",

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AU - Lamminen, Antti

AU - Säily, Jussi

AU - Ala-Laurinaho, Juha

AU - de Cos, Jesus

AU - Ermolov, Vladimir

N1 - Horizon 2020 grant 761390

PY - 2020/8/17

Y1 - 2020/8/17

N2 - This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.

AB - This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.

KW - D-band

KW - antennas

KW - antenna arrays

KW - mSAP

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JO - IEEE Open Journal of Antennas and Propagation

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ER -

Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Abstract

Keywords

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