Patch Antenna and Antenna Array on Multilayer High-Frequency PCB for D-Band

Antti Lamminen (Corresponding Author), Jussi Säily, Juha Ala-Laurinaho, Jesus de Cos, Vladimir Ermolov

    Research output: Contribution to journalArticleScientificpeer-review

    43 Citations (Scopus)

    Abstract

    This paper presents the design, manufacturing, and characterization of a wide-band cavity-backed aperture-coupled patch antenna and a 16-element antenna array on multilayer printed circuit board (PCB) targeted for D-band applications. Microstrip line and grounded coplanar waveguide (GCPW) transmission lines are also designed and tested to investigate line losses at D-band. The test structures are manufactured using printed circuit board technology with semi-additive processing (mSAP) of conductors on a multilayered substrate. The measurement results indicate an insertion loss of 1.9 dB/cm for the microstrip line and 1.8 dB/cm for the coplanar waveguide at 150 GHz. The measured maximum gains for single antenna and 16-element array are respectively 7 dBi and 14 dBi at 143 GHz. The measured antenna input matching bandwidth is 20 GHz. The results show the viability of advanced printed circuit technology for D-band transmission lines, antennas, and antenna arrays.
    Original languageEnglish
    Article number9123961
    Pages (from-to)396-403
    Number of pages8
    JournalIEEE Open Journal of Antennas and Propagation
    Volume1
    Issue number1
    DOIs
    Publication statusPublished - 17 Aug 2020
    MoE publication typeA1 Journal article-refereed

    Keywords

    • D-band
    • antennas
    • antenna arrays
    • mSAP

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